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IS42S16160J-6BLI-TR

Integrated Silicon Solution

IS42S16160J-6BLI-TR by Integrated Silicon Solution

IS42S16160J-6BLI-TR by Integrated Silicon Solution is a 16MX16 Synchronous DRAM with 166 MHz clock frequency. It operates at 3.3V, has a memory density of 268Mbit, and supports common I/O type. Ideal for industrial applications requiring fast access times and high memory density in compact form factors.

Median Price

$4.975

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,046 parts In-Stock

1+ parts

$6.630

100+ parts

$5.710

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$6.630

$5.710

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Rochester

USA . 2,475 parts In-Stock

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$3.320

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$2.970

10k+ parts

$2.790

2,475

-

$3.320

$2.970

$2.790

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$4.420

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$4.420

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Bristol Electronics

USA . 255,907 parts In-Stock

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Chip Stock

USA . 44,870 parts In-Stock

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Vyrian

USA . 2,370 parts In-Stock

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Prism Electronics

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NexGen Digital

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iBuyXS LLC

. 255,907 parts In-Stock

1+ parts

$2.500

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$2.500

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Corohmni

South Africa . 311 parts In-Stock

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$2.680

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$2.680

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Bastille Electronics

Australia . 10 parts In-Stock

1+ parts

$4.420

100+ parts

$4.199

1k+ parts

$3.989

10k+ parts

$3.934

10

$4.420

$4.199

$3.989

$3.934

Continental Prestige Electronics

USA . 6,233 parts In-Stock

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$4.420

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$4.332

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$4.420

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$4.332

Argo Parts USA

USA . 2,048 parts In-Stock

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$4.420

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$4.508

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$4.508

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$4.508

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$4.508

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Aztec Data Supply Inc.

USA . 271 parts In-Stock

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$5.801

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BidChips

USA . 255,907 parts In-Stock

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Lixinc

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Authorized Procurement Solutions

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Futuretech Components

Singapore . 1,500 parts In-Stock

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Overview

Looking for top-notch DRAM performance? Look no further than the IS42S16160J-6BLI-TR by Integrated Silicon Solution. With a reputation for quality and reliability, ISS offers cutting-edge memory solutions for a variety of applications. This high-performance memory module boasts a wide range of features, including self-refresh capabilities and common input/output type. Trust ISS to provide you with the value and benefits you need for your next project. Elevate your technology with IS42S16160J-6BLI-TR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, perfect for mobile devices and other portable applications.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise and efficient data transfer, enhancing overall system performance.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is common and widely supported, making it easy to integrate this DRAM into existing systems.

Maximum Clock Frequency (fCLK): 166 MHz

With a high maximum clock frequency of 166 MHz, this DRAM can handle demanding applications and ensure smooth data processing.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh environments, making this DRAM suitable for a wide range of applications.

Technical Specifications

DRAM IS42S16160J-6BLI-TR attributes and parameters. Explore more DRAM devices from Integrated Silicon Solution

Specs

Access Mode:

FOUR BANK PAGE BURST

Maximum Access Time:

5.4 ns

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

166 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

1,2,4,8

JESD-30 Code:

S-PBGA-B54

JESD-609 Code:

e1

Length:

8 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

54

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA54,9X9,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Refresh Cycles:

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

1,2,4,8,FP

Maximum Standby Current:

.03 Amp

Minimum Standby Voltage:

3 V

Maximum Supply Current:

140 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Trade Compliance

IS42S16160J-6BLI-TR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.24

SB

8542.32.00.15

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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