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S70KS1282GABHV020

Infineon Technologies

S70KS1282GABHV020 by Infineon Technologies

Infineon's S70KS1282GABHV020 is a 16MX8 DRAM with 200 MHz clock frequency, 1.8V supply voltage, and 105°C operating temp. Ideal for applications requiring high-speed synchronous memory in compact devices due to its low profile grid array package and common I/O type.

Median Price

$6.060

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 338 parts In-Stock

1+ parts

$5.820

100+ parts

-

1k+ parts

-

10k+ parts

-

338

$5.820

-

-

-

Newark

USA . 158 parts In-Stock

1+ parts

$5.920

100+ parts

$5.270

1k+ parts

$5.220

10k+ parts

-

158

$5.920

$5.270

$5.220

-

Arrow

USA . 103 parts In-Stock

1+ parts

$6.199

100+ parts

$5.053

1k+ parts

$4.804

10k+ parts

$4.694

103

$6.199

$5.053

$4.804

$4.694

Mouser Electronics

USA . 741 parts In-Stock

1+ parts

$6.610

100+ parts

$5.530

1k+ parts

$5.300

10k+ parts

$5.220

741

$6.610

$5.530

$5.300

$5.220

DigiKey

USA . 602 parts In-Stock

1+ parts

$6.610

100+ parts

$5.687

1k+ parts

$5.308

10k+ parts

$5.229

602

$6.610

$5.687

$5.308

$5.229

Element14

Singapore . 122 parts In-Stock

1+ parts

$7.900

100+ parts

$6.780

1k+ parts

$6.510

10k+ parts

-

122

$7.900

$6.780

$6.510

-

Rochester

USA . 1,701 parts In-Stock

1+ parts

-

100+ parts

$3.860

1k+ parts

$3.450

10k+ parts

$3.250

1,701

-

$3.860

$3.450

$3.250

Verical

USA . 778 parts In-Stock

1+ parts

-

100+ parts

$4.825

1k+ parts

$4.313

10k+ parts

$4.063

778

-

$4.825

$4.313

$4.063

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 573 parts In-Stock

1+ parts

$3.705

100+ parts

-

1k+ parts

-

10k+ parts

-

573

$3.705

-

-

-

Nova Conductors

Japan . 76 parts In-Stock

1+ parts

$6.880

100+ parts

-

1k+ parts

-

10k+ parts

-

76

$6.880

-

-

-

Flip Electronics

USA . 338 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

338

-

-

-

-

Vyrian

USA . 143 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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143

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 282 parts In-Stock

1+ parts

$2.261

100+ parts

-

1k+ parts

-

10k+ parts

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282

$2.261

-

-

-

Ampacity Inc.

Singapore . 43 parts In-Stock

1+ parts

$3.310

100+ parts

-

1k+ parts

-

10k+ parts

-

43

$3.310

-

-

-

Corphita

USA . 964 parts In-Stock

1+ parts

$3.510

100+ parts

-

1k+ parts

-

10k+ parts

-

964

$3.510

-

-

-

Modulus Dynamics

Lithuania . 1,689 parts In-Stock

1+ parts

$4.055

100+ parts

$3.893

1k+ parts

$3.731

10k+ parts

-

1,689

$4.055

$3.893

$3.731

-

Aztec Data Supply Inc.

USA . 262 parts In-Stock

1+ parts

$4.617

100+ parts

-

1k+ parts

-

10k+ parts

-

262

$4.617

-

-

-

Continental Prestige Electronics

USA . 5,568 parts In-Stock

1+ parts

$6.840

100+ parts

-

1k+ parts

-

10k+ parts

$6.703

5,568

$6.840

-

-

$6.703

Netroflash

USA . 50 parts In-Stock

1+ parts

$6.880

100+ parts

-

1k+ parts

$6.536

10k+ parts

$6.398

50

$6.880

-

$6.536

$6.398

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

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Argo Parts USA

USA . 1,199 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,199

-

-

-

-

Robosynatics

Brazil . 495 parts In-Stock

1+ parts

-

100+ parts

$2.682

1k+ parts

$2.628

10k+ parts

$2.628

495

-

$2.682

$2.628

$2.628

Lucentia Tech

USA . 495 parts In-Stock

1+ parts

-

100+ parts

$2.682

1k+ parts

$2.628

10k+ parts

$2.628

495

-

$2.682

$2.628

$2.628

GreenTree Electronics

Israel . 89 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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89

-

-

-

-

Overview

Elevate your electronic devices to the next level with the S70KS1282GABHV020 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality DRAM products that guarantee optimal performance and reliability. This cutting-edge memory module boasts a wide range of applications, from smartphones to IoT devices, ensuring seamless operation and faster data processing. Experience the value of enhanced speed, efficiency, and storage capacity with this innovative product. Upgrade your technology with the best in the market - choose Infineon.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

The surface mount feature allows for easy and secure installation on circuit boards.

Package Shape: RECTANGULAR

The rectangular shape makes it compatible with standard PCB layouts.

Operating Mode: SYNCHRONOUS

The synchronous operation ensures synchronized data transfer for improved performance.

Self Refresh: YES

Self refresh capability helps in conserving power and enhancing overall efficiency.

Input/Output Type: COMMON

Common input/output type allows for easy integration with other components in the system.

Nominal Supply Voltage / Vsup (V): 1.8

The nominal supply voltage of 1.8V offers a balance between performance and power consumption.

No. of Terminals: 24

The 24 terminals provide ample connectivity options for versatile applications.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE

The grid array, very thin profile package style saves space and enables high-density mounting.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range ensures reliable performance in various environmental conditions.

Organization: 16MX8

The organization of 16MX8 allows for efficient data storage and retrieval.

Output Characteristics: 3-STATE

The 3-STATE output characteristics offer flexibility in controlling the output signal.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures operational reliability in extreme cold conditions.

Terminal Position: BOTTOM

The bottom terminal position simplifies board layout and assembly processes.

Maximum Seated Height: 1 mm

The low maximum seated height enables compact designs and stacking options.

Maximum Clock Frequency (fCLK): 200 MHz

The high maximum clock frequency supports fast data processing and transfer speeds.

Width: 6 mm

The 6mm width allows for easy integration into various system designs.

Minimum Supply Voltage (Vsup): 1.7 V

The minimum supply voltage of 1.7V ensures compatibility with a wide range of power sources.

Length: 8 mm

The 8mm length provides a compact footprint for space-constrained applications.

Technology: CMOS

The CMOS technology offers low power consumption and high speed.

Terminal Form: BALL

The ball terminal form provides reliable connections for enhanced durability.

Maximum Supply Current: 50 mA

The maximum supply current of 50mA ensures efficient power usage.

No. of Words: 16777216 words

The high number of words allows for large data storage capacity.

Memory Width: 8

The memory width of 8 enhances data processing capabilities.

Terminal Pitch: 1 mm

The 1mm terminal pitch simplifies board layout and assembly processes.

No. of Words Code: 16M

The 16M words code extends memory capacity for data-intensive applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 ensures protection from moisture damage during storage and handling.

Maximum Supply Voltage (Vsup): 2 V

The maximum supply voltage of 2V provides a safe operating range for the product.

Memory Density: 134217728 bit

The high memory density allows for storing a large amount of data in a compact form.

Memory IC Type: HYPERRAM

The use of HyperRAM technology offers fast and efficient memory access.

Maximum Standby Current: 0.00066 Amp

The low maximum standby current helps in conserving power during idle periods.

Technical Specifications

DRAM S70KS1282GABHV020 attributes and parameters. Explore more DRAM devices from Infineon Technologies

Specs

Maximum Clock Frequency (fCLK):

200 MHz

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B24

Length:

8 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

24

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA24,5X5,40

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Self Refresh:

YES

Maximum Standby Current:

.00066 Amp

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

2 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

6 mm

Trade Compliance

S70KS1282GABHV020 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.02

SB

8542.32.00.15

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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