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NTMFS4C05NT1G-001

Onsemi

NTMFS4C05NT1G-001 by Onsemi

NTMFS4C05NT1G-001 by Onsemi is a N-channel FET with 78A max drain current and 33W power dissipation. Ideal for high-power applications, it operates at up to 150 °C. Suitable for surface mount configurations in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,869 parts In-Stock

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Digiode

USA . 2,384 parts In-Stock

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AZTECH Wire

Italy . 279 parts In-Stock

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$15.960

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Component Stockers USA

USA . 337 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 25,879 parts In-Stock

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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SupplyDigital Components

Austria . 8,242 parts In-Stock

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TANS Electronics

Latvia . 7,716 parts In-Stock

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Kulean Microsystems

USA . 6,040 parts In-Stock

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Problanco Electronics

Mexico . 4,543 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,025 parts In-Stock

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Corphita

USA . 1,366 parts In-Stock

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UHIMA Technologies

Türkiye . 352 parts In-Stock

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Corohmni

South Africa . 109 parts In-Stock

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Overview

Discover the NTMFS4C05NT1G-001 by Onsemi, a high-quality N-CHANNEL small signal Field Effect Transistor designed to enhance performance and efficiency in various applications. With a maximum drain current of 78A and a power dissipation of 33W, this transistor offers reliability and durability like no other. Whether you're looking to optimize power management systems or improve circuit designs, this product is your go-to solution. Trust Onsemi's expertise and innovation to deliver superior technology that exceeds expectations. Unlock endless possibilities with the NTMFS4C05NT1G-001.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL transistors typically have better mobility and conductivity compared to P-CHANNEL transistors, making them suitable for high-performance applications.

Configuration: SINGLE

Single configuration simplifies circuit design and integration, making it easier to use in various electronic applications.

Surface Mount: YES

Surface mount technology allows for compact and space-saving designs, making it ideal for smaller electronic devices and applications.

Maximum Drain Current (Abs) (ID): 78 A

High maximum drain current capability allows for handling larger currents without overheating, making it suitable for power applications.

Maximum Power Dissipation (Abs): 33 W

High power dissipation capability ensures reliability and stable performance under heavy load conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers improved efficiency and reliability compared to other transistor technologies.

Maximum Operating Temperature: 150 °C

High maximum operating temperature allows for use in environments where heat may be a concern, ensuring stability and performance in various conditions.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTMFS4C05NT1G-001 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

78 A

Maximum Drain Current (ID):

78 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

NTMFS4C05NT1G-001 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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