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NTMFS005P03P8ZT1G

Onsemi

NTMFS005P03P8ZT1G by Onsemi

NTMFS005P03P8ZT1G by Onsemi is a P-CHANNEL FET with 30V DS Breakdown Voltage, 0.0027 ohm RDS(on), and 164A ID. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a max power dissipation of 104W. Suitable for surface mount, this MOSFET has a temp range of -55 to 150 °C.

Median Price

$0.938

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 238 parts In-Stock

1+ parts

$0.496

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238

$0.496

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Chip1Stop

Japan . 15 parts In-Stock

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$0.938

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15

$0.938

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Newark

USA . 1,462 parts In-Stock

1+ parts

$2.320

100+ parts

$1.000

1k+ parts

$0.798

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-

1,462

$2.320

$1.000

$0.798

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Mouser Electronics

USA . 132 parts In-Stock

1+ parts

$2.340

100+ parts

$0.998

1k+ parts

$0.818

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132

$2.340

$0.998

$0.818

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Element14

Singapore . 44 parts In-Stock

1+ parts

$3.000

100+ parts

$1.330

1k+ parts

$0.919

10k+ parts

$0.901

44

$3.000

$1.330

$0.919

$0.901

Future Electronics

Canada . 1,500 parts In-Stock

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$0.565

1,500

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$0.565

Verical

USA . 67 parts In-Stock

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$0.939

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$0.592

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67

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$0.939

$0.592

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Farnell

UK . 44 parts In-Stock

1+ parts

-

100+ parts

$0.769

1k+ parts

$0.577

10k+ parts

$0.539

44

-

$0.769

$0.577

$0.539

Distributors (In-Stock)

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Digiode

USA . 243 parts In-Stock

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$0.891

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243

$0.891

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Vyrian

USA . 13,398 parts In-Stock

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13,398

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Chip Stock

USA . 6,960 parts In-Stock

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6,960

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NAC Semi

USA . 3,000 parts In-Stock

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$0.874

3,000

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$0.874

Sensible Micro Corp

USA . 154 parts In-Stock

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154

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Distributors (Availability)

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Corohmni

South Africa . 86 parts In-Stock

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$0.565

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86

$0.565

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Corphita

USA . 1,442 parts In-Stock

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$0.844

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1,442

$0.844

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Component Stockers USA

USA . 514 parts In-Stock

1+ parts

$99.990

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514

$99.990

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Kulean Microsystems

USA . 5,634 parts In-Stock

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5,634

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Problanco Electronics

Mexico . 4,802 parts In-Stock

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SupplyDigital Components

Austria . 4,625 parts In-Stock

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TANS Electronics

Latvia . 4,042 parts In-Stock

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4,042

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UHIMA Technologies

Türkiye . 198 parts In-Stock

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Overview

Unlock the power of efficient switching with the NTMFS005P03P8ZT1G by Onsemi. Crafted with precision and reliability, this P-CHANNEL FET offers unparalleled performance in a compact package. Whether you need to optimize your power management system or enhance your circuit design, this transistor is the ideal solution. Trust in the quality and expertise of Onsemi to deliver cutting-edge technology for all your switching applications. Experience the value and advantages that this product brings to your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: P-CHANNEL

P-channel transistors offer high input impedance and lower leakage current, making them suitable for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient switching and protection against reverse current flow, enhancing the transistor's performance.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor provides fast response times and efficient power handling capabilities.

Surface Mount: YES

Being surface mountable, this transistor offers easy installation and saves space on the circuit board.

Maximum Drain Current (ID): 164 A

With a high maximum drain current rating, this transistor can handle high power applications effectively.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTMFS005P03P8ZT1G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

164 A

Maximum Drain-Source On Resistance:

.0027 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

2550 pF

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMFS005P03P8ZT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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