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MT41K128M16JT-125XIT:KTR

Micron Technology

MT41K128M16JT-125XIT:KTR by Micron Technology

Micron Technology's MT41K128M16JT-125XIT:KTR is a DDR3L DRAM with 128MX16 organization, operating at up to 800 MHz. It features synchronous operation, self-refresh capability, and common I/O type. Suitable for applications requiring high-speed memory access in devices such as servers, PCs, and networking equipment.

Median Price

$7.428

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 874 parts In-Stock

1+ parts

$10.090

100+ parts

$8.000

1k+ parts

$7.270

10k+ parts

$6.970

874

$10.090

$8.000

$7.270

$6.970

Future Electronics

Canada . 20,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$5.510

20,000

-

-

-

$5.510

Arrow

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$7.272

10,000

-

-

-

$7.272

Verical

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$7.583

10,000

-

-

-

$7.583

EBV Elektronik

Germany . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$7.850

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$7.850

-

-

-

Digiode

USA . 2,071 parts In-Stock

1+ parts

$9.586

100+ parts

-

1k+ parts

-

10k+ parts

-

2,071

$9.586

-

-

-

Chip Stock

USA . 19,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19,200

-

-

-

-

IBS Electronics

USA . 11,424 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$188.776

10k+ parts

-

11,424

-

-

$188.776

-

Vyrian

USA . 4,776 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,776

-

-

-

-

NAC Semi

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$10.960

2,000

-

-

-

$10.960

ComSIT Distribution GmbH

Germany . 506 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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506

-

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-

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Speed Components Ltd

Israel . 15 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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15

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 4,430 parts In-Stock

1+ parts

$5.380

100+ parts

$5.246

1k+ parts

$5.219

10k+ parts

-

4,430

$5.380

$5.246

$5.219

-

Ampacity Inc.

Singapore . 4,984 parts In-Stock

1+ parts

$5.930

100+ parts

-

1k+ parts

-

10k+ parts

-

4,984

$5.930

-

-

-

Continental Prestige Electronics

USA . 6,837 parts In-Stock

1+ parts

$7.850

100+ parts

-

1k+ parts

-

10k+ parts

$7.693

6,837

$7.850

-

-

$7.693

Netroflash

USA . 50 parts In-Stock

1+ parts

$7.850

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$7.850

-

-

-

Corphita

USA . 2,450 parts In-Stock

1+ parts

$9.081

100+ parts

-

1k+ parts

-

10k+ parts

-

2,450

$9.081

-

-

-

Component Stockers USA

USA . 1,542 parts In-Stock

1+ parts

$9.480

100+ parts

$7.530

1k+ parts

$6.840

10k+ parts

-

1,542

$9.480

$7.530

$6.840

-

QUARKTWIN TECHNOLOGY LTD

USA . 10,787 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10,787

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-

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Perfect Parts

USA . 8,960 parts In-Stock

1+ parts

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100+ parts

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8,960

-

-

-

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GreenTree Electronics

Israel . 2,000 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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2,000

-

-

-

-

Argo Parts USA

USA . 1,934 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,934

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-

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Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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500

-

-

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Robosynatics

Brazil . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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100

-

-

-

-

Overview

Experience the superior quality and reliability of Micron Technology with the MT41K128M16JT-125XIT:KTR DDR3L DRAM module. Ideal for a wide range of applications, this memory module offers seamless performance with its synchronous operation and self-refresh capability. With a compact design and fine pitch package, this module is perfect for space-constrained environments. Trust Micron Technology to deliver exceptional value and benefits with their cutting-edge memory solutions. Elevate your system's performance today with the MT41K128M16JT-125XIT:KTR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the DRAM, ensuring reliable performance over time.

Surface Mount: YES

Surface mount technology makes installation and assembly of the DRAM easier and more efficient.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures that data is transferred at a consistent rate, leading to improved overall system performance.

Nominal Supply Voltage / Vsup (V): 1.35

This low supply voltage helps in reducing power consumption and heat generation, making the DRAM energy-efficient.

Maximum Operating Temperature: 95 °C

The high maximum operating temperature range ensures stability and performance in varying environmental conditions.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers high speed and low power consumption, making the DRAM ideal for a wide range of applications.

Memory IC Type: DDR3L DRAM

DDR3L DRAM technology provides high-speed and efficient memory access for improved system responsiveness.

Technical Specifications

DRAM MT41K128M16JT-125XIT:KTR attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

MULTI BANK PAGE BURST

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

800 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

8

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e1

Length:

14 mm

Memory Density:

2147483648 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

96

No. of Words:

134217728 words

No. of Words Code:

128M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,9X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Refresh Cycles:

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

8

Maximum Supply Current:

195 mA

Maximum Supply Voltage (Vsup):

1.45 V

Minimum Supply Voltage (Vsup):

1.283 V

Nominal Supply Voltage / Vsup (V):

1.35

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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