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W66CP2NQUAFJ

Winbond Electronics

W66CP2NQUAFJ by Winbond Electronics

Winbond Electronics' W66CP2NQUAFJ is a 128MX32 LPDDR4 DRAM with 134,217,728 words and 4294967296 bit memory density. Operating at up to 1600 MHz, it features synchronous mode and self-refresh capability. Ideal for applications requiring high-speed data processing in compact devices.

Median Price

$6.690

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 81 parts In-Stock

1+ parts

$6.690

100+ parts

$5.180

1k+ parts

$4.810

10k+ parts

$4.670

81

$6.690

$5.180

$4.810

$4.670

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$6.893

100+ parts

-

1k+ parts

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10k+ parts

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50

$6.893

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TECHDesign

Taiwan . 1,151 parts In-Stock

1+ parts

$13.430

100+ parts

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1,151

$13.430

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Vyrian

USA . 121 parts In-Stock

1+ parts

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121

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 799 parts In-Stock

1+ parts

$6.856

100+ parts

-

1k+ parts

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799

$6.856

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Continental Prestige Electronics

USA . 6,492 parts In-Stock

1+ parts

$6.893

100+ parts

-

1k+ parts

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10k+ parts

$6.755

6,492

$6.893

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$6.755

iodParts Technologies Inc.

India . 5,250 parts In-Stock

1+ parts

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5,250

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$6.755

1k+ parts

$6.549

10k+ parts

$6.411

2,000

-

$6.755

$6.549

$6.411

Argo Parts USA

USA . 1,701 parts In-Stock

1+ parts

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1,701

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Overview

Elevate your device's performance with the W66CP2NQUAFJ by Winbond Electronics, a top-tier LPDDR4 DRAM that boasts exceptional quality and reliability. Designed with cutting-edge technology, this memory module offers seamless operation in synchronous mode with self-refresh capabilities. Ideal for a wide range of applications, from smartphones to tablets, this component delivers unmatched speed and efficiency. Experience the superior benefits of Winbond Electronics' expertise in memory solutions with the W66CP2NQUAFJ, setting new standards in performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the DRAM, ensuring it can withstand various environmental conditions.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and coordination within the DRAM, resulting in efficient data transfer and processing.

Nominal Supply Voltage / Vsup (V): 1.1

The 1.1V supply voltage ensures energy efficiency and optimal performance of the DRAM while operating at the specified voltage level.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a very thin profile and fine pitch enables compact and space-saving design options for devices using this DRAM.

Maximum Clock Frequency (fCLK): 1600 MHz

The high maximum clock frequency of 1600 MHz allows for fast data processing and responsive performance in applications utilizing this DRAM.

Technology: CMOS

The CMOS technology used in this DRAM offers low power consumption, high speed, and reliability, making it a suitable choice for a variety of electronic devices.

Memory IC Type: LPDDR4 DRAM

The LPDDR4 DRAM type ensures high performance and efficiency in handling large amounts of data, making it ideal for applications requiring fast and reliable memory access.

Technical Specifications

DRAM W66CP2NQUAFJ attributes and parameters. Explore more DRAM devices from Winbond Electronics

Specs

Access Mode:

MULTI BANK PAGE BURST

Additional Features:

AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMINAL SUPPLY; TERM PITCH-MAX

Maximum Clock Frequency (fCLK):

1600 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

16,32

JESD-30 Code:

R-PBGA-B200

Length:

14.5 mm

Memory Density:

4294967296 bit

Memory IC Type:

Memory Width:

32

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

200

No. of Words:

134217728 words

No. of Words Code:

128M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128MX32

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA200,12X22,32/25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.8 mm

Self Refresh:

YES

Sequential Burst Length:

16,32

Maximum Supply Voltage (Vsup):

1.17 V

Minimum Supply Voltage (Vsup):

1.06 V

Nominal Supply Voltage / Vsup (V):

1.1

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

10 mm

Trade Compliance

W66CP2NQUAFJ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.36

SB

8542.32.00.23

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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