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S27KL0642GABHB020

Infineon Technologies

S27KL0642GABHB020 by Infineon Technologies

Infineon's S27KL0642GABHB020 DRAM offers 8MX8 organization, operates synchronously at up to 200 MHz, and features a self-refresh mode. Ideal for applications requiring high-speed memory access in automotive electronics, with AEC-Q100 screening level ensuring reliability in harsh environments.

Median Price

$4.530

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 626 parts In-Stock

1+ parts

$5.920

100+ parts

$5.096

1k+ parts

$4.758

10k+ parts

$4.687

626

$5.920

$5.096

$4.758

$4.687

Rochester

USA . 740 parts In-Stock

1+ parts

-

100+ parts

$3.140

1k+ parts

$2.810

10k+ parts

$2.640

740

-

$3.140

$2.810

$2.640

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 42 parts In-Stock

1+ parts

$4.930

100+ parts

-

1k+ parts

-

10k+ parts

-

42

$4.930

-

-

-

Vyrian

USA . 201 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

201

-

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 106 parts In-Stock

1+ parts

$3.183

100+ parts

$3.056

1k+ parts

$2.928

10k+ parts

-

106

$3.183

$3.056

$2.928

-

Component Stockers USA

USA . 1,219 parts In-Stock

1+ parts

$3.620

100+ parts

$3.400

1k+ parts

-

10k+ parts

-

1,219

$3.620

$3.400

-

-

Ampacity Inc.

Singapore . 134 parts In-Stock

1+ parts

$4.410

100+ parts

-

1k+ parts

-

10k+ parts

-

134

$4.410

-

-

-

Corphita

USA . 627 parts In-Stock

1+ parts

$4.671

100+ parts

-

1k+ parts

-

10k+ parts

-

627

$4.671

-

-

-

Bastille Electronics

Australia . 24,646 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

24,646

-

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 20,743 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20,743

-

-

-

-

Continental Prestige Electronics

USA . 2,953 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,953

-

-

-

-

Argo Parts USA

USA . 1,277 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,277

-

-

-

-

Overview

Experience superior performance and reliability with the S27KL0642GABHB020 by Infineon Technologies. As a leader in the industry, Infineon guarantees top-notch quality and innovation in every product. This DRAM memory module offers seamless synchronization, self-refresh capabilities, and a wide range of applications. With its common input/output type and 3-state output characteristics, this memory chip is perfect for various electronic devices. Trust Infineon to deliver exceptional value, benefits, and advantages to meet all your memory needs. Elevate your products with the best in the market - choose Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surfacr Mount: YES

Allows for easy and efficient installation on circuit boards, saving time during manufacturing.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and performance, making it suitable for automotive applications.

Operating Mode: SYNCHRONOUS

Enables synchronized communication with other components, improving overall system efficiency.

Nominal Supply Voltage / Vsup (V): 3

Operates at a standard voltage level, compatible with a wide range of systems and devices.

Maximum Clock Frequency (fCLK): 200 MHz

Supports high-speed data processing, making it suitable for demanding applications and tasks.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high performance, enhancing the efficiency of the product.

Technical Specifications

DRAM S27KL0642GABHB020 attributes and parameters. Explore more DRAM devices from Infineon Technologies

Specs

Maximum Clock Frequency (fCLK):

200 MHz

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B24

Length:

8 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

24

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA24,5X5,40

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Self Refresh:

YES

Maximum Standby Current:

.00036 Amp

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

6 mm

Trade Compliance

S27KL0642GABHB020 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.02

SB

8542.32.00.15

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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