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MT41K128M16JT-125AIT:K

Micron Technology

MT41K128M16JT-125AIT:K by Micron Technology

Micron Technology's MT41K128M16JT-125AIT:K is a DDR3L DRAM with 128MX16 organization, operating at 800 MHz. It features a thin profile grid array package and operates in industrial temperature range. Ideal for applications requiring high-speed synchronous memory with common I/O type and self-refresh capability.

Median Price

$10.780

Lifecycle Status

Suppliers In-Stock

21

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1,221 parts In-Stock

1+ parts

$10.780

100+ parts

-

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1,221

$10.780

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Mouser Electronics

USA . 151 parts In-Stock

1+ parts

$12.280

100+ parts

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151

$12.280

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Newark

USA . 21 parts In-Stock

1+ parts

$14.220

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21

$14.220

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Element14

Singapore . 1,221 parts In-Stock

1+ parts

$17.680

100+ parts

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1,221

$17.680

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Arrow

USA . 26,000 parts In-Stock

1+ parts

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10k+ parts

$3.637

26,000

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$3.637

Verical

USA . 26,000 parts In-Stock

1+ parts

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$3.637

26,000

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$3.637

Future Electronics

Canada . 6,120 parts In-Stock

1+ parts

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$2.860

10k+ parts

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6,120

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-

$2.860

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,017 parts In-Stock

1+ parts

$4.228

100+ parts

-

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2,017

$4.228

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$6.841

100+ parts

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100

$6.841

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IBS Electronics

USA . 32,000 parts In-Stock

1+ parts

-

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$8.163

32,000

-

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$8.163

Famous Connections Ltd

Bulgaria . 26,000 parts In-Stock

1+ parts

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26,000

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Chip Stock

USA . 17,900 parts In-Stock

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17,900

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Vyrian

USA . 8,106 parts In-Stock

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NAC Semi

USA . 4,925 parts In-Stock

1+ parts

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$4.640

4,925

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$4.640

Cyclops Electronics Ltd

UK . 4,798 parts In-Stock

1+ parts

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4,798

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Component Sense

UK . 3,457 parts In-Stock

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3,457

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Inventory MP

USA . 1,172 parts In-Stock

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1,172

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Bristol Electronics

USA . 1,172 parts In-Stock

1+ parts

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1,172

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NexGen Digital

USA . 999 parts In-Stock

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999

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Electronic Treasures

USA . 338 parts In-Stock

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338

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PC Components Company LLC

USA . 48 parts In-Stock

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48

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 7,713 parts In-Stock

1+ parts

$3.090

100+ parts

$3.013

1k+ parts

$2.997

10k+ parts

-

7,713

$3.090

$3.013

$2.997

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Corohmni

South Africa . 245 parts In-Stock

1+ parts

$3.416

100+ parts

-

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245

$3.416

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Corphita

USA . 520 parts In-Stock

1+ parts

$4.005

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520

$4.005

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Aztec Data Supply Inc.

USA . 4,826 parts In-Stock

1+ parts

$5.576

100+ parts

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4,826

$5.576

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Continental Prestige Electronics

USA . 3,166 parts In-Stock

1+ parts

$5.980

100+ parts

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10k+ parts

$5.860

3,166

$5.980

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-

$5.860

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$6.841

100+ parts

-

1k+ parts

$6.499

10k+ parts

$6.362

1,000

$6.841

-

$6.499

$6.362

Microchip USA

USA . 2,078 parts In-Stock

1+ parts

$18.228

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2,078

$18.228

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Kepictronics

USA . 20,000 parts In-Stock

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Perfect Parts

USA . 19,451 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,500 parts In-Stock

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7,500

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Infinite Electronics LLP (Excess)

. 3,849 parts In-Stock

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3,849

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Argo Parts USA

USA . 2,227 parts In-Stock

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2,227

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GreenTree Electronics

Israel . 2,000 parts In-Stock

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2,000

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Speed Components Ltd (Excess)

Israel . 2,000 parts In-Stock

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2,000

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Futuretech Components

Singapore . 800 parts In-Stock

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800

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Formix International (Excess)

India . 676 parts In-Stock

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676

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Robosynatics

Brazil . 500 parts In-Stock

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500

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S.R.D Solutions

India . 440 parts In-Stock

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440

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Overview

Experience unparalleled performance and reliability with the MT41K128M16JT-125AIT:K by Micron Technology. As a leading manufacturer in the industry, Micron Technology delivers high-quality DRAM products that excel in various applications. This DDR3L DRAM memory module offers customers exceptional value with its advanced features, including a maximum clock frequency of 800 MHz and a refresh cycle of 8192, ensuring smooth and efficient operations. Trust Micron Technology to provide cutting-edge solutions for your memory needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the DRAM, ensuring it can withstand various operating conditions.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for efficient data transfer and synchronization with other components in the system.

Nominal Supply Voltage / Vsup (V): 1.35

Optimal supply voltage for stable and reliable performance of the DRAM.

Maximum Clock Frequency (fCLK): 800 MHz

High clock frequency enables fast data access and processing speed, making it ideal for demanding applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, enhancing efficiency and performance.

Technical Specifications

DRAM MT41K128M16JT-125AIT:K attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

MULTI BANK PAGE BURST

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

800 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

8

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e1

Length:

14 mm

Memory Density:

2147483648 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

96

No. of Words:

134217728 words

No. of Words Code:

128M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,9X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.35

Qualification:

Not Qualified

Refresh Cycles:

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

8

Maximum Standby Current:

.012 Amp

Sub-Category:

DRAMs

Maximum Supply Current:

195 mA

Maximum Supply Voltage (Vsup):

1.45 V

Minimum Supply Voltage (Vsup):

1.283 V

Nominal Supply Voltage / Vsup (V):

1.35

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

MT41K128M16JT-125AIT:K Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.36

SB

8542.32.00.23

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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