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MT48LC32M16A2TG-75IT:C

Micron Technology

MT48LC32M16A2TG-75IT:C by Micron Technology

Micron Technology's MT48LC32M16A2TG-75IT:C is a 32MX16 DRAM with 3.3V supply, operating at 133MHz clock frequency. Ideal for industrial applications, it offers synchronous operation, self-refresh capability, and a compact thin profile package.

Median Price

$11.834

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$11.834

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600

$11.834

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Chip Stock

USA . 16,900 parts In-Stock

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16,900

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Vyrian

USA . 1,416 parts In-Stock

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1,416

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Kruse Electronics AG

Switzerland . 1,000 parts In-Stock

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1,000

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Digiode

USA . 901 parts In-Stock

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901

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Vectronix, Inc

USA . 274 parts In-Stock

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274

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Sogenti Electronics

Canada . 10 parts In-Stock

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10

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Sunrise Surplus Inc.

USA . 3 parts In-Stock

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3

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Extreme Components

USA . 2 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 295 parts In-Stock

1+ parts

$2.333

100+ parts

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295

$2.333

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Corohmni

South Africa . 18 parts In-Stock

1+ parts

$3.552

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18

$3.552

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Andel Nordic

Denmark . 6,650 parts In-Stock

1+ parts

$7.421

100+ parts

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$7.125

10k+ parts

$7.125

6,650

$7.421

-

$7.125

$7.125

Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

$11.830

100+ parts

$11.238

1k+ parts

-

10k+ parts

$10.529

300

$11.830

$11.238

-

$10.529

AZTECH Wire

Italy . 574 parts In-Stock

1+ parts

$19.033

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574

$19.033

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Ampacity Inc.

Singapore . 702 parts In-Stock

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$23.000

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702

$23.000

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Component Stockers USA

USA . 2,454 parts In-Stock

1+ parts

$68.030

100+ parts

$64.630

1k+ parts

$62.590

10k+ parts

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2,454

$68.030

$64.630

$62.590

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A-Z Elektronik GmbH

Germany . 5,621 parts In-Stock

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5,621

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Perfect Parts

USA . 4,041 parts In-Stock

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4,041

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Continental Prestige Electronics

USA . 2,284 parts In-Stock

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2,284

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Corphita

USA . 2,150 parts In-Stock

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2,150

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Argo Parts USA

USA . 1,572 parts In-Stock

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1,572

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Overview

Experience the superior performance and reliability of Micron Technology with the MT48LC32M16A2TG-75IT:C DRAM. This high-quality component offers unparalleled value to customers with its synchronous operation, self-refresh capabilities, and industrial-grade temperature range. Perfect for a wide range of applications, this memory device boasts a compact package design and efficient power management features. Trust in Micron Technology to deliver cutting-edge technology that meets your needs while providing exceptional benefits and advantages in every use case.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and protection for the DRAM, making it a reliable choice for long-term usage.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and coordination of data transfers, enhancing overall performance of the DRAM.

Nominal Supply Voltage / Vsup (V): 3.3

3.3V supply voltage ensures efficient power consumption while providing the necessary voltage for optimal operation of the DRAM.

Maximum Clock Frequency (fCLK): 133 MHz

High clock frequency of 133 MHz enables fast data transfer rates, improving overall system performance.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in a wide range of temperature conditions, making it suitable for industrial applications.

Memory IC Type: SYNCHRONOUS DRAM

Being a synchronous DRAM, it offers high-speed data processing and efficient operation, making it ideal for demanding applications.

Technical Specifications

DRAM MT48LC32M16A2TG-75IT:C attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

FOUR BANK PAGE BURST

Maximum Access Time:

5.4 ns

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

133 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

1,2,4,8

JESD-30 Code:

R-PDSO-G54

JESD-609 Code:

e0

Length:

22.22 mm

Memory Density:

536870912 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

54

No. of Words:

33554432 words

No. of Words Code:

32M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP54,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

245

Power Supplies (V):

3.3

Qualification:

Not Qualified

Refresh Cycles:

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

1,2,4,8,FP

Maximum Standby Current:

.0035 Amp

Sub-Category:

DRAMs

Maximum Supply Current:

255 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

10.16 mm

Trade Compliance

MT48LC32M16A2TG-75IT:C Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.32

SB

8542.32

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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