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NTMFS4C10NT3G

Onsemi

NTMFS4C10NT3G by Onsemi

NTMFS4C10NT3G by Onsemi is a N-CHANNEL FET with 46A max drain current and 23.6W power dissipation. Ideal for high-power applications, it operates at up to 150°C and features surface mount configuration for easy installation.

Median Price

$1.140

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4,985 parts In-Stock

1+ parts

$1.140

100+ parts

$0.468

1k+ parts

$0.329

10k+ parts

$0.301

4,985

$1.140

$0.468

$0.329

$0.301

Distributors (In-Stock)

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Digiode

USA . 485 parts In-Stock

1+ parts

$1.083

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-

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485

$1.083

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Vyrian

USA . 4,935 parts In-Stock

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4,935

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

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Semicontronic

India . 4,903 parts In-Stock

1+ parts

$0.970

100+ parts

$0.946

1k+ parts

$0.941

10k+ parts

-

4,903

$0.970

$0.946

$0.941

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Ampacity Inc.

Singapore . 4,794 parts In-Stock

1+ parts

$0.970

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4,794

$0.970

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Corphita

USA . 2,002 parts In-Stock

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$1.026

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2,002

$1.026

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Aztec Data Supply Inc.

USA . 3,616 parts In-Stock

1+ parts

$1.510

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3,616

$1.510

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Problanco Electronics

Mexico . 7,898 parts In-Stock

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7,898

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Continental Prestige Electronics

USA . 5,003 parts In-Stock

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SupplyDigital Components

Austria . 4,906 parts In-Stock

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4,906

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TANS Electronics

Latvia . 3,977 parts In-Stock

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3,977

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Kulean Microsystems

USA . 3,856 parts In-Stock

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Microchip USA

USA . 2,172 parts In-Stock

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Argo Parts USA

USA . 1,366 parts In-Stock

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UHIMA Technologies

Türkiye . 526 parts In-Stock

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526

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Corohmni

South Africa . 175 parts In-Stock

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175

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Advanced Electronics

New Zealand . 90 parts In-Stock

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90

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Overview

Unlock the power of innovation with the NTMFS4C10NT3G by Onsemi, a cutting-edge N-CHANNEL Small Signal Field Effect Transistor. Manufactured by industry leader Onsemi, this high-quality FET is designed for maximum performance and reliability. Ideal for a wide range of applications, this single configuration transistor offers a maximum drain current of 46A and a maximum power dissipation of 23.6W, ensuring optimal functionality even in high-demand scenarios. Trust Onsemi to deliver top-notch technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Polarity or Channel Type:

N-CHANNEL - This allows for efficient control of current flow in the transistor.

Configuration:

SINGLE - Simplicity in design makes it easy to integrate into various electronic circuits.

Surface Mount:

YES - Ideal for compact and space-constrained applications.

Maximum Drain Current (Abs) (ID):

46 A - High current handling capability for demanding circuit requirements.

Maximum Power Dissipation (Abs):

23.6 W - Ensures reliable performance under heavy load conditions.

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR - Offers high switching speeds and low power consumption.

Maximum Operating Temperature:

150 °C - Can withstand elevated temperatures for extended periods.

Terminal Finish:

Matte Tin (Sn) - annealed - Provides excellent connectivity and corrosion resistance.

Maximum Time At Peak Reflow Temperature (s):

30 - Allows for efficient and reliable soldering during assembly.

Peak Reflow Temperature °C:

260 - Ensures proper solder reflow without damaging the transistor.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTMFS4C10NT3G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

46 A

Maximum Drain Current (ID):

46 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NTMFS4C10NT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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