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S27KL0642DPBHI023

Infineon Technologies

S27KL0642DPBHI023 by Infineon Technologies

Infineon Technologies' S27KL0642DPBHI023 is a 8MX8 CMOS DRAM with synchronous operation and self-refresh capability. It has a max clock frequency of 166 MHz and a memory density of 67108864 bit. This memory IC type, known as HYPERRAM, is commonly used in applications requiring high-speed data storage and retrieval.

Median Price

$3.364

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,732 parts In-Stock

1+ parts

$4.090

100+ parts

$3.530

1k+ parts

$3.260

10k+ parts

$3.210

3,732

$4.090

$3.530

$3.260

$3.210

DigiKey

USA . 3,399 parts In-Stock

1+ parts

$4.090

100+ parts

$3.530

1k+ parts

$3.250

10k+ parts

$3.142

3,399

$4.090

$3.530

$3.250

$3.142

Rochester

USA . 14,800 parts In-Stock

1+ parts

-

100+ parts

$2.360

1k+ parts

$2.110

10k+ parts

$1.980

14,800

-

$2.360

$2.110

$1.980

Verical

USA . 14,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.638

10k+ parts

$2.475

14,800

-

-

$2.638

$2.475

Flip Electronics (Authorized)

USA . 9,382 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,382

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 675 parts In-Stock

1+ parts

$2.366

100+ parts

-

1k+ parts

-

10k+ parts

-

675

$2.366

-

-

-

Flip Electronics

USA . 152,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

152,500

-

-

-

-

TME

Poland . 20,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$3.868

20,000

-

-

-

$3.868

Vyrian

USA . 3,445 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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-

3,445

-

-

-

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Nova Conductors

Japan . 16 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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16

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 5,748 parts In-Stock

1+ parts

$1.800

100+ parts

-

1k+ parts

-

10k+ parts

-

5,748

$1.800

-

-

-

Corphita

USA . 105 parts In-Stock

1+ parts

$2.241

100+ parts

-

1k+ parts

-

10k+ parts

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105

$2.241

-

-

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Modulus Dynamics

Lithuania . 2,743 parts In-Stock

1+ parts

$3.229

100+ parts

$3.100

1k+ parts

$2.971

10k+ parts

-

2,743

$3.229

$3.100

$2.971

-

QUARKTWIN TECHNOLOGY LTD

USA . 6,392 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,392

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Continental Prestige Electronics

USA . 5,431 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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5,431

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Argo Parts USA

USA . 300 parts In-Stock

1+ parts

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100+ parts

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300

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Bastille Electronics

Australia . 217 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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217

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-

-

Overview

Discover the power of advanced technology with the S27KL0642DPBHI023 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies is known for its exceptional quality and innovation. This DRAM memory module offers unparalleled performance and reliability, making it a top choice for various applications. With its synchronous operating mode and self-refresh capabilities, this product ensures optimal efficiency and seamless data processing. Whether you're a gamer, professional, or tech enthusiast, the S27KL0642DPBHI023 delivers unmatched value, benefits, and advantages that enhance your experience. Trust Infineon Technologies for cutting-edge solutions that elevate your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product has a package made of plastic/epoxy material, which provides durability and protection to the components, making it a reliable choice for long-lasting performance.

Surface Mount: YES

With surface mount capability, this product can be easily mounted onto PCBs, allowing for efficient integration into various electronic devices.

No. of Functions: 1

This product offers a single function, ensuring simplicity and ease of use for specific applications.

Package Shape: RECTANGULAR

The rectangular package shape of this product enables secure and compact installation in electronic systems, optimizing space utilization.

Operating Mode: SYNCHRONOUS

With synchronous operation, this product is synchronized with the system clock, resulting in faster and more efficient data transfers.

Self Refresh: YES

The self-refresh feature of this product allows it to maintain data integrity during power interruptions or system standby, making it ideal for reliable data storage.

Input/Output Type: COMMON

This product has a common I/O type, simplifying system design and compatibility with other components.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V, this product ensures stable and efficient power consumption, contributing to energy efficiency.

No. of Terminals: 24

With 24 terminals, this product offers versatile connections and compatibility with different device configurations.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE

The grid array package style with a very thin profile provides excellent thermal dissipation and space-saving attributes, making it suitable for compact electronic designs.

Maximum Operating Temperature: 85 °C

This product can operate reliably in environments with a maximum temperature of 85°C, ensuring performance stability even under demanding conditions.

Organization: 8MX8

With an organization of 8MX8, this product provides a high memory capacity, making it ideal for applications requiring extensive data storage.

Minimum Operating Temperature: -40 °C

Operating within a minimum temperature of -40°C, this product can withstand extreme cold environments, expanding its potential applications.

Terminal Position: BOTTOM

The bottom terminal position of this product allows for convenient and efficient PCB layout and soldering, facilitating the assembly process.

No. of Ports: 1

With a single port, this product simplifies system configurations while still delivering reliable and high-speed data access.

Maximum Seated Height: 1 mm

The maximum seated height of only 1mm makes this product suitable for low-profile and compact designs, optimizing space utilization.

Maximum Clock Frequency (fCLK): 166 MHz

With a maximum clock frequency of 166MHz, this product offers fast data processing and transfer speeds, enhancing overall system performance.

Width: 6 mm

The compact width of 6mm allows for efficient space utilization in electronic systems and helps to achieve sleek and slim form factors.

Minimum Supply Voltage (Vsup): 2.7 V

Operating with a minimum supply voltage of 2.7V, this product ensures flexibility in power supply options while maintaining proper functionality.

Length: 8 mm

With a length of 8mm, this product offers a compact footprint, ideal for applications with limited space availability.

Technology: CMOS

Utilizing CMOS technology, this product provides low power consumption, high noise immunity, and fast data processing capabilities, making it an efficient choice for various applications.

Terminal Form: BALL

The ball terminal form of this product simplifies the soldering process and ensures secure electrical connections, enhancing durability and reliability.

Maximum Supply Current: 28 mA

With a maximum supply current of 28mA, this product exhibits low power consumption, contributing to energy efficiency in electronic systems.

No. of Words: 8388608 words

This product offers a high number of words for data storage, accommodating large amounts of information and enabling complex applications.

Memory Width: 8

With a memory width of 8, this product can handle and process data efficiently, offering reliable and high-speed data transfers.

Terminal Pitch: 1 mm

The terminal pitch of 1mm allows for a compact configuration of connectors, contributing to space-saving and efficient PCB design.

No. of Words Code: 8M

With an 8M words code, this product provides a significant data storage capacity, suitable for applications requiring extensive memory capabilities.

Moisture Sensitivity Level (MSL): 3

Featuring an MSL of 3, this product has good moisture resistance, ensuring reliability and performance consistency even in humid environments.

Maximum Supply Voltage (Vsup): 3.6 V

Operating efficiently with a maximum supply voltage of 3.6V, this product offers a wide voltage range compatibility, enhancing flexibility in system integration.

Memory Density: 67108864 bit

With a high memory density of 67108864 bits, this product allows for extensive data storage and retrieval, meeting the requirements of data-intensive applications.

Memory IC Type: HYPERRAM

This product belongs to the HYPERRAM memory IC type, providing fast access times, high bandwidth, and high-density storage capabilities, making it an excellent choice for memory-intensive applications.

Maximum Standby Current: 0.00025 Amp

With a maximum standby current of only 0.00025 Amp, this product exhibits extremely low power consumption during idle or standby modes, contributing to energy efficiency and longer battery life.

Maximum Access Time: 35 ns

With a maximum access time of 35ns, this product ensures fast data retrieval, reducing latency and improving overall system responsiveness.

Technical Specifications

DRAM S27KL0642DPBHI023 attributes and parameters. Explore more DRAM devices from Infineon Technologies

Specs

Maximum Access Time:

35 ns

Additional Features:

SELF REFRESH

Maximum Clock Frequency (fCLK):

166 MHz

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B24

Length:

8 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

24

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA24,5X5,40

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Self Refresh:

YES

Maximum Standby Current:

.00025 Amp

Maximum Supply Current:

28 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

6 mm

Trade Compliance

S27KL0642DPBHI023 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.02

SB

8542.32.00.15

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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