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NTMFS4701NT3G

Onsemi

NTMFS4701NT3G by Onsemi

NTMFS4701NT3G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, 7.7A ID, and 0.008 ohm RDS(ON). Ideal for SWITCHING applications due to ENHANCEMENT MODE operation. Features include SINGLE configuration with BUILT-IN DIODE in a SMALL OUTLINE package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Vyrian

USA . 706 parts In-Stock

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Digiode

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Component Stockers USA

USA . 214 parts In-Stock

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Kulean Microsystems

USA . 7,487 parts In-Stock

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Problanco Electronics

Mexico . 3,992 parts In-Stock

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Corphita

USA . 971 parts In-Stock

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TANS Electronics

Latvia . 955 parts In-Stock

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UHIMA Technologies

Türkiye . 873 parts In-Stock

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SupplyDigital Components

Austria . 719 parts In-Stock

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Corohmni

South Africa . 351 parts In-Stock

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Overview

Experience superior performance and reliability with the NTMFS4701NT3G by Onsemi. As a leading manufacturer in the field of Small Signal Field Effect Transistors, Onsemi delivers cutting-edge technology that is perfect for switching applications. With a high drain current capacity of 7.7 A and low drain-source resistance of 0.008 ohm, this N-channel transistor offers unmatched efficiency and durability. Whether you're looking to optimize power management or enhance circuit design, the NTMFS4701NT3G provides the value and benefits you need to take your projects to the next level. Trust Onsemi for quality components that deliver exceptional results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide good insulation and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better performance and higher efficiency compared to P-channel transistors.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier and more efficient switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast and reliable performance.

Surface Mount: YES

Surface mount capability makes it easy to integrate into circuit boards, saving space and improving overall design efficiency.

Package Shape: RECTANGULAR

Rectangular shape is standard and easy to work with for mounting and assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors are easier to control and offer higher efficiency in switching applications.

No. of Terminals: 5

5 terminals allow for versatile connections and flexibility in circuit design.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides good performance and reliability for small signal applications.

Transistor Element Material: SILICON

Silicon transistors are known for their high performance and wide availability in the market.

Maximum Drain Current (ID): 7.7 A

High maximum drain current allows for handling of larger loads and higher power applications.

Maximum Drain-Source On Resistance: 0.008 ohm

Low on-resistance ensures minimal power loss and efficient operation.

Terminal Position: DUAL

Dual terminal positions provide flexibility in circuit connections and design.

Case Connection: DRAIN

Case connection at drain terminal simplifies circuit design and thermal management.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable and durable soldering during assembly.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTMFS4701NT3G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

7.7 A

Maximum Drain-Source On Resistance:

.008 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMFS4701NT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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