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MT48LC8M16A2P-6A:LTR

Micron Technology

MT48LC8M16A2P-6A:LTR by Micron Technology

Micron Technology's MT48LC8M16A2P-6A:LTR is a 8MX16 Synchronous DRAM with 134217728 bit memory density. Operating at 3.3V, it offers 5.4ns max access time and features self-refresh capability. Ideal for commercial applications requiring fast and reliable memory performance in a compact small outline package.

Median Price

$3.390

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,594 parts In-Stock

1+ parts

$6.430

100+ parts

$5.532

1k+ parts

$5.090

10k+ parts

$4.961

3,594

$6.430

$5.532

$5.090

$4.961

Mouser Electronics

USA . 1,460 parts In-Stock

1+ parts

$7.880

100+ parts

-

1k+ parts

-

10k+ parts

-

1,460

$7.880

-

-

-

EBV Elektronik

Germany . 14,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

14,000

-

-

-

-

Future Electronics

Canada . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.730

10,000

-

-

-

$2.730

Arrow

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$3.390

2,000

-

-

-

$3.390

Verical

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$3.390

2,000

-

-

-

$3.390

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 456 parts In-Stock

1+ parts

$1.012

100+ parts

-

1k+ parts

-

10k+ parts

-

456

$1.012

-

-

-

Nova Conductors

Japan . 21 parts In-Stock

1+ parts

$4.455

100+ parts

-

1k+ parts

-

10k+ parts

-

21

$4.455

-

-

-

IBS Electronics

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$5.180

20,000

-

-

-

$5.180

Vyrian

USA . 5,992 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,992

-

-

-

-

Chip Stock

USA . 4,224 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,224

-

-

-

-

NAC Semi

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$4.430

4,000

-

-

-

$4.430

Sensible Micro Corp

USA . 1,354 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,354

-

-

-

-

ComSIT Distribution GmbH

Germany . 618 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

618

-

-

-

-

ComSIT USA

USA . 618 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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618

-

-

-

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Connector Distribution Corp

USA . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Right Parts Inc.

USA . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Contempo Components LLC

USA . 2 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,293 parts In-Stock

1+ parts

$0.958

100+ parts

-

1k+ parts

-

10k+ parts

-

2,293

$0.958

-

-

-

Ampacity Inc.

Singapore . 6,493 parts In-Stock

1+ parts

$2.880

100+ parts

-

1k+ parts

-

10k+ parts

-

6,493

$2.880

-

-

-

Semicontronic

India . 6,097 parts In-Stock

1+ parts

$2.880

100+ parts

$2.808

1k+ parts

$2.794

10k+ parts

-

6,097

$2.880

$2.808

$2.794

-

Corohmni

South Africa . 1,132 parts In-Stock

1+ parts

$3.744

100+ parts

-

1k+ parts

-

10k+ parts

-

1,132

$3.744

-

-

-

Argo Parts USA

USA . 4,558 parts In-Stock

1+ parts

$4.455

100+ parts

-

1k+ parts

-

10k+ parts

-

4,558

$4.455

-

-

-

Continental Prestige Electronics

USA . 2,650 parts In-Stock

1+ parts

$4.455

100+ parts

-

1k+ parts

-

10k+ parts

$4.366

2,650

$4.455

-

-

$4.366

Aztec Data Supply Inc.

USA . 2,888 parts In-Stock

1+ parts

$5.210

100+ parts

-

1k+ parts

-

10k+ parts

-

2,888

$5.210

-

-

-

Andel Nordic

Denmark . 5,853 parts In-Stock

1+ parts

$8.925

100+ parts

-

1k+ parts

$8.568

10k+ parts

$8.568

5,853

$8.925

-

$8.568

$8.568

Perfect Parts

USA . 9,315 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,315

-

-

-

-

A-Z Elektronik GmbH

Germany . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,000

-

-

-

-

GreenTree Electronics

Israel . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,000

-

-

-

-

Authorized Procurement Solutions

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,500

-

-

-

-

S.R.D Solutions

India . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$4.366

1k+ parts

$4.232

10k+ parts

$4.143

2,000

-

$4.366

$4.232

$4.143

Advanced Electronics

New Zealand . 1,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,800

-

-

-

-

Kepictronics

USA . 542 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

542

-

-

-

-

Speed Components Ltd (Excess)

Israel . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Overview

Experience the superior quality and performance of Micron Technology's MT48LC8M16A2P-6A:LTR DRAM. With a commitment to excellence in manufacturing, Micron delivers reliable products that exceed industry standards. This versatile memory component is ideal for a wide range of applications, providing seamless operation and fast data access. Trust in Micron Technology for cutting-edge technology that enhances your devices' capabilities and offers unmatched value to customers looking for top-tier performance. Elevate your products with Micron Technology's MT48LC8M16A2P-6A:LTR DRAM today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards.

Package Shape: RECTANGULAR

The rectangular shape of the package offers efficient use of space on the PCB.

Operating Mode: SYNCHRONOUS

The synchronous operation ensures smooth and stable performance of the DRAM.

Self Refresh: YES

The self-refresh capability helps in saving power and maintaining data integrity during standby mode.

Nominal Supply Voltage: 3.3V

The 3.3V supply voltage ensures compatibility with a wide range of electronic devices.

No. of Terminals: 54

The 54 terminals provide sufficient connectivity options for seamless integration into circuits.

Package Style: SMALL OUTLINE, THIN PROFILE

The small outline and thin profile design allow for space-saving installation in compact devices.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in demanding environments.

Organization: 8MX16

The 8Mx16 organization offers a high memory capacity for storing large amounts of data efficiently.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the DRAM can function in a wide range of environments.

Terminal Finish: MATTE TIN

The matte tin finish provides excellent solderability for reliable connections.

Terminal Position: DUAL

The dual terminal position allows for flexibility in mounting and connection options.

Maximum Seated Height: 1.2 mm

The low maximum seated height enables installation in slim and compact form factors.

Width: 10.16 mm

The 10.16mm width offers a compact footprint for space-constrained designs.

Minimum Supply Voltage: 3V

The 3V minimum supply voltage ensures low power consumption for energy-efficient operation.

Maximum Time At Peak Reflow Temperature: 30s

The 30-second maximum time at peak reflow temperature ensures safe soldering during assembly.

Peak Reflow Temperature: 260C

The high peak reflow temperature allows for reliable soldering of the DRAM during manufacturing.

Length: 22.22 mm

The 22.22mm length provides a balanced form factor for easy integration with other components.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures compatibility with standard operating environments.

Access Mode: FOUR BANK PAGE BURST

The four bank page burst access mode enables fast and efficient data retrieval for high-performance applications.

Technology: CMOS

The CMOS technology delivers low power consumption and high-speed operation for enhanced performance.

Terminal Form: GULL WING

The gull wing terminal form offers secure and reliable connections for stable operation.

No. of Words: 8388608 words

The large number of words allows for extensive data storage and processing capabilities.

Memory Width: 16

The 16-bit memory width provides efficient data transfer rates for improved system performance.

Terminal Pitch: 0.8 mm

The 0.8mm terminal pitch allows for precise connections in compact spaces.

No. of Words Code: 8M

The 8M words code signifies the high memory capacity of the DRAM for storing vast amounts of data.

Maximum Supply Voltage: 3.6V

The 3.6V maximum supply voltage ensures compatibility with a variety of power sources.

Memory Density: 134217728 bit

The high memory density enables the storage of large datasets for intensive computing tasks.

Memory IC Type: SYNCHRONOUS DRAM

The synchronous DRAM type offers high-speed data processing and stable performance.

Maximum Access Time: 5.4 ns

The low maximum access time ensures quick retrieval of data for swift system operation.

Technical Specifications

DRAM MT48LC8M16A2P-6A:LTR attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

FOUR BANK PAGE BURST

Maximum Access Time:

5.4 ns

Additional Features:

AUTO/SELF REFRESH

JESD-30 Code:

R-PDSO-G54

JESD-609 Code:

e3

Length:

22.22 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

54

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

8MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10.16 mm

Trade Compliance

MT48LC8M16A2P-6A:LTR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.02

SB

8542.32.00.15

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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