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IS42S32800J-6TLI

Integrated Silicon Solution

IS42S32800J-6TLI by Integrated Silicon Solution

SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 86; Package Code: TSOP2; Refresh Cycles: 4096; Package Shape: RECTANGULAR;

Median Price

$6.213

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 50 parts In-Stock

1+ parts

$7.258

100+ parts

$6.213

1k+ parts

$5.949

10k+ parts

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50

$7.258

$6.213

$5.949

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Rochester

USA . 357 parts In-Stock

1+ parts

-

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$5.310

1k+ parts

$4.750

10k+ parts

$4.470

357

-

$5.310

$4.750

$4.470

Verical

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$6.213

1k+ parts

$5.949

10k+ parts

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50

-

$6.213

$5.949

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Nova Conductors

Japan . 100 parts In-Stock

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$6.110

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$6.110

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Chip Stock

USA . 16,290 parts In-Stock

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NAC Semi

USA . 324 parts In-Stock

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$4.830

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324

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Vyrian

USA . 183 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 450 parts In-Stock

1+ parts

$2.166

100+ parts

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$2.166

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$3.001

100+ parts

$2.731

1k+ parts

$2.461

10k+ parts

-

2,500

$3.001

$2.731

$2.461

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Aztec Data Supply Inc.

USA . 2,150 parts In-Stock

1+ parts

$4.220

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$4.220

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Continental Prestige Electronics

USA . 4,287 parts In-Stock

1+ parts

$5.749

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$5.634

4,287

$5.749

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$5.634

QUARKTWIN TECHNOLOGY LTD

USA . 10,102 parts In-Stock

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Argo Parts USA

USA . 3,889 parts In-Stock

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GreenTree Electronics

Israel . 2,431 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$5.988

1k+ parts

$5.804

10k+ parts

$5.682

2,000

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$5.988

$5.804

$5.682

Perfect Parts

USA . 857 parts In-Stock

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Authorized Procurement Solutions

USA . 300 parts In-Stock

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Technical Specifications

DRAM IS42S32800J-6TLI attributes and parameters. Explore more DRAM devices from Integrated Silicon Solution

Specs

Access Mode:

FOUR BANK PAGE BURST

Maximum Access Time:

5.4 ns

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

166 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

1,2,4,8

JESD-30 Code:

R-PDSO-G86

JESD-609 Code:

e3

Length:

22.22 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

32

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

86

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8MX32

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP86,.46,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Refresh Cycles:

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

1,2,4,8,FP

Maximum Standby Current:

.004 Amp

Maximum Supply Current:

190 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

10

Width:

10.16 mm

Trade Compliance

IS42S32800J-6TLI Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.24

SB

8542.32.00.15

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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