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S27KL0642DPBHI033

Cypress Semiconductor

S27KL0642DPBHI033 by Cypress Semiconductor

HYPERRAM; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Maximum Standby Current: .00036 Amp; Organization: 8MX8;

Median Price

$2.326

Lifecycle Status

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6

In-Stock Inventory

1k+

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Rochester

USA . 32,500 parts In-Stock

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100+ parts

$2.140

1k+ parts

$1.910

10k+ parts

$1.800

32,500

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$2.140

$1.910

$1.800

Flip Electronics (Authorized)

USA . 30,000 parts In-Stock

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30,000

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Verical

USA . 2,500 parts In-Stock

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$2.513

10k+ parts

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2,500

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$2.513

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Digiode

USA . 920 parts In-Stock

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920

$2.252

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Vyrian

USA . 403 parts In-Stock

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$2.370

100+ parts

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403

$2.370

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Flip Electronics

USA . 30,000 parts In-Stock

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100+ parts

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30,000

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Corphita

USA . 90 parts In-Stock

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$2.133

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90

$2.133

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Modulus Dynamics

Lithuania . 832 parts In-Stock

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$2.239

100+ parts

$2.149

1k+ parts

$2.060

10k+ parts

-

832

$2.239

$2.149

$2.060

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Technical Specifications

DRAM S27KL0642DPBHI033 attributes and parameters. Explore more DRAM devices from Cypress Semiconductor

Specs

Maximum Access Time:

35 ns

Maximum Clock Frequency (fCLK):

166 MHz

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B24

Length:

8 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

24

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA24,5X5,40

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Self Refresh:

YES

Maximum Standby Current:

.00036 Amp

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

6 mm

Trade Compliance

S27KL0642DPBHI033 Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.A

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Cypress Semiconductor

Cypress Semiconductor was an American semiconductor design and manufacturing company. It offered NOR flash memories, F-RAM and SRAM Traveo microcontrollers, PSoC programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense capacitive touch-sensing controllers, Wireless BLE Bluetooth Low-Energy and USB connectivity solutions. Its headquarters were in San Jose, California, with operations in the United States, Ireland, India and the Philippines. In April 2016, Cypress Semiconductors announced the acquisition of Broadcom’s Wireless Internet of Things Business. The deal was closed in July 2016. In June 2019, Infineon Technologies announced it would acquire Cypress for $9.4 billion.The deal closed in April 2020, making Infineon one of the world's top 10 semiconductor manufacturers. Some of its main competitors included Microchip Technology, NXP Semiconductors, Renesas Electronics and Micron Technology.

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