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IS43TR16128B-15HBLI

Integrated Silicon Solution

IS43TR16128B-15HBLI by Integrated Silicon Solution

IS43TR16128B-15HBLI by Integrated Silicon Solution is a 128MX16 DDR3 DRAM with 667 MHz clock frequency. It operates asynchronously, supports self-refresh, and has a common I/O type. Ideal for industrial applications requiring high memory density and fast access times.

Median Price

$6.546

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

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Vyrian

USA . 3,461 parts In-Stock

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PC Components Company LLC

USA . 102 parts In-Stock

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Bristol Electronics

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Continental Prestige Electronics

USA . 555 parts In-Stock

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$6.546

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AZTECH Wire

Italy . 302 parts In-Stock

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$11.951

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Lixinc

USA . 19,686 parts In-Stock

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S.R.D Solutions

India . 17,000 parts In-Stock

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Authorized Procurement Solutions

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Argo Parts USA

USA . 4,623 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$6.219

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$6.088

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Overview

Unlock the power of cutting-edge technology with the IS43TR16128B-15HBLI from Integrated Silicon Solution. As a leading manufacturer in the industry, ISS offers top-notch quality and reliability. This DDR3 DRAM module is perfect for a wide range of applications, providing seamless performance and lightning-fast speeds. With a nominal supply voltage of 1.5V and a maximum clock frequency of 667 MHz, this memory module delivers exceptional value and efficiency. Upgrade your systems today with the IS43TR16128B-15HBLI and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body ensures durability and protection for the DRAM, making it a reliable choice for long-term use.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode allows for flexible and independent operation of the DRAM, optimizing performance and efficiency in various applications.

Nominal Supply Voltage / Vsup (V): 1.5

The 1.5V supply voltage ensures compatibility with a wide range of systems and reduces power consumption, making the DRAM energy-efficient.

Maximum Clock Frequency (fCLK): 667 MHz

The high maximum clock frequency of 667 MHz enables fast data transfer rates, improving overall system performance.

Memory IC Type: DDR3 DRAM

Being DDR3 DRAM, this memory module offers high data transfer speeds and efficient multitasking capabilities, making it suitable for demanding computing tasks.

Technical Specifications

DRAM IS43TR16128B-15HBLI attributes and parameters. Explore more DRAM devices from Integrated Silicon Solution

Specs

Access Mode:

MULTI BANK PAGE BURST

Maximum Access Time:

.255 ns

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

667 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

4,8

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e1

Length:

13 mm

Memory Density:

2147483648 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

96

No. of Words:

134217728 words

No. of Words Code:

128M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,9X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5

Qualification:

Not Qualified

Refresh Cycles:

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

4,8

Maximum Standby Current:

.014 Amp

Sub-Category:

DRAMs

Maximum Supply Current:

286 mA

Maximum Supply Voltage (Vsup):

1.575 V

Minimum Supply Voltage (Vsup):

1.425 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

IS43TR16128B-15HBLI Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.36

SB

8542.32.00.23

PCN

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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