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MT47H64M16NF-25EAAT:M

Micron Technology

MT47H64M16NF-25EAAT:M by Micron Technology

Micron Technology's MT47H64M16NF-25EAAT:M is a DDR2 DRAM with 64MX16 organization, operating at a max clock frequency of 400 MHz. It has a memory density of 1,073,741,824 bits and is commonly used in applications requiring high-speed synchronous memory.

Median Price

$6.230

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 9,621 parts In-Stock

1+ parts

$5.310

100+ parts

$4.440

1k+ parts

$4.240

10k+ parts

-

9,621

$5.310

$4.440

$4.240

-

Farnell

UK . 1,391 parts In-Stock

1+ parts

$7.150

100+ parts

$5.050

1k+ parts

$4.950

10k+ parts

-

1,391

$7.150

$5.050

$4.950

-

Newark

USA . 102 parts In-Stock

1+ parts

$10.380

100+ parts

-

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102

$10.380

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Element14

Singapore . 697 parts In-Stock

1+ parts

$14.030

100+ parts

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697

$14.030

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Arrow

USA . 2,736 parts In-Stock

1+ parts

-

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-

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10k+ parts

$3.522

2,736

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$3.522

Verical

USA . 2,736 parts In-Stock

1+ parts

-

100+ parts

-

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$3.522

2,736

-

-

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$3.522

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,318 parts In-Stock

1+ parts

$3.068

100+ parts

-

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2,318

$3.068

-

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$5.740

100+ parts

-

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100

$5.740

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Vyrian

USA . 3,939 parts In-Stock

1+ parts

-

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3,939

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NAC Semi

USA . 2,392 parts In-Stock

1+ parts

-

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$5.310

2,392

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-

$5.310

Greenchips

USA . 110 parts In-Stock

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110

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SIE Connect GmbH - GreenChips

Germany . 110 parts In-Stock

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110

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Speed Components Ltd

Israel . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,766 parts In-Stock

1+ parts

$2.907

100+ parts

-

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1,766

$2.907

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Ampacity Inc.

Singapore . 4,180 parts In-Stock

1+ parts

$2.990

100+ parts

-

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4,180

$2.990

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Corohmni

South Africa . 977 parts In-Stock

1+ parts

$4.160

100+ parts

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977

$4.160

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Aztec Data Supply Inc.

USA . 3,252 parts In-Stock

1+ parts

$4.480

100+ parts

-

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3,252

$4.480

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Continental Prestige Electronics

USA . 3,849 parts In-Stock

1+ parts

$5.740

100+ parts

-

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$5.625

3,849

$5.740

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-

$5.625

Netroflash

USA . 100 parts In-Stock

1+ parts

$5.740

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100

$5.740

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Semicontronic

India . 4,210 parts In-Stock

1+ parts

$6.520

100+ parts

$6.357

1k+ parts

$6.324

10k+ parts

-

4,210

$6.520

$6.357

$6.324

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Perfect Parts

USA . 21,280 parts In-Stock

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21,280

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A-Z Elektronik GmbH

Germany . 7,496 parts In-Stock

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Argo Parts USA

USA . 4,071 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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S.R.D Solutions

India . 3,000 parts In-Stock

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GreenTree Electronics

Israel . 1,218 parts In-Stock

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Futuretech Components

Singapore . 790 parts In-Stock

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790

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Kepictronics

USA . 93 parts In-Stock

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93

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Overview

Experience the ultimate in performance and reliability with the MT47H64M16NF-25EAAT:M by Micron Technology. As a leading manufacturer in the industry, Micron Technology is renowned for its commitment to quality and innovation. This high-density DDR2 DRAM offers a wide range of applications, providing seamless performance for your computing needs. With its advanced features and cutting-edge technology, the MT47H64M16NF-25EAAT:M delivers faster speeds, lower power consumption, and increased memory density. Whether you're gaming, multitasking, or running resource-intensive applications, this product guarantees an unmatched experience. Upgrade your system today and unleash the full potential of your device with Micron Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's use of plastic/epoxy as its package body material ensures durability and resilience, making it a reliable choice.

Surface Mount: YES

The option for surface mount allows for easy installation and integration into various electronic devices, making this product convenient and versatile.

No. of Functions: 1

With one function, this product offers simplicity and straightforwardness in its operation, making it user-friendly and efficient.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures that this product meets rigorous automotive industry standards, making it suitable for automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space, enabling easier integration into electronic devices and systems.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures accurate and precise data transfers, making this product ideal for high-performance applications.

Self Refresh: YES

This product's self-refresh capability enhances power efficiency, as it can dynamically manage power consumption when idle, making it an energy-efficient choice.

Input/Output Type: COMMON

The use of a common input/output type simplifies circuit design and promotes compatibility with other components, making this product easy to incorporate into existing systems.

Nominal Supply Voltage / Vsup (V): 1.8

The 1.8V nominal supply voltage ensures optimal performance and compatibility with a wide range of devices, making this product suitable for many applications.

No. of Terminals: 84

With 84 terminals, this product provides sufficient connectivity options, allowing for versatile uses and integration into complex systems.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array package style, combined with a thin profile and fine pitch, offers high density and compactness, optimizing space utilization and enabling efficient PCB layouts.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105°C, this product can withstand elevated temperatures, ensuring reliability and suitability for harsh environments.

Organization: 64MX16

The organization of this product as 64MX16 provides a high memory density and improves data processing capabilities, making it ideal for data-intensive applications.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow for multiple devices to share the same bus with minimal interference, increasing system flexibility and scalability.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product can function reliably even in extremely cold environments, making it suitable for various applications.

Terminal Position: BOTTOM

The bottom terminal position simplifies installation and connectivity, ensuring easy integration into electronic systems and reducing assembly complexity.

No. of Ports: 1

With one port, this product provides simplicity and ease of use in its connectivity, making it suitable for straightforward applications.

Maximum Seated Height: 1.2 mm

The maximum seated height of 1.2mm allows for low-profile designs and compact system form factors, making this product ideal for space-constrained applications.

Maximum Clock Frequency (fCLK): 400 MHz

With a maximum clock frequency of 400MHz, this product offers high data transfer rates and enhances system performance in demanding applications.

Width: 8 mm

The 8mm width enables compact PCB layouts and efficient space utilization, ensuring flexibility in integrating this product into various electronic devices.

Minimum Supply Voltage (Vsup): 1.7 V

The minimum supply voltage of 1.7V ensures compatibility with low-power systems and promotes energy efficiency, making this product suitable for battery-operated devices.

Length: 12.5 mm

With a length of 12.5mm, this product provides a compact form factor, allowing for versatile integration into different electronic devices and systems.

Access Mode: MULTI BANK PAGE BURST

The multi-bank page burst access mode enhances memory access efficiency by allowing simultaneous access to different memory banks, improving overall system performance.

Technology: CMOS

Built using CMOS technology, this product offers low power consumption, high noise immunity, and compatibility with a wide range of electronic systems.

Terminal Form: BALL

With a ball terminal form, this product ensures reliable electrical connections and simplifies assembly processes, making it easy to integrate into system designs.

Maximum Supply Current: 260 mA

With a maximum supply current of 260mA, this product can deliver the required power to support high-performance applications, ensuring optimal operation.

No. of Words: 67108864 words

With 67,108,864 words, this product offers a large memory capacity, allowing for extensive data storage and handling, making it suitable for memory-intensive applications.

Sequential Burst Length: 4,8

The sequential burst length of 4 and 8 improves data transfer efficiency by allowing consecutive data transfers, enhancing overall system performance.

Memory Width: 16

With a memory width of 16, this product provides a larger data path, enabling faster data transfers and enhancing system responsiveness.

Terminal Pitch: 0.8 mm

The terminal pitch of 0.8mm allows for precise and reliable connections, facilitating easy integration and reducing electrical signal noise.

No. of Words Code: 64M

The 64M words code signifies a large memory capacity, making this product suitable for applications requiring extensive data storage and processing.

Maximum Supply Voltage (Vsup): 1.9 V

The maximum supply voltage of 1.9V allows for compatibility with a wide range of devices and systems, ensuring reliable and stable operation.

Memory Density: 1073741824 bit

With a memory density of 1,073,741,824 bits, this product offers a high-capacity memory solution, enabling efficient data storage and processing for various applications.

Memory IC Type: DDR2 DRAM

Based on the DDR2 DRAM technology, this product delivers high-speed data transfers and improved performance, making it suitable for demanding computing applications.

Maximum Standby Current: 0.01 Amp

With a maximum standby current of 0.01A, this product ensures energy efficiency during idle periods, minimizing power consumption and prolonging battery life.

Refresh Cycles: 8192

The 8192 refresh cycles ensure stable and reliable data retention, preventing data loss and ensuring the long-term integrity of stored information.

Interleaved Burst Length: 4,8

The interleaved burst length of 4 and 8 improves memory utilization and access efficiency, enhancing system performance in data-intensive applications.

Maximum Access Time: 0.4 ns

With a maximum access time of 0.4ns, this product offers fast data retrieval and processing, enabling quick response times and efficient system operation.

Technical Specifications

DRAM MT47H64M16NF-25EAAT:M attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

MULTI BANK PAGE BURST

Maximum Access Time:

.4 ns

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

400 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

4,8

JESD-30 Code:

R-PBGA-B84

Length:

12.5 mm

Memory Density:

1073741824 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

84

No. of Words:

67108864 words

No. of Words Code:

64M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA84,9X15,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Refresh Cycles:

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

4,8

Maximum Standby Current:

.01 Amp

Maximum Supply Current:

260 mA

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8 mm

Trade Compliance

MT47H64M16NF-25EAAT:M Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.32

SB

8542.32.00.15

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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