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MT48LC16M16A2P-75:D

Micron Technology

MT48LC16M16A2P-75:D by Micron Technology

MT48LC16M16A2P-75:D by Micron Technology is a 16MX16 SDRAM with 3.3V supply, 133 MHz clock frequency, and 70°C operating temp. Ideal for commercial applications requiring high-speed memory access in a small outline package.

Median Price

$5.103

Lifecycle Status

Suppliers In-Stock

31

In-Stock Inventory

1k+

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Nova Conductors

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Digiode

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Touchstone Systems

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Speed Components Ltd

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Bristol Electronics

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Zilex Electronics Inc.

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Rebound Electronics

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Legend Electronics Inc.

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ComSIT Distribution GmbH

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ComSIT USA

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Quantum Digital Technology

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Connector Distribution Corp

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Right Parts Inc.

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Prism Electronics

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Halfin

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Carlin Systems, Inc.

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Flex Direct, LLC

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Component Sense

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Atlantic Semiconductor

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Cogito LLC

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Sensible Micro Corp

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Sunrise Surplus Inc.

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Semicontronic

India . 1,564 parts In-Stock

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$2.925

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Corohmni

South Africa . 833 parts In-Stock

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Aztec Data Supply Inc.

USA . 222 parts In-Stock

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Continental Prestige Electronics

USA . 4,668 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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Advanced Electronics

New Zealand . 700 parts In-Stock

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$7.004

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$6.444

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AZTECH Wire

Italy . 217 parts In-Stock

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Andel Nordic

Denmark . 3,677 parts In-Stock

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Ampacity Inc.

Singapore . 643 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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RC Electronics

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Perfect Parts

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Germany . 6,747 parts In-Stock

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Microchip USA

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Benley Electronics

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Argo Parts USA

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Authorized Procurement Solutions

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Corphita

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ChipTracer

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Futuretech Components

Singapore . 789 parts In-Stock

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Metaverse IC Inc.

Canada . 726 parts In-Stock

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S.R.D Solutions

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Kepictronics

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GreenTree Electronics

Israel . 228 parts In-Stock

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Assy Fe

Spain . 220 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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Computer Components Inc. - USA

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Overview

Unlock the power of cutting-edge technology with Micron Technology's MT48LC16M16A2P-75:D DRAM module. Designed with precision and reliability in mind, this product is perfect for a wide range of applications, from industrial automation to telecommunications. Boasting a nominal supply voltage of 3.3V and a maximum clock frequency of 133MHz, this module delivers exceptional performance while maintaining low power consumption. Trust Micron Technology to provide you with the quality and innovation you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for portable devices.

Surface Mount: YES

Surface mounting allows for easy and efficient installation on circuit boards.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures data is transferred at a constant rate, improving overall performance.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage is common and widely supported in electronic devices.

Maximum Clock Frequency (fCLK): 133 MHz

High clock frequency allows for fast data processing and improved system performance.

No. of Words: 16777216 words

High number of words allows for large amounts of data to be stored and accessed efficiently.

Memory Width: 16

Wider memory width allows for faster data transfers and processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving energy efficiency.

Refresh Cycles: 8192

High number of refresh cycles ensures data integrity and reliability over long periods of use.

Maximum Access Time: 5.4 ns

Low access time allows for quick retrieval of data, improving system responsiveness.

Technical Specifications

DRAM MT48LC16M16A2P-75:D attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

FOUR BANK PAGE BURST

Maximum Access Time:

5.4 ns

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

133 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

1,2,4,8

JESD-30 Code:

R-PDSO-G54

JESD-609 Code:

e3

Length:

22.22 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

54

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

16MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP54,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Refresh Cycles:

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

1,2,4,8,FP

Maximum Standby Current:

.002 Amp

Sub-Category:

DRAMs

Maximum Supply Current:

125 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10.16 mm

Trade Compliance

MT48LC16M16A2P-75:D Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.24

SB

8542.32.00.15

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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