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MT40A2G8VA-062EIT:B

Micron Technology

MT40A2G8VA-062EIT:B by Micron Technology

Micron Technology's MT40A2G8VA-062EIT:B is a DDR4 DRAM with 2GX8 organization, operating at up to 1600 MHz. It features a thin profile grid array package suitable for industrial applications requiring high memory density and common I/O type.

Median Price

$19.143

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

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$21.657

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100

$21.657

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Cyclops Electronics Ltd

UK . 13,422 parts In-Stock

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Vyrian

USA . 8,311 parts In-Stock

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Chip Stock

USA . 3,500 parts In-Stock

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Velocity Electronics

USA . 3,385 parts In-Stock

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Bristol Electronics

USA . 2,530 parts In-Stock

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BCID Electronics Ltd.

Israel . 1,892 parts In-Stock

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Digiode

USA . 1,799 parts In-Stock

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NAC Semi

USA . 311 parts In-Stock

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$16.630

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Distributors (Availability)

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AZTECH Wire

Italy . 744 parts In-Stock

1+ parts

$15.508

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$15.508

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Ampacity Inc.

Singapore . 1,181 parts In-Stock

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$17.000

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Aranea Global

USA . 50 parts In-Stock

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$21.224

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$20.375

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Infinite Electronics LLP (Excess)

. 10,006 parts In-Stock

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Argo Parts USA

USA . 4,423 parts In-Stock

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A-Z Elektronik GmbH

Germany . 3,627 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 2,188 parts In-Stock

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Corphita

USA . 1,850 parts In-Stock

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Continental Prestige Electronics

USA . 1,682 parts In-Stock

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RC Electronics

USA . 827 parts In-Stock

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Overview

Enhance your device's performance with Micron Technology's MT40A2G8VA-062EIT:B DDR4 DRAM, designed for seamless synchronization and self-refresh capabilities. This high-quality memory module offers a wide range of applications, ensuring optimal efficiency in industrial-grade settings. With a minimal standby voltage and maximum operating temperature of 95°C, this product guarantees reliability and endurance. Upgrade your system now and experience the speed and consistency you deserve. Trust Micron Technology to deliver top-notch products that elevate your technology experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making this product suitable for various applications.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise and accurate data transfer, enhancing the performance of the product.

Nominal Supply Voltage / Vsup (V): 1.2

Low nominal supply voltage helps in reducing power consumption and increasing energy efficiency.

Maximum Operating Temperature: 95 °C

High maximum operating temperature tolerance makes this product suitable for industrial environments with varying temperature conditions.

Memory IC Type: DDR4 DRAM

DDR4 technology ensures high-speed data transfer and improved overall system performance.

Technical Specifications

DRAM MT40A2G8VA-062EIT:B attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

MULTI BANK PAGE BURST

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

1600 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

8

JESD-30 Code:

R-PBGA-B78

JESD-609 Code:

e1

Length:

11 mm

Memory Density:

17179869184 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

78

No. of Words:

2147483648 words

No. of Words Code:

2G

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2GX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA78,9X13,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Refresh Cycles:

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

8

Minimum Standby Voltage:

1.14 V

Maximum Supply Voltage (Vsup):

1.26 V

Minimum Supply Voltage (Vsup):

1.14 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

MT40A2G8VA-062EIT:B Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.36

SB

8542.32.00.23

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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