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MT41K256M16TW-107IT:P

Micron Technology

MT41K256M16TW-107IT:P by Micron Technology

Micron Technology's MT41K256M16TW-107IT:P is a DDR3L DRAM with 256MX16 organization, operating at 1.35V. It features synchronous mode, self-refresh capability, and multi-bank page burst access. Ideal for applications requiring high memory density and fast data processing speeds.

Median Price

$5.280

Lifecycle Status

Suppliers In-Stock

39

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,921 parts In-Stock

1+ parts

$5.280

100+ parts

$4.540

1k+ parts

$4.150

10k+ parts

-

3,921

$5.280

$4.540

$4.150

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Newark

USA . 132 parts In-Stock

1+ parts

$5.280

100+ parts

$4.540

1k+ parts

$4.290

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132

$5.280

$4.540

$4.290

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Element14

Singapore . 186 parts In-Stock

1+ parts

$8.376

100+ parts

$6.737

1k+ parts

$6.145

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186

$8.376

$6.737

$6.145

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Farnell

UK . 1,161 parts In-Stock

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$16.250

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Arrow

USA . 590,000 parts In-Stock

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$4.239

590,000

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EBV Elektronik

Germany . 121,176 parts In-Stock

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Verical

USA . 111,896 parts In-Stock

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Edge Electronics

USA . 2,124 parts In-Stock

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WPG Americas

USA . 2,000 parts In-Stock

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Tomark Electronics Ltd

UK . 2,000 parts In-Stock

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$3.540

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$3.540

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Digiode

USA . 493 parts In-Stock

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$4.208

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493

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Nova Conductors

Japan . 650 parts In-Stock

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$8.038

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650

$8.038

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Cyclops Electronics Ltd

UK . 77,535 parts In-Stock

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Component Sense

UK . 66,159 parts In-Stock

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Touchstone Systems

USA . 43,058 parts In-Stock

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Vyrian

USA . 39,873 parts In-Stock

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Semtec, LLC

USA . 10,191 parts In-Stock

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IBS Electronics

USA . 10,000 parts In-Stock

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K-1 Technologies

USA . 5,200 parts In-Stock

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Dynamic Solutions

Germany . 4,000 parts In-Stock

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Martec Srl

Italy . 3,672 parts In-Stock

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Sensible Micro Corp

USA . 3,672 parts In-Stock

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Chip Stock

USA . 3,500 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,446 parts In-Stock

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Electronic Treasures

USA . 1,998 parts In-Stock

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NAC Semi

USA . 1,827 parts In-Stock

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1,827

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Global Solutions Electronics Company

USA . 999 parts In-Stock

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ComSIT USA

USA . 854 parts In-Stock

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Avant Electronics Limited

UK . 563 parts In-Stock

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Atlantic Semiconductor

USA . 489 parts In-Stock

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ComSIT Distribution GmbH

Germany . 110 parts In-Stock

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Bristol Electronics

USA . 61 parts In-Stock

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BCID Electronics Ltd.

Israel . 45 parts In-Stock

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Inventory MP

USA . 42 parts In-Stock

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PC Components Company LLC

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A&K Electronics

USA . 9 parts In-Stock

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LWI Electronics Inc

India . 5 parts In-Stock

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5

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Carlin Systems, Inc.

USA . 4 parts In-Stock

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4

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NexGen Digital

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 24,918 parts In-Stock

1+ parts

$2.320

100+ parts

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24,918

$2.320

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Semicontronic

India . 227,842 parts In-Stock

1+ parts

$2.930

100+ parts

$2.857

1k+ parts

$2.842

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227,842

$2.930

$2.857

$2.842

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Ampacity Inc.

Singapore . 83,391 parts In-Stock

1+ parts

$3.600

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83,391

$3.600

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Corphita

USA . 231 parts In-Stock

1+ parts

$3.987

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231

$3.987

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Corohmni

South Africa . 233 parts In-Stock

1+ parts

$5.830

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$5.830

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Continental Prestige Electronics

USA . 8,693 parts In-Stock

1+ parts

$7.690

100+ parts

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10k+ parts

$7.536

8,693

$7.690

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$7.536

Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

$8.038

100+ parts

$7.636

1k+ parts

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10k+ parts

$7.154

300

$8.038

$7.636

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$7.154

CoreStaff

Japan . 1,224 parts In-Stock

1+ parts

$14.935

100+ parts

$9.867

1k+ parts

$9.854

10k+ parts

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1,224

$14.935

$9.867

$9.854

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Perfect Parts

USA . 39,803 parts In-Stock

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Infinite Electronics LLP (Excess)

. 39,568 parts In-Stock

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A-Z Elektronik GmbH

Germany . 21,331 parts In-Stock

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ChipstoGo Electronic ltd

UK . 20,000 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 19,021 parts In-Stock

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S.R.D Solutions

India . 17,568 parts In-Stock

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17,568

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Glotronic Ltd.

UK . 16,072 parts In-Stock

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GreenTree Electronics

Israel . 8,000 parts In-Stock

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Computer Components Inc. - USA

USA . 7,760 parts In-Stock

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7,760

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RC Electronics

USA . 6,980 parts In-Stock

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EMSNET (Excess)

USA . 6,000 parts In-Stock

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Epart123

USA . 5,472 parts In-Stock

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$4.600

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$4.600

5,472

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$4.600

$4.600

Robosynatics

Brazil . 5,000 parts In-Stock

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Kepictronics

USA . 4,000 parts In-Stock

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Formix International (Excess)

India . 3,634 parts In-Stock

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3,634

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Argo Parts USA

USA . 2,478 parts In-Stock

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2,478

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Legend Electronics Inc. (Excess)

USA . 2,364 parts In-Stock

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2,364

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iodParts Technologies Inc.

India . 1,776 parts In-Stock

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1,776

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Authorized Procurement Solutions

USA . 988 parts In-Stock

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988

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Futuretech Components

Singapore . 600 parts In-Stock

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600

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Overview

Discover the unparalleled quality and innovation of Micron Technology with the MT41K256M16TW-107IT:P, a cutting-edge DDR3L DRAM module. This memory solution offers seamless synchronous operation, self-refresh capabilities, and a nominal supply voltage of just 1.35V, making it ideal for a wide range of applications. With a compact and durable package design, this memory module provides exceptional performance and reliability. Upgrade your systems with Micron's MT41K256M16TW-107IT:P for faster speeds, improved efficiency, and unmatched value. Elevate your technology experience today!

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

This material is durable and lightweight, making the product easy to handle and resistant to damage.

Surface Mount : YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and effort.

Operating Mode : SYNCHRONOUS

Synchronous operation ensures that data is transferred at precise intervals, improving overall performance.

Nominal Supply Voltage / Vsup (V) : 1.35

The low nominal supply voltage helps in reducing power consumption without compromising on performance.

Organization : 256MX16

This organization allows for high density memory storage and efficient data retrieval.

Technology : CMOS

CMOS technology provides low power consumption and fast switching speeds, enhancing overall efficiency.

Memory IC Type : DDR3L DRAM

DDR3L DRAM offers high-speed operation and improved bandwidth, making it suitable for demanding applications.

Technical Specifications

DRAM MT41K256M16TW-107IT:P attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

MULTI BANK PAGE BURST

Maximum Access Time:

20 ns

Additional Features:

AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY

JESD-30 Code:

R-PBGA-B96

Length:

14 mm

Memory Density:

4294967296 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

96

No. of Words:

268435456 words

No. of Words Code:

256M

Operating Mode:

SYNCHRONOUS

Organization:

256MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Maximum Supply Voltage (Vsup):

1.45 V

Minimum Supply Voltage (Vsup):

1.283 V

Nominal Supply Voltage / Vsup (V):

1.35

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

MT41K256M16TW-107IT:P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.36

SB

8542.32.00.23

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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