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IS43TR16256BL-107MBLI

Integrated Silicon Solution

IS43TR16256BL-107MBLI by Integrated Silicon Solution

IS43TR16256BL-107MBLI by Integrated Silicon Solution is a 256MX16 DDR3 DRAM with 1.35V supply, operating from -40 to 95°C. Featuring synchronous mode and self-refresh, it has a thin profile grid array package suitable for industrial applications requiring high memory density and multi-bank page burst access.

Median Price

$8.870

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 219 parts In-Stock

1+ parts

$8.870

100+ parts

$7.230

1k+ parts

$7.070

10k+ parts

-

219

$8.870

$7.230

$7.070

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Element14

Singapore . 78 parts In-Stock

1+ parts

$20.940

100+ parts

$17.540

1k+ parts

$17.100

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78

$20.940

$17.540

$17.100

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Rochester

USA . 705 parts In-Stock

1+ parts

-

100+ parts

$7.210

1k+ parts

$6.450

10k+ parts

$6.070

705

-

$7.210

$6.450

$6.070

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$9.270

100+ parts

-

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300

$9.270

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-

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Chip Stock

USA . 30,970 parts In-Stock

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30,970

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Cyclops Electronics Ltd

UK . 19,952 parts In-Stock

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19,952

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Vyrian

USA . 13,112 parts In-Stock

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13,112

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NAC Semi

USA . 495 parts In-Stock

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$11.550

10k+ parts

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495

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$11.550

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 1,579 parts In-Stock

1+ parts

$2.340

100+ parts

-

1k+ parts

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1,579

$2.340

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Corohmni

South Africa . 303 parts In-Stock

1+ parts

$4.267

100+ parts

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303

$4.267

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Continental Prestige Electronics

USA . 133 parts In-Stock

1+ parts

$10.150

100+ parts

$7.560

1k+ parts

-

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133

$10.150

$7.560

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Lixinc

USA . 12,336 parts In-Stock

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12,336

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Authorized Procurement Solutions

USA . 2,775 parts In-Stock

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2,775

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GreenTree Electronics

Israel . 2,015 parts In-Stock

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2,015

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Argo Parts USA

USA . 1,981 parts In-Stock

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1,981

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iodParts Technologies Inc.

India . 950 parts In-Stock

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950

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Netroflash

USA . 50 parts In-Stock

1+ parts

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100+ parts

$9.085

1k+ parts

$8.807

10k+ parts

$8.621

50

-

$9.085

$8.807

$8.621

Overview

Upgrade your system with the IS43TR16256BL-107MBLI by Integrated Silicon Solution, a top-tier DRAM module that delivers exceptional performance and reliability. Manufactured by industry leader ISSI, this DDR3 memory chip is designed for seamless integration into a wide range of applications, ensuring smooth operation and fast data processing. With a nominal supply voltage of 1.35V and self-refresh capabilities, this memory module offers energy efficiency and stable performance. Elevate your system's speed and responsiveness with the IS43TR16256BL-107MBLI and experience superior computing power like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides durability and protection for the DRAM, ensuring a longer lifespan.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and coordination between the DRAM and other components, enhancing overall system performance.

Nominal Supply Voltage / Vsup (V): 1.35

Low supply voltage of 1.35V helps in reducing power consumption and heat generation, making it energy efficient.

Maximum Operating Temperature: 95 °C

High maximum operating temperature of 95°C ensures reliability and stability even in demanding industrial environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, leading to efficient operation and improved performance.

Technical Specifications

DRAM IS43TR16256BL-107MBLI attributes and parameters. Explore more DRAM devices from Integrated Silicon Solution

Specs

Access Mode:

MULTI BANK PAGE BURST

Additional Features:

AUTO/SELF REFRESH

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e1

Length:

13 mm

Memory Density:

4294967296 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

96

No. of Words:

268435456 words

No. of Words Code:

256M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Maximum Supply Voltage (Vsup):

1.45 V

Minimum Supply Voltage (Vsup):

1.283 V

Nominal Supply Voltage / Vsup (V):

1.35

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

IS43TR16256BL-107MBLI Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.36

SB

8542.32.00.23

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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