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MT41K128M16JT-125:K

Micron Technology

MT41K128M16JT-125:K by Micron Technology

MT41K128M16JT-125:K by Micron Technology is a DDR3L DRAM with 128MX16 organization, operating at 800 MHz. It features a thin profile grid array package and consumes 195 mA max supply current. Ideal for applications requiring high-speed synchronous memory with common I/O type and self-refresh capability.

Median Price

$5.908

Lifecycle Status

Suppliers In-Stock

47

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 638 parts In-Stock

1+ parts

$8.840

100+ parts

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638

$8.840

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Element14

Singapore . 628 parts In-Stock

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$14.510

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$14.510

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Mouser Electronics

USA . 2,344 parts In-Stock

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$17.700

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$17.700

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Arrow

USA . 158,000 parts In-Stock

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$2.977

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Verical

USA . 144,000 parts In-Stock

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Future Electronics

Canada . 24,276 parts In-Stock

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$1.560

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$1.540

24,276

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$1.540

Avnet

USA . 14,688 parts In-Stock

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EBV Elektronik

Germany . 6,120 parts In-Stock

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IBS Electronics

USA . 24,201 parts In-Stock

1+ parts

$2.444

100+ parts

$2.202

1k+ parts

$2.187

10k+ parts

$2.179

24,201

$2.444

$2.202

$2.187

$2.179

Digiode

USA . 1,192 parts In-Stock

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$3.676

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Nova Conductors

Japan . 300 parts In-Stock

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$4.770

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$4.770

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Mobius Materials

USA . 54 parts In-Stock

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$13.257

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$10.621

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54

$13.257

$10.621

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Component Electronics Inc.

Canada . 560 parts In-Stock

1+ parts

$13.850

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$10.380

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$9.000

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560

$13.850

$10.380

$9.000

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Cyclops Electronics Ltd

UK . 60,914 parts In-Stock

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Lakeland Logistics Inc

USA . 20,000 parts In-Stock

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NAC Semi

USA . 18,239 parts In-Stock

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Chip Stock

USA . 17,600 parts In-Stock

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Component Sense

UK . 15,402 parts In-Stock

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Vyrian

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Sensible Micro Corp

USA . 5,565 parts In-Stock

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Dynamic Solutions

Germany . 4,000 parts In-Stock

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Rebound Electronics

UK . 3,342 parts In-Stock

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Dan-Mar Components

USA . 2,803 parts In-Stock

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Astute Electronics Inc

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Classic Components Corporation

USA . 1,832 parts In-Stock

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Elcom Components

USA . 1,082 parts In-Stock

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A2Z Electronics, Inc.

USA . 848 parts In-Stock

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Pegasus Components GmbH

Germany . 827 parts In-Stock

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ComSIT Distribution GmbH

Germany . 717 parts In-Stock

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Lantek

USA . 490 parts In-Stock

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BCID Electronics Ltd.

Israel . 408 parts In-Stock

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Netsource Technology, Inc.

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Inventory MP

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Prism Electronics

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Bristol Electronics

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Goldney Electronics S.L.

Spain . 33 parts In-Stock

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SPM Sales

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EMSNET

USA . 25 parts In-Stock

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Cogito LLC

Ukraine . 24 parts In-Stock

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Sunrise Surplus Inc.

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Connector Distribution Corp

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Right Parts Inc.

USA . 14 parts In-Stock

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LWI Electronics Inc

India . 10 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 8 parts In-Stock

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Semtec, LLC

USA . 7 parts In-Stock

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NexGen Digital

USA . 2 parts In-Stock

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USA . 1 parts In-Stock

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Semicontronic

India . 136,723 parts In-Stock

1+ parts

$1.790

100+ parts

$1.745

1k+ parts

$1.736

10k+ parts

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136,723

$1.790

$1.745

$1.736

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Corphita

USA . 637 parts In-Stock

1+ parts

$3.483

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$3.483

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Argo Parts USA

USA . 4,362 parts In-Stock

1+ parts

$4.254

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4,362

$4.254

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Aztec Data Supply Inc.

USA . 94 parts In-Stock

1+ parts

$4.261

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$4.261

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Advanced Electronics

New Zealand . 15,000 parts In-Stock

1+ parts

$4.465

100+ parts

$4.242

1k+ parts

$4.242

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15,000

$4.465

$4.242

$4.242

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Corohmni

South Africa . 1,164 parts In-Stock

1+ parts

$5.220

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1,164

$5.220

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Continental Prestige Electronics

USA . 2,336 parts In-Stock

1+ parts

$5.230

100+ parts

$3.760

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2,336

$5.230

$3.760

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Modulus Dynamics

Lithuania . 39 parts In-Stock

1+ parts

$5.295

100+ parts

$5.242

1k+ parts

$5.083

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39

$5.295

$5.242

$5.083

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Microchip USA

USA . 5,012 parts In-Stock

1+ parts

$16.350

100+ parts

$16.350

1k+ parts

$16.350

10k+ parts

$16.350

5,012

$16.350

$16.350

$16.350

$16.350

Infinite Electronics LLP (Excess)

. 439,237 parts In-Stock

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iBuyXS LLC

. 300,000 parts In-Stock

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Formix International (Excess)

India . 60,203 parts In-Stock

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Kepictronics

USA . 15,000 parts In-Stock

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Epart123

USA . 13,680 parts In-Stock

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$3.650

13,680

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$3.650

S.R.D Solutions

India . 13,469 parts In-Stock

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13,469

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GreenTree Electronics

Israel . 10,000 parts In-Stock

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RC Electronics

USA . 9,305 parts In-Stock

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$5.590

1k+ parts

$5.100

10k+ parts

$4.950

9,305

-

$5.590

$5.100

$4.950

Futuretech Components

Singapore . 4,000 parts In-Stock

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4,000

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Speed Components Ltd (Excess)

Israel . 924 parts In-Stock

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924

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iodParts Technologies Inc.

India . 549 parts In-Stock

1+ parts

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$2.328

1k+ parts

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549

-

$2.328

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Robosynatics

Brazil . 100 parts In-Stock

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100+ parts

$0.271

1k+ parts

$0.271

10k+ parts

$0.271

100

-

$0.271

$0.271

$0.271

Lucentia Tech

USA . 100 parts In-Stock

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$0.271

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$0.271

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$0.271

100

-

$0.271

$0.271

$0.271

Overview

Elevate your system's performance with the MT41K128M16JT-125:K by Micron Technology. As a leading manufacturer in the industry, Micron brings you top-quality DRAM products that deliver unparalleled reliability and speed. Whether you're enhancing your gaming experience or boosting your business operations, this DDR3L DRAM memory module is the perfect solution. With a low supply voltage of 1.35V and a maximum clock frequency of 800MHz, you'll enjoy efficient power usage and lightning-fast data processing. Upgrade to Micron Technology for cutting-edge technology that meets all your memory needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection of the DRAM chip within the package.

Surface Mount: YES

Being surface mountable makes installation easier and more efficient in electronic devices.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and coordination between the DRAM and other components, enhancing overall system performance.

Nominal Supply Voltage / Vsup (V): 1.35

The low nominal supply voltage of 1.35V helps in reducing power consumption and heat generation, improving energy efficiency.

Maximum Clock Frequency (fCLK): 800 MHz

The high maximum clock frequency of 800 MHz enables fast data transfer rates and smooth performance.

Memory IC Type: DDR3L DRAM

The use of DDR3L DRAM technology ensures reliable and high-speed memory functionality, ideal for various computing tasks.

Technical Specifications

DRAM MT41K128M16JT-125:K attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

MULTI BANK PAGE BURST

Maximum Access Time:

.225 ns

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

800 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

8

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e1

Length:

14 mm

Memory Density:

2147483648 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

96

No. of Words:

134217728 words

No. of Words Code:

128M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Organization:

128MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,9X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.35

Qualification:

Not Qualified

Refresh Cycles:

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

8

Maximum Standby Current:

.012 Amp

Sub-Category:

DRAMs

Maximum Supply Current:

195 mA

Maximum Supply Voltage (Vsup):

1.45 V

Minimum Supply Voltage (Vsup):

1.283 V

Nominal Supply Voltage / Vsup (V):

1.35

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

MT41K128M16JT-125:K Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.36

SB

8542.32.00.23

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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