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MT48LC4M16A2P-6A:J

Micron Technology

MT48LC4M16A2P-6A:J by Micron Technology

Micron Technology's MT48LC4M16A2P-6A:J is a 4MX16 Synchronous DRAM with 3.3V supply, operating at 167MHz. It features a small outline package and offers common I/O type for applications requiring fast access times and high memory density.

Median Price

$6.780

Lifecycle Status

Suppliers In-Stock

30

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 36,180 parts In-Stock

1+ parts

$4.180

100+ parts

$3.910

1k+ parts

$3.710

10k+ parts

$3.190

36,180

$4.180

$3.910

$3.710

$3.190

Farnell

UK . 2,797 parts In-Stock

1+ parts

$6.200

100+ parts

$4.381

1k+ parts

$4.201

10k+ parts

-

2,797

$6.200

$4.381

$4.201

-

Mouser Electronics

USA . 839 parts In-Stock

1+ parts

$7.360

100+ parts

$6.780

1k+ parts

-

10k+ parts

-

839

$7.360

$6.780

-

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Newark

USA . 348 parts In-Stock

1+ parts

$9.610

100+ parts

-

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-

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348

$9.610

-

-

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Element14

Singapore . 2,188 parts In-Stock

1+ parts

$12.990

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-

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-

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2,188

$12.990

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Verical

USA . 36,180 parts In-Stock

1+ parts

-

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36,180

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WPG Americas

USA . 830 parts In-Stock

1+ parts

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830

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Avnet

USA . 662 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$4.742

662

-

-

-

$4.742

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 15 parts In-Stock

1+ parts

$0.600

100+ parts

-

1k+ parts

-

10k+ parts

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15

$0.600

-

-

-

Component Electronics Inc.

Canada . 8 parts In-Stock

1+ parts

$3.850

100+ parts

$2.880

1k+ parts

$2.500

10k+ parts

-

8

$3.850

$2.880

$2.500

-

Digiode

USA . 909 parts In-Stock

1+ parts

$4.009

100+ parts

-

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-

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909

$4.009

-

-

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Nova Conductors

Japan . 43 parts In-Stock

1+ parts

$4.310

100+ parts

-

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43

$4.310

-

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Cyclops Electronics Ltd

UK . 26,727 parts In-Stock

1+ parts

-

100+ parts

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26,727

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-

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Chip Stock

USA . 22,700 parts In-Stock

1+ parts

-

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22,700

-

-

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NAC Semi

USA . 10,800 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

$3.640

10,800

-

-

-

$3.640

Vyrian

USA . 4,774 parts In-Stock

1+ parts

-

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4,774

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-

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Dynamic Solutions

Germany . 4,000 parts In-Stock

1+ parts

-

100+ parts

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4,000

-

-

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Mil-Aero Solutions, Inc.

USA . 1,783 parts In-Stock

1+ parts

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1,783

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ACDS - Activité Composants Distribution Service

France . 786 parts In-Stock

1+ parts

-

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786

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Inventory MP

USA . 209 parts In-Stock

1+ parts

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209

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Bristol Electronics

USA . 209 parts In-Stock

1+ parts

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209

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Sea View Technologies

USA . 88 parts In-Stock

1+ parts

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88

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ComSIT Distribution GmbH

Germany . 56 parts In-Stock

1+ parts

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56

-

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LIBRA Elektronik GmbH

Germany . 54 parts In-Stock

1+ parts

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54

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Prism Electronics

USA . 30 parts In-Stock

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30

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Component Sense

UK . 13 parts In-Stock

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13

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Elcom Components

USA . 4 parts In-Stock

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4

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Sensible Micro Corp

USA . 3 parts In-Stock

1+ parts

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3

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Flex Direct, LLC

USA . 3 parts In-Stock

1+ parts

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3

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NexGen Digital

USA . 1 parts In-Stock

1+ parts

-

100+ parts

-

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1

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 854 parts In-Stock

1+ parts

$3.087

100+ parts

-

1k+ parts

-

10k+ parts

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854

$3.087

-

-

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Ampacity Inc.

Singapore . 4,866 parts In-Stock

1+ parts

$3.400

100+ parts

-

1k+ parts

-

10k+ parts

-

4,866

$3.400

-

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Semicontronic

India . 4,550 parts In-Stock

1+ parts

$3.400

100+ parts

$3.315

1k+ parts

$3.298

10k+ parts

-

4,550

$3.400

$3.315

$3.298

-

Corphita

USA . 1,730 parts In-Stock

1+ parts

$3.798

100+ parts

-

1k+ parts

-

10k+ parts

-

1,730

$3.798

-

-

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Argo Parts USA

USA . 4,110 parts In-Stock

1+ parts

$4.230

100+ parts

-

1k+ parts

-

10k+ parts

-

4,110

$4.230

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$4.310

100+ parts

-

1k+ parts

-

10k+ parts

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100

$4.310

-

-

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Aztec Data Supply Inc.

USA . 4,996 parts In-Stock

1+ parts

$4.979

100+ parts

-

1k+ parts

-

10k+ parts

-

4,996

$4.979

-

-

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Continental Prestige Electronics

USA . 4,361 parts In-Stock

1+ parts

$5.080

100+ parts

$3.750

1k+ parts

-

10k+ parts

-

4,361

$5.080

$3.750

-

-

Advanced Electronics

New Zealand . 58 parts In-Stock

1+ parts

$6.134

100+ parts

$5.582

1k+ parts

$5.030

10k+ parts

-

58

$6.134

$5.582

$5.030

-

CoreStaff

Japan . 543 parts In-Stock

1+ parts

$6.171

100+ parts

$4.077

1k+ parts

$4.072

10k+ parts

-

543

$6.171

$4.077

$4.072

-

Perfect Parts

USA . 24,816 parts In-Stock

1+ parts

-

100+ parts

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24,816

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A-Z Elektronik GmbH

Germany . 8,232 parts In-Stock

1+ parts

-

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1k+ parts

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8,232

-

-

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RC Electronics

USA . 5,592 parts In-Stock

1+ parts

-

100+ parts

$4.320

1k+ parts

$3.950

10k+ parts

$3.830

5,592

-

$4.320

$3.950

$3.830

Futuretech Components

Singapore . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

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4,000

-

-

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S.R.D Solutions

India . 3,000 parts In-Stock

1+ parts

-

100+ parts

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3,000

-

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Assy Fe

Spain . 1,184 parts In-Stock

1+ parts

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1,184

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-

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Authorized Procurement Solutions

USA . 1,080 parts In-Stock

1+ parts

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100+ parts

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1,080

-

-

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Kepictronics

USA . 710 parts In-Stock

1+ parts

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710

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-

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GreenTree Electronics

Israel . 500 parts In-Stock

1+ parts

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500

-

-

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-

Overview

Experience the next level of performance with Micron Technology's MT48LC4M16A2P-6A:J DRAM. Designed for reliability and efficiency, this product offers seamless operation in a variety of applications. With a focus on quality and innovation, Micron Technology ensures that customers receive top-notch products that deliver exceptional value and benefits. Elevate your projects with the cutting-edge technology of Micron's DRAM and unlock new possibilities for your business. Trust in Micron Technology to provide the quality and performance you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and cost-effectiveness, making this product a reliable choice for various applications.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving, making it ideal for compact designs.

Package Shape: RECTANGULAR

The rectangular shape of the package offers easy handling and efficient PCB layout, enhancing the overall usability of the product.

Operating Mode: SYNCHRONOUS

The synchronous operation ensures precise and synchronous data transfer, enhancing the performance and reliability of the product.

Self Refresh: YES

The self-refresh capability helps in reducing power consumption and prolonging battery life, making it an efficient choice for power-sensitive devices.

Input/Output Type: COMMON

The common input/output type simplifies the design process and allows for easier integration, making it a convenient choice for designers.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V offers compatibility with a wide range of systems and ensures stable operation, making it a versatile choice for different applications.

Power Supplies (V): 3.3

With a power supply voltage of 3.3V, this product offers efficient power consumption and compatibility, making it suitable for various devices.

No. of Terminals: 54

The ample number of terminals provide flexibility in connection and installation, catering to different design requirements effectively.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline and thin profile package style save space and facilitate compact designs, making it suitable for space-constrained applications.

Technical Specifications

DRAM MT48LC4M16A2P-6A:J attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

FOUR BANK PAGE BURST

Maximum Access Time:

5.4 ns

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

167 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

1,2,4,8

JESD-30 Code:

R-PDSO-G54

JESD-609 Code:

e3

Length:

22.22 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

54

No. of Words:

4194304 words

No. of Words Code:

4M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

4MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP54,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Refresh Cycles:

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

1,2,4,8,FP

Maximum Standby Current:

.0025 Amp

Sub-Category:

DRAMs

Maximum Supply Current:

150 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10.16 mm

Trade Compliance

MT48LC4M16A2P-6A:J Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.02

SB

8542.32.00.15

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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