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MT40A1G16KD-062EIT:E

Micron Technology

MT40A1G16KD-062EIT:E by Micron Technology

Micron Technology's MT40A1G16KD-062EIT:E is a DDR4 DRAM with 1GX16 organization, operating at 1600 MHz. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory access in devices like computers and servers.

Median Price

$16.395

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 7 parts In-Stock

1+ parts

$13.130

100+ parts

$11.518

1k+ parts

$10.539

10k+ parts

-

7

$13.130

$11.518

$10.539

-

Mouser Electronics

USA . 149 parts In-Stock

1+ parts

$13.890

100+ parts

$10.610

1k+ parts

$10.020

10k+ parts

-

149

$13.890

$10.610

$10.020

-

Farnell

UK . 1,382 parts In-Stock

1+ parts

$18.900

100+ parts

$11.910

1k+ parts

-

10k+ parts

-

1,382

$18.900

$11.910

-

-

Verical

USA . 732 parts In-Stock

1+ parts

$24.400

100+ parts

$21.230

1k+ parts

-

10k+ parts

-

732

$24.400

$21.230

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,837 parts In-Stock

1+ parts

$17.955

100+ parts

-

1k+ parts

-

10k+ parts

-

1,837

$17.955

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$25.391

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$25.391

-

-

-

Cyclops Electronics Ltd

UK . 9,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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9,750

-

-

-

-

Kruse Electronics AG

Switzerland . 1,318 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,318

-

-

-

-

ARCO, INC.

USA . 1,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,100

-

-

-

-

Vyrian

USA . 1,039 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,039

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 659 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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659

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 3,189 parts In-Stock

1+ parts

$2.660

100+ parts

-

1k+ parts

-

10k+ parts

-

3,189

$2.660

-

-

-

Corohmni

South Africa . 695 parts In-Stock

1+ parts

$3.461

100+ parts

-

1k+ parts

-

10k+ parts

-

695

$3.461

-

-

-

Ampacity Inc.

Singapore . 1,160 parts In-Stock

1+ parts

$16.060

100+ parts

-

1k+ parts

-

10k+ parts

-

1,160

$16.060

-

-

-

Corphita

USA . 1,065 parts In-Stock

1+ parts

$17.010

100+ parts

-

1k+ parts

-

10k+ parts

-

1,065

$17.010

-

-

-

Aranea Global

USA . 50 parts In-Stock

1+ parts

$24.883

100+ parts

-

1k+ parts

$23.888

10k+ parts

-

50

$24.883

-

$23.888

-

Continental Prestige Electronics

USA . 4,445 parts In-Stock

1+ parts

$25.391

100+ parts

-

1k+ parts

-

10k+ parts

$24.883

4,445

$25.391

-

-

$24.883

Semicontronic

India . 1,313 parts In-Stock

1+ parts

$34.960

100+ parts

$34.086

1k+ parts

$33.911

10k+ parts

-

1,313

$34.960

$34.086

$33.911

-

Argo Parts USA

USA . 2,538 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,538

-

-

-

-

Perfect Parts

USA . 1,476 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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1,476

-

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

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GreenTree Electronics

Israel . 705 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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705

-

-

-

-

Cyclops Electronics Ltd (Excess)

UK . 659 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

659

-

-

-

-

Glotronic Ltd.

UK . 527 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

527

-

-

-

-

RC Electronics

USA . 282 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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282

-

-

-

-

Emar International I/E

Canada . 180 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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180

-

-

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Microchip USA

USA . 131 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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131

-

-

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Akira Global LLC

USA . 7 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7

-

-

-

-

Overview

Experience unparalleled performance and reliability with Micron Technology's MT40A1G16KD-062EIT:E DDR4 DRAM. Crafted with precision and expertise, this memory module offers a seamless synchronous operating mode, self-refresh capabilities, and common input/output type for optimized functionality. Ideal for a wide range of applications, from data centers to personal computing, this high-quality component ensures faster processing speeds and enhanced multitasking capabilities. Elevate your system's performance with Micron Technology's cutting-edge technology, delivering unmatched value and efficiency to meet your computing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the internal components, ensuring a long lifespan for the product.

Operating Mode: SYNCHRONOUS

Allows for synchronized data transfer and processing, improving overall system performance.

Nominal Supply Voltage / Vsup (V): 1.2

Efficient power consumption at a standard voltage level, optimizing energy usage.

Maximum Clock Frequency (fCLK): 1600 MHz

Supports high-speed data processing and operation, perfect for demanding applications.

Technology: CMOS

Utilizes Complementary Metal-Oxide-Semiconductor technology for low power consumption and high reliability.

Memory IC Type: DDR4 DRAM

Uses DDR4 technology for faster data access and transfer speeds, enhancing overall system performance.

Technical Specifications

DRAM MT40A1G16KD-062EIT:E attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

MULTI BANK PAGE BURST

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

1600 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

8

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e1

Length:

13 mm

Memory Density:

17179869184 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

96

No. of Words:

1073741824 words

No. of Words Code:

1G

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1GX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,9X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Refresh Cycles:

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

8

Maximum Supply Voltage (Vsup):

1.26 V

Minimum Supply Voltage (Vsup):

1.14 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

MT40A1G16KD-062EIT:E Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.36

SB

8542.32.00.23

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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