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MT46H32M16LFBF-5IT:CTR

Micron Technology

MT46H32M16LFBF-5IT:CTR by Micron Technology

MT46H32M16LFBF-5IT:CTR by Micron Technology is a 32MX16 LPDDR1 DRAM with 536870912 bit memory density. It operates at 1.8V, has a peak reflow temp of 260°C, and supports synchronous mode with self-refresh capability. Ideal for industrial applications requiring fast access times and low power consumption.

Median Price

$5.502

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,171 parts In-Stock

1+ parts

$5.160

100+ parts

$4.450

1k+ parts

$4.190

10k+ parts

-

1,171

$5.160

$4.450

$4.190

-

DigiKey

USA . 190 parts In-Stock

1+ parts

$10.750

100+ parts

$9.222

1k+ parts

$8.477

10k+ parts

-

190

$10.750

$9.222

$8.477

-

EBV Elektronik

Germany . 42,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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42,000

-

-

-

-

Future Electronics

Canada . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.890

10k+ parts

-

5,000

-

-

$2.890

-

Arrow

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.502

10k+ parts

-

4,000

-

-

$5.502

-

Verical

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.502

10k+ parts

-

4,000

-

-

$5.502

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$4.208

100+ parts

-

1k+ parts

-

10k+ parts

-

550

$4.208

-

-

-

Digiode

USA . 524 parts In-Stock

1+ parts

$4.740

100+ parts

-

1k+ parts

-

10k+ parts

-

524

$4.740

-

-

-

NAC Semi

USA . 170,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.950

10k+ parts

-

170,000

-

-

$3.950

-

Vyrian

USA . 20,564 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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20,564

-

-

-

-

Chip Stock

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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15,000

-

-

-

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Cyclops Electronics Ltd

UK . 7,439 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,439

-

-

-

-

Classic Components Corporation

USA . 522 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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522

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 535 parts In-Stock

1+ parts

$3.838

100+ parts

-

1k+ parts

-

10k+ parts

-

535

$3.838

-

-

-

Component Stockers USA

USA . 1,188 parts In-Stock

1+ parts

$4.110

100+ parts

$4.190

1k+ parts

$3.790

10k+ parts

-

1,188

$4.110

$4.190

$3.790

-

Argo Parts USA

USA . 1,960 parts In-Stock

1+ parts

$4.208

100+ parts

-

1k+ parts

-

10k+ parts

-

1,960

$4.208

-

-

-

Continental Prestige Electronics

USA . 827 parts In-Stock

1+ parts

$4.208

100+ parts

-

1k+ parts

-

10k+ parts

$4.124

827

$4.208

-

-

$4.124

Netroflash

USA . 500 parts In-Stock

1+ parts

$4.208

100+ parts

$4.124

1k+ parts

-

10k+ parts

-

500

$4.208

$4.124

-

-

Ampacity Inc.

Singapore . 19,606 parts In-Stock

1+ parts

$4.220

100+ parts

-

1k+ parts

-

10k+ parts

-

19,606

$4.220

-

-

-

Corphita

USA . 418 parts In-Stock

1+ parts

$4.491

100+ parts

-

1k+ parts

-

10k+ parts

-

418

$4.491

-

-

-

Semicontronic

India . 20,292 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

10k+ parts

-

20,292

$4.500

$4.388

$4.365

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Aztec Data Supply Inc.

USA . 545 parts In-Stock

1+ parts

$5.360

100+ parts

-

1k+ parts

-

10k+ parts

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545

$5.360

-

-

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Epart123

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10,000

-

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Perfect Parts

USA . 7,840 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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7,840

-

-

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Authorized Procurement Solutions

USA . 6,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,800

-

-

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A-Z Elektronik GmbH

Germany . 6,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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6,000

-

-

-

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ChipstoGo Electronic ltd

UK . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,000

-

-

-

-

Glotronic Ltd.

UK . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,000

-

-

-

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iodParts Technologies Inc.

India . 1,928 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,928

-

-

-

-

Overview

Experience the cutting-edge technology of Micron Technology with the MT46H32M16LFBF-5IT:CTR DRAM module. This innovative product offers unparalleled performance and reliability, making it ideal for a wide range of applications. With a sleek rectangular design and self-refreshing capabilities, this DRAM module is a game-changer in the industry. Upgrade your system with Micron's top-of-the-line memory solution and unlock new possibilities for your projects. Trust Micron Technology to deliver the quality and efficiency you need for your next big project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DRAM, ensuring longevity and reliability.

Operating Mode: SYNCHRONOUS

Allows for synchronized data transfers and operations, improving efficiency and performance.

Nominal Supply Voltage / Vsup (V): 1.8

Offers a stable supply voltage for the DRAM, ensuring consistent and reliable operation.

Maximum Operating Temperature: 85 °C

Can operate efficiently even in high-temperature environments, making it suitable for industrial applications.

Organization: 32MX16

Provides a high memory organization, allowing for storing and accessing large amounts of data efficiently.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed, making it energy-efficient and fast.

Memory Density: 536870912 bit

Offers a high memory density, allowing for storing a large amount of data in a compact space.

Memory IC Type: LPDDR1 DRAM

Utilizes LPDDR1 technology for low power consumption and high performance, making it ideal for mobile devices and battery-operated systems.

Technical Specifications

DRAM MT46H32M16LFBF-5IT:CTR attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

FOUR BANK PAGE BURST

Maximum Access Time:

5 ns

Additional Features:

AUTO/SELF REFRESH

JESD-30 Code:

R-PBGA-B60

JESD-609 Code:

e1

Length:

9 mm

Memory Density:

536870912 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

60

No. of Words:

33554432 words

No. of Words Code:

32M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Self Refresh:

YES

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

MT46H32M16LFBF-5IT:CTR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.28

SB

8542.32.00.15

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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