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2N7002BKV,115

NXP Semiconductors

2N7002BKV,115 by NXP Semiconductors

NXP Semiconductors' 2N7002BKV,115 is a N-CHANNEL FET for SWITCHING applications. Features include 60V DS Breakdown Voltage, 0.34A Drain Current, and 1.6 ohm On Resistance. With a max temp of 150°C, it's ideal for small outline packages in ENHANCEMENT MODE circuits.

Median Price

$0.089

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

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Newark

USA . 233 parts In-Stock

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Arrow

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Verical

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Rochester

USA . 36,000 parts In-Stock

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Chip1Stop

Japan . 24,000 parts In-Stock

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TTI

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Farnell

UK . 11,325 parts In-Stock

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Element14

Singapore . 4,233 parts In-Stock

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EBV Elektronik

Germany . 4,000 parts In-Stock

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Digiode

USA . 4,082 parts In-Stock

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Maritex

Poland . 34 parts In-Stock

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Nova Conductors

Japan . 52 parts In-Stock

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Chip Stock

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NAC Semi

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Vyrian

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Cyclops Electronics Ltd

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Sensible Micro Corp

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A2Z Electronics, Inc.

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ComSIT Distribution GmbH

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Bristol Electronics

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Elcom Components

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Semicontronic

India . 126,358 parts In-Stock

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Ampacity Inc.

Singapore . 42,164 parts In-Stock

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Corphita

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AZTECH Wire

Italy . 12,542 parts In-Stock

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Argo Parts USA

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Modulus Dynamics

Lithuania . 38 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,652 parts In-Stock

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Advanced Electronics

New Zealand . 114 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Perfect Parts

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Eastek

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Continental Prestige Electronics

USA . 29,605 parts In-Stock

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Lucentia Tech

USA . 12,117 parts In-Stock

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Microchip USA

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QUARKTWIN TECHNOLOGY LTD

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Supply Digital

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Overview

Discover the unparalleled quality and reliability of the NXP Semiconductors 2N7002BKV,115 Small Signal Field Effect Transistor. Designed for switching applications, this N-CHANNEL transistor offers enhanced performance and efficiency. With a maximum DS breakdown voltage of 60V and a maximum drain current of 0.34A, this transistor is built to handle a wide range of tasks with ease. Whether you're working on automotive electronics or consumer devices, the 2N7002BKV,115 delivers exceptional value and benefits that will elevate your projects to new heights. Upgrade to NXP Semiconductors for superior performance and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

Allows for efficient switching operations in electronic circuits.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

Enables versatile use in a variety of circuit designs.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance.

Surface Mount: YES

Offers easy and convenient installation on circuit boards.

Minimum DS Breakdown Voltage: 60 V

Can handle high voltage levels, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

Facilitates compact and space-saving design in electronic devices.

Terminal Form: FLAT

Simplifies soldering and connection processes during assembly.

Operating Mode: ENHANCEMENT MODE

Provides efficient control over the transistor's operation.

No. of Elements: 2

Offers enhanced functionality and versatility in circuit designs.

Maximum Drain Current (Abs) (ID): 0.34 A

Capable of handling moderate current levels for various applications.

No. of Terminals: 6

Provides multiple connection points for flexible circuit integration.

Maximum Power Dissipation (Abs): 1.14 W

Can dissipate heat effectively to maintain optimal performance.

Package Style (Meter): SMALL OUTLINE

Suitable for compact and space-constrained electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Delivers efficient and reliable performance in switching applications.

Maximum Operating Temperature: 150 °C

Can operate effectively in a wide range of temperature environments.

Transistor Element Material: SILICON

Provides stable and consistent performance over time.

Minimum Operating Temperature: -55 °C

Can function reliably in extreme cold conditions.

Terminal Finish: TIN

Ensures good connectivity and corrosion resistance for long-term use.

Maximum Drain-Source On Resistance: 1.6 ohm

Allows for efficient current flow with minimal voltage drop.

Terminal Position: DUAL

Facilitates easy connection and integration in circuit layouts.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand reflow soldering processes without damage.

Peak Reflow Temperature °C: 260

Meets industry-standard reflow soldering requirements.

Reference Standard: AEC-Q101

Complies with automotive-grade quality and reliability standards.

Technical Specifications

Small Signal Field Effect Transistors (FET) 2N7002BKV,115 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

.34 A

Maximum Drain Current (ID):

.34 A

Maximum Drain-Source On Resistance:

1.6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

2N7002BKV,115 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.75

SB

8541.21.00.80

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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