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NTMFD1D4N02P1E

Onsemi

NTMFD1D4N02P1E by Onsemi

NTMFD1D4N02P1E by Onsemi is a N-CHANNEL FET with 2 SERIES CONNECTED elements, ideal for SWITCHING applications. It features a Max Drain Current of 74A, Min DS Breakdown Voltage of 25V, and Max Power Dissipation of 25W. This small outline transistor operates in an ENHANCEMENT MODE with a temperature range from -55 to 150 °C.

Median Price

$3.200

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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DigiKey

USA . 946 parts In-Stock

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$3.200

100+ parts

$1.443

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$1.232

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$3.200

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Flip Electronics (Authorized)

USA . 12,000 parts In-Stock

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Digiode

USA . 403 parts In-Stock

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$2.261

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Vyrian

USA . 430 parts In-Stock

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$2.380

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Chip Stock

USA . 55,000 parts In-Stock

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Flip Electronics

USA . 7,900 parts In-Stock

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Component Sense

UK . 3,356 parts In-Stock

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Corphita

USA . 2,147 parts In-Stock

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$2.142

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Corohmni

South Africa . 282 parts In-Stock

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$2.380

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282

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Microchip USA

USA . 8,909 parts In-Stock

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$7.441

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QUARKTWIN TECHNOLOGY LTD

USA . 14,855 parts In-Stock

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TANS Electronics

Latvia . 6,699 parts In-Stock

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SupplyDigital Components

Austria . 6,531 parts In-Stock

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Problanco Electronics

Mexico . 5,919 parts In-Stock

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UHIMA Technologies

Türkiye . 728 parts In-Stock

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Kulean Microsystems

USA . 526 parts In-Stock

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Overview

Unleash the power of innovation with the NTMFD1D4N02P1E by Onsemi. Crafted with precision and reliability, this Small Signal Field Effect Transistor offers unparalleled performance for switching applications. With cutting-edge technology and a sleek design, this N-CHANNEL transistor provides enhanced efficiency and seamless operation. Experience the difference with Onsemi's superior quality and advanced features, delivering value and benefits to customers in various industries. Elevate your projects with the NTMFD1D4N02P1E and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

Allows for efficient switching operations in electronic circuits.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE

Enables versatile circuit designs and added functionality with the built-in diode.

Transistor Application: SWITCHING

Specifically designed for switching applications, ensuring optimal performance in such scenarios.

Surface Mount: YES

Allows for convenient and space-saving installation on circuit boards.

Minimum DS Breakdown Voltage: 25 V

Offers a reliable voltage threshold to prevent breakdown during operation.

Package Shape: RECTANGULAR

Facilitates easy integration into circuit layouts and designs.

Operating Mode: ENHANCEMENT MODE

Enhances the transistor's performance and efficiency in operation.

Maximum Power Dissipation (Abs): 25 W

Can handle high power dissipation, suitable for demanding applications.

Package Style (Meter): SMALL OUTLINE

Compact design for efficient use of space on PCBs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes advanced semiconductor technology for improved performance.

Maximum Operating Temperature: 150 °C

Can operate effectively at high temperatures, expanding its range of applications.

Transistor Element Material: SILICON

Offers reliability and performance benefits associated with silicon-based transistors.

Minimum Operating Temperature: -55 °C

Can operate in extreme cold temperatures, suitable for diverse environments.

Maximum Drain Current (ID): 74 A

Capable of handling high drain currents for demanding applications.

Maximum Drain-Source On Resistance: 0.0033 ohm

Low on-resistance for efficient switching operations and minimal power loss.

Terminal Position: DUAL

Provides versatility in circuit connections and configurations.

Case Connection: SOURCE

Optimal connection for proper circuit functionality.

Maximum Feedback Capacitance (Crss): 22 pF

Low feedback capacitance for improved stability in circuit operation.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTMFD1D4N02P1E attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

SOURCE

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (ID):

74 A

Maximum Drain-Source On Resistance:

.0033 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

22 pF

JESD-30 Code:

R-PDSO-N8

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMFD1D4N02P1E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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