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MT48LC16M16A2P-6AIT:G

Micron Technology

MT48LC16M16A2P-6AIT:G by Micron Technology

Micron Technology's MT48LC16M16A2P-6AIT:G is a 16MX16 Synchronous DRAM with 167 MHz clock frequency, 3.3V supply voltage, and -40 to 85°C operating temperature range. Ideal for industrial applications requiring high-speed memory access with a compact form factor and low power consumption.

Median Price

$8.990

Lifecycle Status

Suppliers In-Stock

33

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 5,720 parts In-Stock

1+ parts

$4.480

100+ parts

$3.940

1k+ parts

$3.820

10k+ parts

$3.740

5,720

$4.480

$3.940

$3.820

$3.740

Farnell

UK . 76 parts In-Stock

1+ parts

$8.990

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76

$8.990

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Mouser Electronics

USA . 868 parts In-Stock

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$9.280

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868

$9.280

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Element14

Singapore . 76 parts In-Stock

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$15.800

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EBV Elektronik

Germany . 14,040 parts In-Stock

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Future Electronics

Canada . 10,476 parts In-Stock

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$2.690

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Verical

USA . 5,720 parts In-Stock

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5,720

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Distributors (In-Stock)

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Digiode

USA . 279 parts In-Stock

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$4.038

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Nova Conductors

Japan . 10 parts In-Stock

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$5.600

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$5.600

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Cyclops Electronics Ltd

UK . 103,185 parts In-Stock

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NAC Semi

USA . 65,880 parts In-Stock

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Chip Stock

USA . 24,700 parts In-Stock

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Dynamic Solutions

Germany . 4,000 parts In-Stock

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HZD GmbH

Germany . 3,470 parts In-Stock

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Inventory MP

USA . 2,180 parts In-Stock

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Vyrian

USA . 1,312 parts In-Stock

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Component Sense

UK . 636 parts In-Stock

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ComSIT Distribution GmbH

Germany . 606 parts In-Stock

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Classic Components Corporation

USA . 539 parts In-Stock

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539

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Martec Srl

Italy . 173 parts In-Stock

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Touchstone Systems

USA . 98 parts In-Stock

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Sensible Micro Corp

USA . 87 parts In-Stock

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PC Components Company LLC

USA . 47 parts In-Stock

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Holdelec - ElecDif-Pro

France . 38 parts In-Stock

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A&K Electronics

USA . 30 parts In-Stock

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Rotakorn

Sweden . 30 parts In-Stock

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Velocity Electronics

USA . 23 parts In-Stock

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North Shore Components

USA . 23 parts In-Stock

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J2 Sourcing AB

Sweden . 15 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 12 parts In-Stock

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Semi Source

USA . 10 parts In-Stock

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Bristol Electronics

USA . 9 parts In-Stock

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Connect4Technologies Inc.

Canada . 2 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 3,327 parts In-Stock

1+ parts

$2.105

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3,327

$2.105

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Advanced Electronics

New Zealand . 1,080 parts In-Stock

1+ parts

$3.308

100+ parts

$3.143

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$3.143

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1,080

$3.308

$3.143

$3.143

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Semicontronic

India . 23,075 parts In-Stock

1+ parts

$3.340

100+ parts

$3.256

1k+ parts

$3.240

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23,075

$3.340

$3.256

$3.240

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Ampacity Inc.

Singapore . 4,277 parts In-Stock

1+ parts

$3.350

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4,277

$3.350

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Corphita

USA . 644 parts In-Stock

1+ parts

$3.825

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644

$3.825

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Aztec Data Supply Inc.

USA . 276 parts In-Stock

1+ parts

$4.920

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276

$4.920

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Continental Prestige Electronics

USA . 8,177 parts In-Stock

1+ parts

$5.246

100+ parts

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$5.141

8,177

$5.246

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$5.141

Netroflash

USA . 50 parts In-Stock

1+ parts

$5.600

100+ parts

$5.488

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50

$5.600

$5.488

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Perfect Parts

USA . 73,338 parts In-Stock

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73,338

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A-Z Elektronik GmbH

Germany . 22,970 parts In-Stock

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S.R.D Solutions

India . 18,840 parts In-Stock

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RC Electronics

USA . 9,083 parts In-Stock

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Kepictronics

USA . 4,500 parts In-Stock

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Argo Parts USA

USA . 3,010 parts In-Stock

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Microchip USA

USA . 2,917 parts In-Stock

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Lucentia Tech

USA . 2,850 parts In-Stock

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$0.221

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$0.221

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$0.221

2,850

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$0.221

$0.221

$0.221

Authorized Procurement Solutions

USA . 2,387 parts In-Stock

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2,387

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Robosynatics

Brazil . 1,500 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 860 parts In-Stock

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860

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Formix International (Excess)

India . 754 parts In-Stock

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754

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XScomponents

USA . 748 parts In-Stock

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748

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Futuretech Components

Singapore . 700 parts In-Stock

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700

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GreenTree Electronics

Israel . 700 parts In-Stock

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700

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iodParts Technologies Inc.

India . 108 parts In-Stock

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108

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Overview

Elevate your system's performance with the MT48LC16M16A2P-6AIT:G from Micron Technology. As a leading manufacturer in the industry, Micron guarantees top-notch quality and reliability. This DRAM memory module is perfect for applications requiring fast and efficient data processing. With a compact design and advanced features like self-refresh and common input/output type, this product delivers outstanding value and performance. Upgrade your system today with Micron's cutting-edge technology and experience seamless multitasking and smooth operation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material helps reduce the weight of the product and provides durability.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures efficient and synchronized data transfer within the device.

Nominal Supply Voltage / Vsup (V): 3.3

The low supply voltage of 3.3V helps in reducing power consumption and heat generation.

Maximum Clock Frequency (fCLK): 167 MHz

High clock frequency enables fast data processing and retrieval speeds.

Temperature Grade: INDUSTRIAL

Industrial grade temperature tolerance ensures reliability and stability in various operating conditions.

Memory IC Type: SYNCHRONOUS DRAM

The type of memory IC used ensures efficient and synchronized data access and transfer.

Technical Specifications

DRAM MT48LC16M16A2P-6AIT:G attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

FOUR BANK PAGE BURST

Maximum Access Time:

5.4 ns

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

167 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

1,2,4,8

JESD-30 Code:

R-PDSO-G54

Length:

22.22 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

54

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP54,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Refresh Cycles:

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

1,2,4,8,FP

Maximum Standby Current:

.0025 Amp

Sub-Category:

DRAMs

Maximum Supply Current:

100 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10.16 mm

Trade Compliance

MT48LC16M16A2P-6AIT:G Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.24

SB

8542.32.00.15

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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