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K4B2G1646C-HCH9

Samsung

K4B2G1646C-HCH9 by Samsung

DDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 96; Package Code: FBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;

Median Price

$26.920

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

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Distributors (In-Stock)

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Component Electronics Inc.

Canada . 23 parts In-Stock

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$26.920

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$20.190

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$17.500

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Speed Components Ltd

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Prism Electronics

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Odintec Ltd.

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J2 Sourcing AB

Sweden . 70 parts In-Stock

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ACDS - Activité Composants Distribution Service

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Cyclops Electronics Ltd

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Nova Conductors

Japan . 10 parts In-Stock

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PC Components Company LLC

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Bristol Electronics

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Corohmni

South Africa . 1 parts In-Stock

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Ampacity Inc.

Singapore . 1,331 parts In-Stock

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RC Electronics

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Argo Parts USA

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Alle Elektronik GmbH

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Continental Prestige Electronics

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Assy Fe

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Cyclops Electronics Ltd (Excess)

UK . 956 parts In-Stock

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GreenTree Electronics

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Aranea Global

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Perfect Parts

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S.R.D Solutions

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ChipstoGo Electronic ltd

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Technical Specifications

DRAM K4B2G1646C-HCH9 attributes and parameters. Explore more DRAM devices from Samsung

Specs

Maximum Access Time:

.255 ns

Maximum Clock Frequency (fCLK):

667 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

4,8

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e1

Memory Density:

2147483648 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

96

No. of Words:

134217728 words

No. of Words Code:

128M

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Organization:

128MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,9X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5

Qualification:

Not Qualified

Refresh Cycles:

Sequential Burst Length:

4,8

Maximum Standby Current:

.012 Amp

Sub-Category:

DRAMs

Maximum Supply Current:

245 mA

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

K4B2G1646C-HCH9 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.36

SB

8542.32.00.23

Manufacturer Highlights

Samsung

Samsung Electronics Co., Ltd. engages in the consumer electronics, information technology and mobile communications, and device solutions businesses worldwide. The company offers smartphones, tablets, watches, and accessories; TVs, projectors, and sound devices; home appliances, including refrigerators, washing machines and dryers, vacuum cleaners, cooking appliances, dishwashers, air conditioners, and air purifiers; monitors, and memory and storage products; displays, and smart and LED signages; and other accessories. It also engages in technology, venture capital investments, cloud services, network devices installation and optimization, semiconductor equipment services, digital advertising platforms, marketing, consulting, connected services, logistics, financing, and software design activities; toll processing of display panels and semiconductors; development and sale of network solutions; manufactures semiconductors and food; provision of repair services for electronic devices and enterprise automation solutions; and development and supply of semiconductor process defect and quality control software. The company serves various industries, including education, retail, and finance, as well as government and corporate customers. Samsung Electronics Co., Ltd. was incorporated in 1969 and is based in Suwon-si, South Korea.

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