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MT47H32M16NF-25EIT:HTR

Micron Technology

MT47H32M16NF-25EIT:HTR by Micron Technology

Micron Technology's MT47H32M16NF-25EIT:HTR is a DDR2 DRAM with 32MX16 organization and 33554432 words. It operates synchronously at a voltage of 1.8V, has a temperature range of -40 to 85°C, and is suitable for industrial applications.

Median Price

$3.570

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,979 parts In-Stock

1+ parts

$5.010

100+ parts

$4.317

1k+ parts

$4.070

10k+ parts

$3.987

1,979

$5.010

$4.317

$4.070

$3.987

Mouser Electronics

USA . 1,442 parts In-Stock

1+ parts

$6.650

100+ parts

-

1k+ parts

-

10k+ parts

-

1,442

$6.650

-

-

-

EBV Elektronik

Germany . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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10,000

-

-

-

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Future Electronics

Canada . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.800

8,000

-

-

-

$2.800

Arrow

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$3.570

2,000

-

-

-

$3.570

Verical

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$3.570

2,000

-

-

-

$3.570

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EXC GmbH

Germany . 1,000 parts In-Stock

1+ parts

$2.224

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$2.224

-

-

-

Digiode

USA . 1,339 parts In-Stock

1+ parts

$5.064

100+ parts

-

1k+ parts

-

10k+ parts

-

1,339

$5.064

-

-

-

Nova Conductors

Japan . 65 parts In-Stock

1+ parts

$5.463

100+ parts

-

1k+ parts

-

10k+ parts

-

65

$5.463

-

-

-

Chip Stock

USA . 25,000 parts In-Stock

1+ parts

-

100+ parts

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25,000

-

-

-

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NAC Semi

USA . 24,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

$6.530

24,000

-

-

-

$6.530

Vyrian

USA . 5,657 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,657

-

-

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Component Sense

UK . 1,559 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,559

-

-

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Sensible Micro Corp

USA . 665 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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665

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Mil-Aero Solutions, Inc.

USA . 317 parts In-Stock

1+ parts

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100+ parts

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317

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Bristol Electronics

USA . 207 parts In-Stock

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207

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 48,520 parts In-Stock

1+ parts

$2.690

100+ parts

-

1k+ parts

-

10k+ parts

-

48,520

$2.690

-

-

-

Advanced Electronics

New Zealand . 140 parts In-Stock

1+ parts

$2.775

100+ parts

$2.636

1k+ parts

$2.636

10k+ parts

-

140

$2.775

$2.636

$2.636

-

Semicontronic

India . 10,825 parts In-Stock

1+ parts

$3.160

100+ parts

$3.081

1k+ parts

$3.065

10k+ parts

-

10,825

$3.160

$3.081

$3.065

-

Ampacity Inc.

Singapore . 4,590 parts In-Stock

1+ parts

$3.160

100+ parts

-

1k+ parts

-

10k+ parts

-

4,590

$3.160

-

-

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Corohmni

South Africa . 623 parts In-Stock

1+ parts

$3.893

100+ parts

-

1k+ parts

-

10k+ parts

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623

$3.893

-

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Argo Parts USA

USA . 2,168 parts In-Stock

1+ parts

$4.260

100+ parts

-

1k+ parts

-

10k+ parts

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2,168

$4.260

-

-

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Continental Prestige Electronics

USA . 995 parts In-Stock

1+ parts

$4.260

100+ parts

-

1k+ parts

-

10k+ parts

$4.175

995

$4.260

-

-

$4.175

Corphita

USA . 773 parts In-Stock

1+ parts

$4.797

100+ parts

-

1k+ parts

-

10k+ parts

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773

$4.797

-

-

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Perfect Parts

USA . 56,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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56,000

-

-

-

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Epart123

USA . 38,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.690

10k+ parts

$2.690

38,000

-

-

$2.690

$2.690

RC Electronics

USA . 5,808 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,808

-

-

-

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,000

-

-

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iodParts Technologies Inc.

India . 1,665 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

-

1,665

-

-

-

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$5.354

1k+ parts

$5.190

10k+ parts

$5.081

1,000

-

$5.354

$5.190

$5.081

Futuretech Components

Singapore . 791 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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791

-

-

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Formix International (Excess)

India . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5

-

-

-

-

Overview

Discover the cutting-edge MT47H32M16NF-25EIT:HTR by Micron Technology, a high-quality DDR2 DRAM that sets new standards in performance and reliability. With its advanced CMOS technology and synchronous operating mode, this memory module ensures lightning-fast data processing and seamless multi-tasking. Whether you're a gamer, a graphic designer, or a tech enthusiast, this product is designed to enhance your computing experience and deliver unparalleled speed and efficiency. Trust in Micron Technology's expertise and industry-leading manufacturing capabilities to bring you the very best in memory solutions. Upgrade your system today and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and flexibility to the DRAM, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the DRAM onto circuit boards, saving time and cost in manufacturing.

No. of Functions: 1

This DRAM has a single function, simplifying its use and integration into electronic devices.

Package Shape: RECTANGULAR

The rectangular shape offers compatibility with standard electronic components and facilitates efficient design and layout.

Operating Mode: SYNCHRONOUS

The synchronous operation ensures precise data transfer, improving overall system performance.

Self Refresh: YES

The self-refresh feature eliminates the need for external refreshing, reducing power consumption and extending battery life in portable devices.

Nominal Supply Voltage / Vsup (V): 1.8

The 1.8V supply voltage provides efficient power consumption while maintaining reliable operation of the DRAM.

No. of Terminals: 84

With 84 terminals, this DRAM offers a wide range of connectivity options for integration into various electronic systems.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch package style enables high-density mounting, making it suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

This DRAM can withstand high operating temperatures, ensuring reliable performance in harsh environments.

Organization: 32MX16

With an organization of 32 megabytes by 16 bits, this DRAM provides ample memory capacity for data storage and retrieval.

Minimum Operating Temperature: -40 °C

The DRAM can operate reliably even under extremely low temperatures, making it suitable for industrial and automotive applications.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper terminal finish ensures robust and reliable electrical connections, enhancing the overall performance and longevity of the DRAM.

Terminal Position: BOTTOM

The bottom terminal position facilitates easier integration and assembly onto circuit boards, simplifying the manufacturing process.

No. of Ports: 1

This DRAM features a single port, allowing for efficient data transfer and access.

Maximum Seated Height: 1.2 mm

The compact height of 1.2mm enables the DRAM's integration into space-constrained devices without compromising performance.

Width: 8 mm

With a width of 8mm, this DRAM can fit into compact designs, making it suitable for smaller electronic devices.

Minimum Supply Voltage (Vsup): 1.7 V

The minimum supply voltage of 1.7V ensures compatibility with low-power applications while maintaining reliable operation.

Maximum Time At Peak Reflow Temperature (s): 30

The DRAM can withstand the specified maximum time at peak reflow temperature, ensuring proper soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability of 260°C ensures reliable solder joint formation during assembly.

Length: 12.5 mm

The length of 12.5mm allows for easy integration into various electronic systems, providing versatility in design.

Temperature Grade: INDUSTRIAL

This DRAM is designed to operate reliably within industrial temperature conditions, making it suitable for demanding applications in harsh environments.

Access Mode: FOUR BANK PAGE BURST

The four-bank page burst access mode allows for faster and more efficient data transfer, enhancing overall system performance.

Technology: CMOS

The use of complementary metal-oxide-semiconductor (CMOS) technology enables low power consumption and high-speed operation.

Terminal Form: BALL

The ball terminal form ensures reliable electrical connections and facilitates automated assembly processes in manufacturing.

No. of Words: 33554432 words

With a large number of words (33554432), this DRAM provides ample memory capacity for storing and retrieving data.

Memory Width: 16

The DRAM's memory width of 16 bits allows for efficient data transfer and processing, enhancing system performance.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8mm enables high-density packaging, making it suitable for compact electronic devices.

No. of Words Code: 32M

The 32M words code ensures compatibility with systems that require this specific memory configuration.

Maximum Supply Voltage (Vsup): 1.9 V

The DRAM can safely operate at a maximum supply voltage of 1.9V, providing versatility in powering options.

Memory Density: 536870912 bit

The high memory density of 536870912 bits allows for efficient storage and retrieval of large amounts of data.

Memory IC Type: DDR2 DRAM

This DRAM is of DDR2 type, providing improved performance and higher data transfer rates compared to earlier DDR versions.

Maximum Access Time: 0.4 ns

The short maximum access time of 0.4 nanoseconds ensures rapid data access and processing capabilities.

Technical Specifications

DRAM MT47H32M16NF-25EIT:HTR attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

FOUR BANK PAGE BURST

Maximum Access Time:

.4 ns

Additional Features:

AUTO/SELF REFRESH

JESD-30 Code:

R-PBGA-B84

JESD-609 Code:

e1

Length:

12.5 mm

Memory Density:

536870912 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

84

No. of Words:

33554432 words

No. of Words Code:

32M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

MT47H32M16NF-25EIT:HTR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.28

SB

8542.32.00.15

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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