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BSS84PL6327

Infineon Technologies

BSS84PL6327 by Infineon Technologies

BSS84PL6327 by Infineon is a P-CHANNEL FET with 60V DS breakdown voltage and 8 ohm RDS(on). Ideal for small outline applications, it operates in enhancement mode with max ID of 0.17A. With GULL WING terminals and built-in diode, it's suitable for various electronic devices.

Median Price

$0.060

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

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Rebound Electronics

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Component Sense

UK . 1,667 parts In-Stock

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Atlantic Semiconductor

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Bristol Electronics

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Japan . 100 parts In-Stock

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Semicontronic

India . 796 parts In-Stock

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$1.050

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$1.024

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$1.018

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Aztec Data Supply Inc.

USA . 3,628 parts In-Stock

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$1.251

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Advanced Electronics

New Zealand . 3,271 parts In-Stock

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Modulus Dynamics

Lithuania . 14,234 parts In-Stock

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Corohmni

South Africa . 155 parts In-Stock

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AZTECH Wire

Italy . 377 parts In-Stock

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Singapore . 1,391 parts In-Stock

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Denmark . 2,918 parts In-Stock

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Continental Prestige Electronics

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Lucentia Tech

USA . 350 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Discover the power of the BSS84PL6327 by Infineon Technologies, a top-tier manufacturer known for its high-quality small signal field effect transistors. This P-Channel FET comes in a convenient plastic/epoxy package with a built-in diode, making it ideal for various applications. With a maximum breakdown voltage of 60V and a low on-resistance of 8 ohms, this transistor offers superior performance and reliability. Trust Infineon Technologies to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the BSS84PL6327 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: P-CHANNEL

Allows for efficient current control and operation in various electronic circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by including a diode within the transistor itself.

Minimum DS Breakdown Voltage: 60 V

Can withstand high voltage levels, making it suitable for a wide range of applications.

Surface Mount: YES

Facilitates easy installation on circuit boards, saving space and reducing assembly time.

Maximum Drain Current (ID): 0.17 A

Capable of handling moderate current levels, suitable for various low-power applications.

Maximum Drain-Source On Resistance: 8 ohm

Offers low resistance for efficient power transfer and minimal heat generation.

Maximum Operating Temperature: 150 °C

Can operate reliably at high temperatures, ensuring performance in demanding environments.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSS84PL6327 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

.17 A

Maximum Drain-Source On Resistance:

8 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

3 pF

JESD-30 Code:

R-PDSO-G3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Element Material:

SILICON

Trade Compliance

BSS84PL6327 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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