Loading...

S70KL1282DPBHA023

Infineon Technologies

S70KL1282DPBHA023 by Infineon Technologies

Infineon's S70KL1282DPBHA023 is a 16MX8 DRAM with 200 MHz clock frequency, operating at 3.6V max voltage. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for automotive applications due to AEC-Q100 screening level and very thin profile grid array package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 5,373 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,373

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 5,373 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,373

-

-

-

-

Vyrian

USA . 5,181 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,181

-

-

-

-

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

150

-

-

-

-

Digiode

USA . 4 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 3,216 parts In-Stock

1+ parts

$3.985

100+ parts

$3.826

1k+ parts

$3.666

10k+ parts

-

3,216

$3.985

$3.826

$3.666

-

Ampacity Inc.

Singapore . 5,001 parts In-Stock

1+ parts

$6.000

100+ parts

-

1k+ parts

-

10k+ parts

-

5,001

$6.000

-

-

-

Microchip USA

USA . 5,458 parts In-Stock

1+ parts

$23.030

100+ parts

-

1k+ parts

-

10k+ parts

-

5,458

$23.030

-

-

-

Argo Parts USA

USA . 4,201 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,201

-

-

-

-

Continental Prestige Electronics

USA . 2,239 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,239

-

-

-

-

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Corphita

USA . 392 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

392

-

-

-

-

Overview

Experience unparalleled performance and reliability with the S70KL1282DPBHA023 by Infineon Technologies. As a leading manufacturer in the industry, Infineon is known for producing top-quality DRAM products that excel in various applications. This high-performance memory module offers exceptional value to customers with its advanced features and benefits, including a compact design, low power consumption, and fast clock frequency. Whether you're looking to enhance the performance of your electronics or streamline your data processing, the S70KL1282DPBHA023 is the perfect solution for all your memory needs. Experience the difference with Infineon.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the DRAM, ensuring long-lasting performance.

Surface Mount: YES

Ease of installation and integration into electronic devices.

Screening Level: AEC-Q100

Ensures high reliability and quality standards, suitable for automotive applications.

Package Shape: RECTANGULAR

Efficient use of space and easy integration into circuit boards.

Operating Mode: SYNCHRONOUS

Allows for synchronized data transfers, enhancing overall system performance.

Self Refresh: YES

Helps in conserving power and maintaining data integrity during standby periods.

Nominal Supply Voltage / Vsup (V): 3

Standard voltage supply for compatibility with a wide range of systems.

No. of Terminals: 24

Sufficient number of terminals for data transfer and connectivity.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE

Compact and space-saving design for modern electronic devices.

Maximum Operating Temperature: 85 °C

Suitable for a wide range of operating environments.

Organization: 16MX8

16 megabits organized into 8 data bits for efficient data storage and retrieval.

Output Characteristics: 3-STATE

Enables high-speed data output and flexibility in controlling data flow.

Minimum Operating Temperature: -40 °C

Ability to perform reliably in extreme cold conditions.

Terminal Position: BOTTOM

Facilitates easy connection and installation in circuit boards.

Maximum Seated Height: 1 mm

Low profile design for slim electronic devices and space-constrained applications.

Maximum Clock Frequency (fCLK): 200 MHz

High clock frequency for fast data processing and transfer speeds.

Width: 6 mm

Compact width for efficient use of space in electronic devices.

Minimum Supply Voltage (Vsup): 2.7 V

Wide range of supply voltage for flexibility in system design.

Length: 8 mm

Optimal length for compact electronic device designs.

Technology: CMOS

Advanced CMOS technology for low power consumption and high performance.

Terminal Form: BALL

Ball terminal form for reliable and secure connections.

Maximum Supply Current: 60 mA

Moderate supply current for power-efficient operation.

No. of Words: 16777216 words

Large storage capacity for storing a vast amount of data.

Memory Width: 8

8-bit memory width for efficient data handling.

Terminal Pitch: 1 mm

Optimal terminal pitch for easy installation and connections.

No. of Words Code: 16M

16 million words code for easy identification and integration.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level for reliable performance in diverse environments.

Maximum Supply Voltage (Vsup): 3.6 V

Safe maximum voltage supply to prevent damage to the DRAM.

Memory Density: 134217728 bit

High memory density for storing large amounts of data.

Memory IC Type: HYPERRAM

Advanced memory IC type for superior performance and data processing.

Maximum Standby Current: 0.0005 Amp

Low standby current for power efficiency during idle periods.

Technical Specifications

DRAM S70KL1282DPBHA023 attributes and parameters. Explore more DRAM devices from Infineon Technologies

Specs

Maximum Clock Frequency (fCLK):

200 MHz

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B24

Length:

8 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

24

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA24,5X5,40

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Self Refresh:

YES

Maximum Standby Current:

.0005 Amp

Maximum Supply Current:

60 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

6 mm

Trade Compliance

S70KL1282DPBHA023 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.02

SB

8542.32.00.15

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19