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MT40A512M16LY-075:E

Micron Technology

MT40A512M16LY-075:E by Micron Technology

Micron Technology's MT40A512M16LY-075:E is a DDR4 DRAM with 512MX16 organization, operating at 1.2V. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for applications requiring high memory density and fast data access in thin profile devices.

Median Price

$9.641

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 327 parts In-Stock

1+ parts

$8.032

100+ parts

-

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327

$8.032

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Mouser Electronics

USA . 1,881 parts In-Stock

1+ parts

$11.250

100+ parts

$9.400

1k+ parts

-

10k+ parts

$7.290

1,881

$11.250

$9.400

-

$7.290

Distributors (In-Stock)

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Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$7.030

100+ parts

-

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750

$7.030

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Digiode

USA . 683 parts In-Stock

1+ parts

$7.630

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683

$7.630

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Cyclops Electronics Ltd

UK . 62,011 parts In-Stock

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62,011

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Vyrian

USA . 7,040 parts In-Stock

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7,040

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Dynamic Solutions

Germany . 4,000 parts In-Stock

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4,000

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BCID Electronics Ltd.

Israel . 3,080 parts In-Stock

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3,080

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Netsource Technology, Inc.

USA . 2,000 parts In-Stock

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2,000

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Sensible Micro Corp

USA . 875 parts In-Stock

1+ parts

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875

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ACDS - Activité Composants Distribution Service

France . 680 parts In-Stock

1+ parts

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680

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Component Sense

UK . 374 parts In-Stock

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374

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Flip Electronics

USA . 224 parts In-Stock

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224

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Greenchips

USA . 56 parts In-Stock

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56

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SIE Connect GmbH - GreenChips

Germany . 56 parts In-Stock

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56

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Prism Electronics

USA . 4 parts In-Stock

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 1,988 parts In-Stock

1+ parts

$4.060

100+ parts

-

1k+ parts

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1,988

$4.060

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Corohmni

South Africa . 1,019 parts In-Stock

1+ parts

$4.207

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1,019

$4.207

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$4.735

100+ parts

$4.498

1k+ parts

$4.498

10k+ parts

-

1,000

$4.735

$4.498

$4.498

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Continental Prestige Electronics

USA . 5,769 parts In-Stock

1+ parts

$6.411

100+ parts

-

1k+ parts

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10k+ parts

$6.283

5,769

$6.411

-

-

$6.283

Semicontronic

India . 1,790 parts In-Stock

1+ parts

$6.830

100+ parts

$6.659

1k+ parts

$6.625

10k+ parts

-

1,790

$6.830

$6.659

$6.625

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Netroflash

USA . 100 parts In-Stock

1+ parts

$7.030

100+ parts

-

1k+ parts

$6.679

10k+ parts

$6.538

100

$7.030

-

$6.679

$6.538

Corphita

USA . 2,033 parts In-Stock

1+ parts

$7.229

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2,033

$7.229

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Epart123

USA . 62,000 parts In-Stock

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$5.000

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$5.000

62,000

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$5.000

$5.000

Kepictronics

USA . 20,000 parts In-Stock

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Perfect Parts

USA . 18,548 parts In-Stock

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A-Z Elektronik GmbH

Germany . 14,426 parts In-Stock

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Argo Parts USA

USA . 3,978 parts In-Stock

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3,978

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RC Electronics

USA . 1,789 parts In-Stock

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1,789

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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S.R.D Solutions

India . 950 parts In-Stock

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950

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iodParts Technologies Inc.

India . 142 parts In-Stock

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142

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Formix International (Excess)

India . 77 parts In-Stock

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77

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Speed Components Ltd (Excess)

Israel . 70 parts In-Stock

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70

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Overview

Experience the power of cutting-edge technology with the MT40A512M16LY-075:E by Micron Technology. As a leading manufacturer in the industry, Micron ensures top-notch quality and reliability in their products. This DDR4 DRAM module offers unparalleled performance and efficiency, making it ideal for a wide range of applications. From gaming to data processing, this memory module delivers lightning-fast speeds and seamless multitasking capabilities. Upgrade your system today and unleash the full potential of your devices with Micron's MT40A512M16LY-075:E. Elevate your experience with Micron Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various operating conditions.

Surface Mount: YES

Allows for easy installation and integration onto PCBs for efficient use of space.

Operating Mode: SYNCHRONOUS

Enables synchronized data transfers for improved performance in applications requiring high-speed data processing.

Nominal Supply Voltage: 1.2V

Optimal supply voltage for stable and efficient operation of the DRAM module.

Memory IC Type: DDR4 DRAM

Utilization of cutting-edge DDR4 technology ensures high performance and energy efficiency in data processing.

Technical Specifications

DRAM MT40A512M16LY-075:E attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

MULTI BANK PAGE BURST

Additional Features:

AUTO/SELF REFRESH

Input/Output Type:

COMMON

Interleaved Burst Length:

8

JESD-30 Code:

R-PBGA-B96

JESD-609 Code:

e1

Length:

13.5 mm

Memory Density:

8589934592 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

96

No. of Words:

536870912 words

No. of Words Code:

512M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,9X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Refresh Cycles:

Reverse Pinout:

NO

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Maximum Supply Voltage (Vsup):

1.26 V

Minimum Supply Voltage (Vsup):

1.14 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

MT40A512M16LY-075:E Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.36

SB

8542.32.00.23

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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