Loading...

NTMFS4701NT1G

Onsemi

NTMFS4701NT1G by Onsemi

NTMFS4701NT1G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, 7.7A ID, and 0.008 ohm RDS(ON). It's used for SWITCHING applications in ENHANCEMENT MODE with built-in DIODE. This SMALL OUTLINE transistor has METAL-OXIDE SEMICONDUCTOR tech and operates in DUAL terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 58,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

58,000

-

-

-

-

Vyrian

USA . 9,463 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,463

-

-

-

-

Digiode

USA . 1,730 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,730

-

-

-

-

Prism Electronics

USA . 513 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

513

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 545 parts In-Stock

1+ parts

$19.630

100+ parts

-

1k+ parts

-

10k+ parts

-

545

$19.630

-

-

-

TANS Electronics

Latvia . 7,396 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,396

-

-

-

-

SupplyDigital Components

Austria . 6,158 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,158

-

-

-

-

A-Z Elektronik GmbH

Germany . 4,878 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,878

-

-

-

-

Kulean Microsystems

USA . 1,341 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,341

-

-

-

-

Corphita

USA . 1,119 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,119

-

-

-

-

UHIMA Technologies

Türkiye . 929 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

929

-

-

-

-

Problanco Electronics

Mexico . 915 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

915

-

-

-

-

Perfect Parts

USA . 564 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

564

-

-

-

-

Corohmni

South Africa . 416 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

416

-

-

-

-

Kepictronics

USA . 195 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

195

-

-

-

-

Overview

Experience seamless and efficient switching with the Onsemi NTMFS4701NT1G Small Signal FET. Crafted with precision by Onsemi, this N-CHANNEL transistor boasts a single configuration with a built-in diode, making it ideal for a variety of applications. With a maximum drain current of 7.7 A and a low on-resistance of 0.008 ohm, this transistor ensures optimal performance and reliability. Trust in Onsemi's reputation for quality and innovation, and elevate your projects with the NTMFS4701NT1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have higher electron mobility and lower resistance, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for efficient and reliable switching operations in circuits.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in such scenarios.

Surface Mount: YES

Surface mount technology allows for easy and compact integration of the transistor onto circuit boards.

Minimum DS Breakdown Voltage: 30 V

Provides a high breakdown voltage, ensuring the transistor can handle higher voltages without damage.

Package Shape: RECTANGULAR

Rectangular shape provides ease of handling and installation in various electronic devices.

Terminal Form: FLAT

Flat terminals allow for secure connections and better heat dissipation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation enables precise control of the transistor for switching functions.

No. of Terminals: 5

5 terminals provide various connection options and flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and is ideal for compact electronic designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability in switching applications.

Transistor Element Material: SILICON

Silicon material provides good thermal stability and high efficiency in operation.

Terminal Finish: TIN

Tin finish ensures good conductivity and corrosion resistance for the terminals.

Maximum Drain Current (ID): 7.7 A

High maximum drain current rating allows the transistor to handle large current loads.

Maximum Drain-Source On Resistance: 0.008 ohm

Low on-resistance ensures minimal power loss and efficient switching performance.

Terminal Position: DUAL

Dual terminal position offers additional connection options for more versatile circuit designs.

Case Connection: DRAIN

Drain connection is commonly used for FETs in switching applications, providing optimal performance.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for reliable soldering and integration onto circuit boards.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTMFS4701NT1G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

7.7 A

Maximum Drain-Source On Resistance:

.008 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMFS4701NT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19