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MT48LC4M16A2P-6AIT:J

Micron Technology

MT48LC4M16A2P-6AIT:J by Micron Technology

Micron Technology's MT48LC4M16A2P-6AIT:J is a 4MX16 DRAM with 3.3V supply, operating at 167MHz clock frequency. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for industrial applications requiring fast access times and high memory density.

Median Price

$6.405

Lifecycle Status

Suppliers In-Stock

27

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 6 parts In-Stock

1+ parts

$4.310

100+ parts

$4.310

1k+ parts

$4.310

10k+ parts

-

6

$4.310

$4.310

$4.310

-

Arrow

USA . 2,875 parts In-Stock

1+ parts

$4.900

100+ parts

$4.300

1k+ parts

$3.960

10k+ parts

$3.810

2,875

$4.900

$4.300

$3.960

$3.810

Mouser Electronics

USA . 250 parts In-Stock

1+ parts

$7.910

100+ parts

-

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-

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250

$7.910

-

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Farnell

UK . 1,073 parts In-Stock

1+ parts

$8.190

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1,073

$8.190

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Element14

Singapore . 1,062 parts In-Stock

1+ parts

$18.450

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1,062

$18.450

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Future Electronics

Canada . 5,400 parts In-Stock

1+ parts

-

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$2.950

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5,400

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$2.950

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Verical

USA . 2,874 parts In-Stock

1+ parts

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2,874

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EBV Elektronik

Germany . 2,160 parts In-Stock

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2,160

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Distributors (In-Stock)

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Digiode

USA . 454 parts In-Stock

1+ parts

$3.135

100+ parts

-

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454

$3.135

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$4.695

100+ parts

-

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100

$4.695

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Voyager Components

USA . 20 parts In-Stock

1+ parts

$8.402

100+ parts

$8.402

1k+ parts

$8.402

10k+ parts

$8.402

20

$8.402

$8.402

$8.402

$8.402

Vyrian

USA . 8,493 parts In-Stock

1+ parts

-

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8,493

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Chip Stock

USA . 6,859 parts In-Stock

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6,859

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NAC Semi

USA . 6,480 parts In-Stock

1+ parts

-

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10k+ parts

$3.720

6,480

-

-

-

$3.720

Dynamic Solutions

Germany . 4,000 parts In-Stock

1+ parts

-

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4,000

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Cyclops Electronics Ltd

UK . 2,181 parts In-Stock

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2,181

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ACDS - Activité Composants Distribution Service

France . 1,289 parts In-Stock

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1,289

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Component Sense

UK . 1,237 parts In-Stock

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1,237

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Sensible Micro Corp

USA . 664 parts In-Stock

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664

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Dan-Mar Components

USA . 320 parts In-Stock

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320

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Prism Electronics

USA . 108 parts In-Stock

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108

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PC Components Company LLC

USA . 94 parts In-Stock

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94

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Bristol Electronics

USA . 94 parts In-Stock

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94

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Euro-Tech

UK . 56 parts In-Stock

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56

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Bas Electronics GmbH & Co. KG

Germany . 26 parts In-Stock

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ComSIT Distribution GmbH

Germany . 20 parts In-Stock

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20

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Atlantic Semiconductor

USA . 4 parts In-Stock

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 7,784 parts In-Stock

1+ parts

$2.800

100+ parts

$2.730

1k+ parts

$2.716

10k+ parts

-

7,784

$2.800

$2.730

$2.716

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Ampacity Inc.

Singapore . 3,900 parts In-Stock

1+ parts

$2.800

100+ parts

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3,900

$2.800

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Corphita

USA . 2,038 parts In-Stock

1+ parts

$2.970

100+ parts

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2,038

$2.970

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$4.601

100+ parts

-

1k+ parts

$4.417

10k+ parts

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500

$4.601

-

$4.417

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Continental Prestige Electronics

USA . 8,456 parts In-Stock

1+ parts

$4.693

100+ parts

-

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10k+ parts

$4.599

8,456

$4.693

-

-

$4.599

Aztec Data Supply Inc.

USA . 240 parts In-Stock

1+ parts

$5.300

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-

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240

$5.300

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Advanced Electronics

New Zealand . 90 parts In-Stock

1+ parts

$5.667

100+ parts

$5.384

1k+ parts

$5.384

10k+ parts

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90

$5.667

$5.384

$5.384

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Corohmni

South Africa . 181 parts In-Stock

1+ parts

$5.874

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181

$5.874

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Andel Nordic

Denmark . 7,149 parts In-Stock

1+ parts

$5.940

100+ parts

-

1k+ parts

$5.702

10k+ parts

$5.702

7,149

$5.940

-

$5.702

$5.702

Perfect Parts

USA . 74,423 parts In-Stock

1+ parts

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74,423

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A-Z Elektronik GmbH

Germany . 11,777 parts In-Stock

1+ parts

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11,777

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RC Electronics

USA . 4,418 parts In-Stock

1+ parts

-

100+ parts

$4.930

1k+ parts

$4.640

10k+ parts

$4.550

4,418

-

$4.930

$4.640

$4.550

Argo Parts USA

USA . 4,204 parts In-Stock

1+ parts

-

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4,204

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Microchip USA

USA . 2,360 parts In-Stock

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2,360

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Glotronic Ltd.

UK . 2,333 parts In-Stock

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2,333

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Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

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1,000

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Futuretech Components

Singapore . 950 parts In-Stock

1+ parts

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950

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Kepictronics

USA . 698 parts In-Stock

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698

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Authorized Procurement Solutions

USA . 512 parts In-Stock

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512

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Formix International (Excess)

India . 429 parts In-Stock

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429

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Overview

Unleash the power of reliable and high-performance memory with the MT48LC4M16A2P-6AIT:J by Micron Technology. Designed for industrial applications, this DRAM offers a seamless synchronous operation with self-refresh capabilities, ensuring optimal performance even in demanding environments. With a compact package style and excellent temperature tolerance, this memory module is ideal for a wide range of applications where speed and reliability are crucial. Elevate your systems with Micron Technology's cutting-edge memory solutions today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DRAM, ensuring a longer lifespan.

Surface Mount: YES

Enables easy and efficient installation on circuit boards, saving time during assembly.

Operating Mode: SYNCHRONOUS

Allows for synchronized data transfer with the system clock, enhancing overall performance.

Nominal Supply Voltage / Vsup (V): 3.3

Optimal voltage level for reliable and stable operation of the DRAM.

Maximum Clock Frequency (fCLK): 167 MHz

Supports high-speed data processing, ideal for demanding applications.

Memory Density: 67108864 bit

Provides ample storage capacity for storing large amounts of data efficiently.

Technical Specifications

DRAM MT48LC4M16A2P-6AIT:J attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

FOUR BANK PAGE BURST

Maximum Access Time:

5.4 ns

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

167 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

1,2,4,8

JESD-30 Code:

R-PDSO-G54

JESD-609 Code:

e3

Length:

22.22 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

54

No. of Words:

4194304 words

No. of Words Code:

4M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP54,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Refresh Cycles:

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

1,2,4,8,FP

Maximum Standby Current:

.0025 Amp

Sub-Category:

DRAMs

Maximum Supply Current:

150 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10.16 mm

Trade Compliance

MT48LC4M16A2P-6AIT:J Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.02

SB

8542.32.00.15

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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