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MT48LC16M16A2TG-75IT

Micron Technology

MT48LC16M16A2TG-75IT by Micron Technology

MT48LC16M16A2TG-75IT by Micron Technology is a 16MX16 DRAM with 3.3V supply, operating at 133MHz. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for industrial applications requiring fast memory access and low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 23,700 parts In-Stock

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23,700

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Vyrian

USA . 8,606 parts In-Stock

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8,606

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Digiode

USA . 2,133 parts In-Stock

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2,133

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Nova Conductors

Japan . 100 parts In-Stock

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100

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ComSIT Distribution GmbH

Germany . 47 parts In-Stock

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47

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ComSIT USA

USA . 47 parts In-Stock

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47

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Vectronix, Inc

USA . 44 parts In-Stock

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44

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Semi Source

USA . 20 parts In-Stock

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20

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Speed Components Ltd

Israel . 8 parts In-Stock

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8

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A&K Electronics

USA . 5 parts In-Stock

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Bristol Electronics

USA . 5 parts In-Stock

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5

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LWI Electronics Inc

India . 3 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 12,048 parts In-Stock

1+ parts

$4.078

100+ parts

-

1k+ parts

$3.915

10k+ parts

$3.915

12,048

$4.078

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$3.915

$3.915

AZTECH Wire

Italy . 472 parts In-Stock

1+ parts

$15.978

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472

$15.978

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Ampacity Inc.

Singapore . 642 parts In-Stock

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$19.000

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642

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Continental Prestige Electronics

USA . 2,717 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Benley Electronics

USA . 1,193 parts In-Stock

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1,193

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Perfect Parts

USA . 612 parts In-Stock

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612

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Argo Parts USA

USA . 588 parts In-Stock

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588

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Corphita

USA . 576 parts In-Stock

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576

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Bastille Electronics

Australia . 500 parts In-Stock

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500

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Overview

Unlock the power of cutting-edge technology with Micron Technology's MT48LC16M16A2TG-75IT DRAM module. Designed with precision and quality in mind, this product offers unparalleled performance and reliability for a wide range of applications. Whether you're looking to boost the speed and efficiency of your gaming system or enhance the capabilities of your industrial equipment, this memory module delivers exceptional value with its advanced features and innovative design. Trust Micron Technology to provide you with the tools you need to take your projects to the next level. Elevate your performance with the MT48LC16M16A2TG-75IT today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the components within the package, ensuring longevity and reliability.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and coordination, enhancing performance efficiency.

Nominal Supply Voltage / Vsup (V): 3.3

The optimal supply voltage of 3.3V ensures stable and efficient power delivery to the device.

Maximum Clock Frequency (fCLK): 133 MHz

The high clock frequency enables fast data transfer and processing speeds, making this product suitable for demanding applications.

Memory Width: 16

With a wider memory width of 16 bits, this product can handle larger amounts of data simultaneously, improving overall performance.

Refresh Cycles: 8192

The high number of refresh cycles ensures data integrity and reliability, especially in high-demand usage scenarios.

Technical Specifications

DRAM MT48LC16M16A2TG-75IT attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

FOUR BANK PAGE BURST

Maximum Access Time:

5.4 ns

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

133 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

1,2,4,8

JESD-30 Code:

R-PDSO-G54

JESD-609 Code:

e0

Length:

22.22 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

54

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP54,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Qualification:

Not Qualified

Refresh Cycles:

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

1,2,4,8,FP

Maximum Standby Current:

.002 Amp

Sub-Category:

DRAMs

Maximum Supply Current:

270 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10.16 mm

Trade Compliance

MT48LC16M16A2TG-75IT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.24

SB

8542.32.00.15

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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