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MT48LC16M16A2P-6A:DTR

Micron Technology

MT48LC16M16A2P-6A:DTR by Micron Technology

Micron Technology's MT48LC16M16A2P-6A:DTR is a 16MX16 Synchronous DRAM with 16777216 words, 268435456 bit memory density, and operates at 3.3V. It features SYNCHRONOUS operation mode, SELF REFRESH capability, and FOUR BANK PAGE BURST access mode. Ideal for commercial applications requiring fast data processing in compact systems.

Median Price

$4.620

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 25 parts In-Stock

1+ parts

$4.620

100+ parts

$3.460

1k+ parts

$3.000

10k+ parts

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25

$4.620

$3.460

$3.000

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Vyrian

USA . 6,552 parts In-Stock

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Chip Stock

USA . 4,675 parts In-Stock

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4,675

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Digiode

USA . 1,921 parts In-Stock

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Nova Conductors

Japan . 65 parts In-Stock

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65

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Prism Electronics

USA . 61 parts In-Stock

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61

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Distributors (Availability)

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AZTECH Wire

Italy . 494 parts In-Stock

1+ parts

$6.477

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494

$6.477

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Argo Parts USA

USA . 4,513 parts In-Stock

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Continental Prestige Electronics

USA . 3,340 parts In-Stock

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Corphita

USA . 1,126 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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500

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Microchip USA

USA . 445 parts In-Stock

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445

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Overview

Unleash the power of cutting-edge technology with the MT48LC16M16A2P-6A:DTR by Micron Technology. As a leading manufacturer in the industry, Micron guarantees top-notch quality and reliability for its DRAM products. Ideal for a wide range of applications, this memory device boasts synchronous operation and self-refresh capabilities, ensuring seamless performance. With a compact design and advanced features, the MT48LC16M16A2P-6A:DTR offers unparalleled value, benefits, and advantages to customers looking for high-speed memory solutions. Elevate your projects with the best in class memory technology from Micron.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the components inside the package, ensuring the product's longevity.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures data is transferred at a consistent and precise rate, enhancing the overall performance of the product.

Nominal Supply Voltage / Vsup (V): 3.3

The specified voltage requirement ensures compatibility with standard power sources, making integration into existing systems seamless.

No. of Terminals: 54

Having a sufficient number of terminals allows for versatile connectivity options and ensures reliable signal transmission.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature tolerance enables the product to function effectively even in demanding and high-temperature environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in operation.

Memory IC Type: SYNCHRONOUS DRAM

The use of synchronous DRAM technology ensures faster data access and processing speeds, enhancing the overall performance of the memory module.

Technical Specifications

DRAM MT48LC16M16A2P-6A:DTR attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

FOUR BANK PAGE BURST

Maximum Access Time:

5.4 ns

Additional Features:

AUTO/SELF REFRESH

JESD-30 Code:

R-PDSO-G54

JESD-609 Code:

e3

Length:

22.22 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

54

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

16MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

MT48LC16M16A2P-6A:DTR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.24

SB

8542.32.00.15

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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