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TM124BBK32-60

Texas Instruments

TM124BBK32-60 by Texas Instruments

TM124BBK32-60 by Texas Instruments is a 1MX32 DRAM module with 1048576 words, 33554432-bit memory density, and 32-word memory width. It operates in FAST PAGE access mode with a max access time of 60 ns. Ideal for applications requiring high-speed data storage and retrieval in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,225 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,225

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-

-

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Digiode

USA . 3,077 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,077

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,211 parts In-Stock

1+ parts

$3.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,211

$3.000

-

-

-

Parana Technologies

USA . 1,080 parts In-Stock

1+ parts

$4.608

100+ parts

-

1k+ parts

$5.077

10k+ parts

-

1,080

$4.608

-

$5.077

-

DigiPath Technology Company

USA . 2,229 parts In-Stock

1+ parts

$5.074

100+ parts

$4.668

1k+ parts

-

10k+ parts

-

2,229

$5.074

$4.668

-

-

IDEA Electronic Components Group

UK . 1,721 parts In-Stock

1+ parts

$5.178

100+ parts

-

1k+ parts

$4.660

10k+ parts

-

1,721

$5.178

-

$4.660

-

ChromeModa Solutions

Germany . 844 parts In-Stock

1+ parts

$5.178

100+ parts

$4.246

1k+ parts

-

10k+ parts

-

844

$5.178

$4.246

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-

AZTECH Wire

Italy . 895 parts In-Stock

1+ parts

$11.127

100+ parts

-

1k+ parts

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10k+ parts

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895

$11.127

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Corphita

USA . 1,435 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,435

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Overview

Experience high-quality performance and reliability with the TM124BBK32-60 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers exceptional DRAM modules that excel in various applications. Offering a seamless asynchronous operating mode and 1MX32 organization, this module provides unmatched value and benefits to customers. With a fast page access mode and 3-STATE output characteristics, the TM124BBK32-60 ensures efficient data processing without compromising on speed or efficiency. Upgrade your system with Texas Instruments for superior performance and reliability.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular shape allows for efficient space utilization and easy integration into existing systems.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for flexible and independent timing control, making it suitable for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 5

Stable supply voltage of 5V ensures reliable performance and compatibility with standard power sources.

No. of Terminals: 72

Having 72 terminals provides ample connectivity options for interfacing with other components or devices.

Maximum Operating Temperature: 70 °C

High maximum operating temperature of 70°C allows for reliable operation in various environmental conditions.

Organization: 1MX32

1MX32 organization offers a high memory capacity and data width, suitable for demanding computing tasks.

Technology: CMOS

CMOS technology ensures low power consumption and high speed performance, making it energy-efficient.

Memory IC Type: FAST PAGE DRAM MODULE

Fast page DRAM module design enhances data transfer speeds and overall system performance.

Refresh Cycles: 1024

With 1024 refresh cycles, the memory maintains data integrity and reliability over extended periods of use.

Maximum Access Time: 60 ns

Fast maximum access time of 60 ns enables quick data retrieval and processing, essential for real-time applications.

Technical Specifications

DRAM TM124BBK32-60 attributes and parameters. Explore more DRAM devices from Texas Instruments

Specs

Access Mode:

FAST PAGE

Maximum Access Time:

60 ns

Additional Features:

RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

Input/Output Type:

COMMON

JESD-30 Code:

R-XSMA-N72

Memory Density:

33554432 bit

Memory IC Type:

Memory Width:

32

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

72

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1MX32

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SSIM72

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Power Supplies (V):

5

Qualification:

Not Qualified

Refresh Cycles:

Maximum Seated Height:

25.527 mm

Self Refresh:

NO

Maximum Standby Current:

.008 Amp

Sub-Category:

DRAMs

Maximum Supply Current:

840 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

SINGLE

Trade Compliance

TM124BBK32-60 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.02

SB

8542.32.00.15

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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