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NTMFS008N12MC

Onsemi

NTMFS008N12MC by Onsemi

NTMFS008N12MC by Onsemi is a N-CHANNEL FET with 120V DS breakdown voltage, 0.008 ohm RDS(on), and 150 °C max operating temp. Ideal for switching applications, it features a single configuration with built-in diode in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,154 parts In-Stock

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Digiode

USA . 1,260 parts In-Stock

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1,260

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TANS Electronics

Latvia . 7,621 parts In-Stock

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7,621

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Kulean Microsystems

USA . 7,133 parts In-Stock

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Corphita

USA . 2,139 parts In-Stock

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Problanco Electronics

Mexico . 1,444 parts In-Stock

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Corohmni

South Africa . 499 parts In-Stock

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499

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UHIMA Technologies

Türkiye . 457 parts In-Stock

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457

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SupplyDigital Components

Austria . 170 parts In-Stock

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Overview

Enhance your electronics projects with the NTMFS008N12MC by Onsemi, a top-quality N-channel small signal field effect transistor perfect for switching applications. Manufactured by Onsemi, a trusted leader in semiconductor technology, this transistor offers unparalleled performance and reliability. With a built-in diode and low drain-source resistance, this transistor provides optimal efficiency and power management. Whether you're designing consumer electronics, automotive systems, or industrial equipment, the NTMFS008N12MC delivers the value and benefits you need to take your projects to the next level. Upgrade your designs today with this high-performance transistor from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring long-lasting performance.

Polarity or Channel Type: N-CHANNEL

Allows for efficient switching operations and versatility in circuit design.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by including a diode within the transistor package.

Transistor Application: SWITCHING

Ideal for switching applications, providing fast and reliable performance.

Surface Mount: YES

Enables easy and secure mounting on circuit boards, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 120 V

Provides high breakdown voltage for added protection and reliability in circuit operation.

Package Shape: RECTANGULAR

Compact and space-saving design for easy integration into electronic circuits.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high performance and efficiency in switching applications.

Maximum Operating Temperature: 150 °C

Can withstand high operating temperatures, ensuring reliability in various environments.

Transistor Element Material: SILICON

Provides high efficiency and performance in electronic circuits.

Maximum Drain-Source On Resistance: 0.008 ohm

Low on-resistance for efficient switching and minimal power loss.

Terminal Position: DUAL

Dual terminal position for versatile usage in different circuit configurations.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTMFS008N12MC attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

120 V

Maximum Drain-Source On Resistance:

.008 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-N8

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

DUAL GATE, ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMFS008N12MC Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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