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TM124BBK32S-80

Texas Instruments

TM124BBK32S-80 by Texas Instruments

TM124BBK32S-80 by Texas Instruments is a 1MX32 DRAM module with 1048576 words, 32-bit memory width, and 33554432 bit memory density. It operates in FAST PAGE access mode with an 80 ns max access time. Ideal for commercial applications requiring high-speed data storage and retrieval.

Median Price

$31.376

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 296 parts In-Stock

1+ parts

-

100+ parts

$27.890

1k+ parts

$24.960

10k+ parts

$23.490

296

-

$27.890

$24.960

$23.490

DigiKey

USA . 296 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

296

-

-

-

-

Verical

USA . 296 parts In-Stock

1+ parts

-

100+ parts

$34.862

1k+ parts

$31.200

10k+ parts

$29.363

296

-

$34.862

$31.200

$29.363

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,119 parts In-Stock

1+ parts

$29.440

100+ parts

-

1k+ parts

-

10k+ parts

-

2,119

$29.440

-

-

-

Vyrian

USA . 5,880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,880

-

-

-

-

DigiKey Marketplace

USA . 296 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

296

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 382 parts In-Stock

1+ parts

$2.689

100+ parts

-

1k+ parts

$3.172

10k+ parts

-

382

$2.689

-

$3.172

-

DigiPath Technology Company

USA . 467 parts In-Stock

1+ parts

$2.961

100+ parts

$2.724

1k+ parts

-

10k+ parts

-

467

$2.961

$2.724

-

-

ChromeModa Solutions

Germany . 840 parts In-Stock

1+ parts

$3.021

100+ parts

$2.477

1k+ parts

-

10k+ parts

-

840

$3.021

$2.477

-

-

IDEA Electronic Components Group

UK . 621 parts In-Stock

1+ parts

$3.021

100+ parts

-

1k+ parts

$2.719

10k+ parts

-

621

$3.021

-

$2.719

-

Corphita

USA . 2,738 parts In-Stock

1+ parts

$27.891

100+ parts

-

1k+ parts

-

10k+ parts

-

2,738

$27.891

-

-

-

Overview

Experience unparalleled speed and reliability with the TM124BBK32S-80 by Texas Instruments, a top-notch DRAM module designed for high-performance applications. Texas Instruments, known for their commitment to quality and innovation, delivers a product that exceeds expectations in terms of efficiency and durability. Ideal for a wide range of uses, this DRAM module offers seamless operation and fast access times, making it a valuable asset for any project. Upgrade your system with the TM124BBK32S-80 and enjoy the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into standard electronic devices and circuit boards.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode allows for fast and efficient data transfer without the need for synchronization signals.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage ensures stable and reliable performance of the DRAM module.

No. of Terminals: 72

The 72 terminals provide ample connectivity options for various applications and devices.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this DRAM module can withstand high heat conditions.

Refresh Cycles: 1024

The 1024 refresh cycles ensure data integrity and reliability over extended periods of use.

Technical Specifications

DRAM TM124BBK32S-80 attributes and parameters. Explore more DRAM devices from Texas Instruments

Specs

Access Mode:

FAST PAGE

Maximum Access Time:

80 ns

Additional Features:

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

Input/Output Type:

COMMON

JESD-30 Code:

R-XSMA-N72

Memory Density:

33554432 bit

Memory IC Type:

Memory Width:

32

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

72

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1MX32

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SSIM72

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Power Supplies (V):

5

Qualification:

Not Qualified

Refresh Cycles:

Maximum Seated Height:

25.527 mm

Self Refresh:

NO

Maximum Standby Current:

.008 Amp

Sub-Category:

DRAMs

Maximum Supply Current:

640 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

SINGLE

Trade Compliance

TM124BBK32S-80 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.02

SB

8542.32.00.15

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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