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IS43TR16256BL-125KBLI

Integrated Silicon Solution

IS43TR16256BL-125KBLI by Integrated Silicon Solution

IS43TR16256BL-125KBLI by Integrated Silicon Solution is a 256MX16 DDR3L DRAM with a max clock frequency of 400 MHz. It operates in synchronous mode and has a self-refresh feature. It is commonly used in industrial applications requiring high memory density and fast data processing.

Median Price

$10.416

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

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Chip1Stop

Japan . 570 parts In-Stock

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$9.585

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$8.366

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$6.783

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570

$9.585

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$6.783

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Arrow

USA . 159 parts In-Stock

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$9.760

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$8.633

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$7.097

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$9.760

$8.633

$7.097

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Verical

USA . 159 parts In-Stock

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$9.760

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Element14

Singapore . 88 parts In-Stock

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$10.416

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$8.815

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$10.416

$8.815

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Farnell

UK . 88 parts In-Stock

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$10.856

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$8.171

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$7.694

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88

$10.856

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$7.694

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Mouser Electronics

USA . 15 parts In-Stock

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$15.830

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$13.590

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$15.830

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Newark

USA . 2 parts In-Stock

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$17.910

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$17.910

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Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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$10.712

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10

$10.712

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Chip Stock

USA . 20,500 parts In-Stock

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ComSIT Distribution GmbH

Germany . 9,456 parts In-Stock

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NAC Semi

USA . 4,940 parts In-Stock

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$10.540

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$9.730

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$9.730

North Shore Components

USA . 2,825 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,025 parts In-Stock

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Vyrian

USA . 1,036 parts In-Stock

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GLYN GmbH & Co. KG

Germany . 570 parts In-Stock

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570

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Sensible Micro Corp

USA . 500 parts In-Stock

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500

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LIBRA Elektronik GmbH

Germany . 18 parts In-Stock

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LWI Electronics Inc

India . 5 parts In-Stock

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Semi Source

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 953 parts In-Stock

1+ parts

$4.706

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953

$4.706

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Continental Prestige Electronics

USA . 107 parts In-Stock

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$8.640

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$7.070

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107

$8.640

$7.070

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Aranea Global

USA . 1,000 parts In-Stock

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$10.498

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$10.078

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$10.498

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$10.078

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Corohmni

South Africa . 40 parts In-Stock

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$11.309

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$11.309

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Advanced Electronics

New Zealand . 600 parts In-Stock

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$11.648

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$11.066

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$11.066

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$11.648

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$11.066

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Lixinc

USA . 4,847 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,611 parts In-Stock

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RC Electronics

USA . 3,654 parts In-Stock

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$9.560

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$8.730

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$8.460

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Authorized Procurement Solutions

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Argo Parts USA

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Futuretech Components

Singapore . 1,500 parts In-Stock

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Eastek

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Perfect Parts

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Overview

Revolutionize your computing experience with the IS43TR16256BL-125KBLI by Integrated Silicon Solution. As a leading manufacturer in the industry, this DDR3L DRAM offers unparalleled quality and reliability. Ideal for industrial applications, this memory module boasts a wide operating temperature range and low standby current, ensuring optimal performance in any environment. With a high memory density of 4294967296 bits and a maximum clock frequency of 400 MHz, this chip provides lightning-fast data processing. Upgrade your system today and experience the ultimate in speed and efficiency with the IS43TR16256BL-125KBLI.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product is made with a strong and durable plastic/epoxy material, ensuring its longevity and reliability.

Surface Mount: YES

With a surface mount capability, this product can be easily mounted onto circuit boards, saving space and making installation hassle-free.

No. of Functions: 1

Featuring a single function, this product offers simplicity and ease of use.

Package Shape: RECTANGULAR

The rectangular package shape of this product allows for efficient use of space and easy integration into electronic devices.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures that data is transmitted and processed at the same time, enhancing overall performance and speed.

Self Refresh: YES

This product has a self-refresh feature, allowing it to maintain performance even during periods of low power or standby mode.

Input/Output Type: COMMON

The common input/output type of this product enables compatibility with a wide range of devices and systems, making it a versatile choice.

Nominal Supply Voltage (Vsup): 1.35V

With a low nominal supply voltage, this product offers energy efficiency and helps reduce power consumption.

No. of Terminals: 96

The 96 terminals provide ample connectivity options and ensure reliable connections for optimal performance.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch package style make this product suitable for applications with limited space, while maintaining high data transfer rates.

Maximum Operating Temperature: 95 °C

This product can reliably operate at high temperatures up to 95°C, making it suitable for demanding industrial environments.

Organization: 256MX16

The organization of 256MX16 allows for a large memory capacity and data storage capabilities.

Output Characteristics: 3-STATE

With 3-state output characteristics, this product offers flexibility in controlling signal flow, making it ideal for various applications and data transfer scenarios.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product can withstand extreme cold environments, ensuring reliable performance.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides excellent conductivity and corrosion resistance, ensuring reliable connections and maximizing product lifespan.

Terminal Position: BOTTOM

The terminal position at the bottom of this product allows for efficient board layout and easy integration into circuit designs.

No. of Ports: 1

Featuring a single port, this product offers simplified connectivity and ease of use.

Maximum Seated Height: 1.2 mm

With a compact maximum seated height, this product can be easily installed into slim devices without compromising on performance.

Maximum Clock Frequency (fCLK): 400 MHz

The maximum clock frequency of 400 MHz ensures fast data processing and smooth performance.

Width: 9 mm

With a compact width of 9 mm, this product can fit into space-constrained devices without sacrificing functionality.

Minimum Supply Voltage (Vsup): 1.283 V

The low minimum supply voltage ensures energy efficiency and helps prolong battery life.

Maximum Time At Peak Reflow Temperature (s): 30

This product can withstand a maximum of 30 seconds at peak reflow temperature during manufacturing processes, ensuring reliable soldering.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand high-temperature assembly processes, ensuring proper soldering and durability.

Length: 13 mm

With a compact length of 13 mm, this product can be easily integrated into small electronic devices without occupying excessive space.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product can withstand harsh operating conditions and perform reliably in demanding environments.

Access Mode: MULTI BANK PAGE BURST

The multi-bank page burst access mode allows for efficient data transfer and retrieval, enhancing overall system performance.

Technology: CMOS

Based on CMOS technology, this product offers low power consumption, high speed, and excellent noise immunity, making it a reliable choice.

Terminal Form: BALL

The ball terminal form ensures secure and reliable connections, making this product suitable for challenging and high-stress environments.

Maximum Supply Current: 228 mA

With a maximum supply current of 228 mA, this product ensures stable and efficient operation without excessive power consumption.

No. of Words: 268435456 words

This product offers a large number of words for data storage, making it suitable for applications with high memory requirements.

Sequential Burst Length: 4,8

The sequential burst length of 4 and 8 allows for efficient data retrieval and transfer, maximizing overall system performance.

Memory Width: 16

With a memory width of 16, this product can handle larger volumes of data and enable faster data processing.

Terminal Pitch: 0.8 mm

The terminal pitch of 0.8 mm ensures accurate and reliable connections, making this product suitable for high-density circuit designs.

No. of Words Code: 256M

This product is equipped with a 256M words code, providing ample memory capacity for various applications.

Moisture Sensitivity Level (MSL): 3

The level 3 moisture sensitivity ensures proper handling, storage, and soldering of this product, preventing moisture-related issues.

Maximum Supply Voltage (Vsup): 1.45 V

With a maximum supply voltage of 1.45V, this product allows for flexible power input options, providing compatibility with various systems.

Memory Density: 4294967296 bit

With a memory density of 4294967296 bits, this product offers a large storage capacity for data-intensive applications.

Memory IC Type: DDR3L DRAM

This product utilizes DDR3L DRAM technology, providing high-speed data transfer and efficient memory management, making it a reliable choice.

Maximum Standby Current: 0.028 Amp

With a maximum standby current of 0.028 Amp, this product minimizes power consumption in idle or standby modes, prolonging battery life and energy efficiency.

Refresh Cycles: 8192

This product offers a high number of refresh cycles, ensuring data integrity and preventing data loss or corruption.

Interleaved Burst Length: 4,8

The interleaved burst length of 4 and 8 allows for efficient data access and transfer, optimizing overall system performance.

Technical Specifications

DRAM IS43TR16256BL-125KBLI attributes and parameters. Explore more DRAM devices from Integrated Silicon Solution

Specs

Access Mode:

MULTI BANK PAGE BURST

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

400 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

4,8

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e1

Length:

13 mm

Memory Density:

4294967296 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

96

No. of Words:

268435456 words

No. of Words Code:

256M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,9X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Refresh Cycles:

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

4,8

Maximum Standby Current:

.028 Amp

Maximum Supply Current:

228 mA

Maximum Supply Voltage (Vsup):

1.45 V

Minimum Supply Voltage (Vsup):

1.283 V

Nominal Supply Voltage / Vsup (V):

1.35

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

IS43TR16256BL-125KBLI Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.36

SB

8542.32.00.23

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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