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MT48LC8M16A2P-6AIT:L

Micron Technology

MT48LC8M16A2P-6AIT:L by Micron Technology

Micron Technology's MT48LC8M16A2P-6AIT:L is a 3.3V Synchronous DRAM with 8MX16 organization, operating at up to 167 MHz clock frequency. It features self-refresh capability, common I/O type, and supports four-bank page burst access mode. Ideal for industrial applications requiring high memory density and fast access times.

Median Price

$6.452

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,291 parts In-Stock

1+ parts

$4.620

100+ parts

$4.120

1k+ parts

$4.040

10k+ parts

$3.940

2,291

$4.620

$4.120

$4.040

$3.940

Mouser Electronics

USA . 1,193 parts In-Stock

1+ parts

$5.780

100+ parts

$4.570

1k+ parts

$4.470

10k+ parts

$4.310

1,193

$5.780

$4.570

$4.470

$4.310

Farnell

UK . 921 parts In-Stock

1+ parts

$7.125

100+ parts

$5.036

1k+ parts

$4.828

10k+ parts

-

921

$7.125

$5.036

$4.828

-

Newark

USA . 382 parts In-Stock

1+ parts

$11.310

100+ parts

-

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-

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382

$11.310

-

-

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Element14

Singapore . 488 parts In-Stock

1+ parts

$15.270

100+ parts

-

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488

$15.270

-

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Future Electronics

Canada . 3,240 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.150

10k+ parts

-

3,240

-

-

$3.150

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Verical

USA . 2,290 parts In-Stock

1+ parts

-

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2,290

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 454 parts In-Stock

1+ parts

$3.164

100+ parts

-

1k+ parts

-

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454

$3.164

-

-

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Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$5.089

100+ parts

-

1k+ parts

-

10k+ parts

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450

$5.089

-

-

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NAC Semi

USA . 350 parts In-Stock

1+ parts

$14.250

100+ parts

-

1k+ parts

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350

$14.250

-

-

-

Cyclops Electronics Ltd

UK . 11,187 parts In-Stock

1+ parts

-

100+ parts

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11,187

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-

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Chip Stock

USA . 10,200 parts In-Stock

1+ parts

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10,200

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-

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IBS Electronics

USA . 9,240 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

$5.992

9,240

-

-

-

$5.992

Dynamic Solutions

Germany . 4,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,000

-

-

-

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ACDS - Activité Composants Distribution Service

France . 1,261 parts In-Stock

1+ parts

-

100+ parts

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1,261

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Vyrian

USA . 692 parts In-Stock

1+ parts

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692

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Bristol Electronics

USA . 305 parts In-Stock

1+ parts

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305

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Bisco

USA . 25 parts In-Stock

1+ parts

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25

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ComSIT Distribution GmbH

Germany . 24 parts In-Stock

1+ parts

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24

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Inventory MP

USA . 8 parts In-Stock

1+ parts

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8

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Semi Source

USA . 3 parts In-Stock

1+ parts

-

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3

-

-

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Connect4Technologies Inc.

Canada . 3 parts In-Stock

1+ parts

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3

-

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Semtec, LLC

USA . 2 parts In-Stock

1+ parts

-

100+ parts

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2

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 2,915 parts In-Stock

1+ parts

$2.710

100+ parts

-

1k+ parts

-

10k+ parts

-

2,915

$2.710

-

-

-

Semicontronic

India . 2,514 parts In-Stock

1+ parts

$2.830

100+ parts

$2.759

1k+ parts

$2.745

10k+ parts

-

2,514

$2.830

$2.759

$2.745

-

Ampacity Inc.

Singapore . 2,407 parts In-Stock

1+ parts

$2.830

100+ parts

-

1k+ parts

-

10k+ parts

-

2,407

$2.830

-

-

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Corphita

USA . 1,176 parts In-Stock

1+ parts

$2.997

100+ parts

-

1k+ parts

-

10k+ parts

-

1,176

$2.997

-

-

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Corohmni

South Africa . 114 parts In-Stock

1+ parts

$3.434

100+ parts

-

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10k+ parts

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114

$3.434

-

-

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Continental Prestige Electronics

USA . 3,853 parts In-Stock

1+ parts

$5.089

100+ parts

-

1k+ parts

-

10k+ parts

$4.988

3,853

$5.089

-

-

$4.988

CoreStaff

Japan . 685 parts In-Stock

1+ parts

$11.730

100+ parts

$5.228

1k+ parts

-

10k+ parts

-

685

$11.730

$5.228

-

-

Perfect Parts

USA . 28,465 parts In-Stock

1+ parts

-

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28,465

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Argo Parts USA

USA . 4,807 parts In-Stock

1+ parts

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4,807

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-

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S.R.D Solutions

India . 4,600 parts In-Stock

1+ parts

-

100+ parts

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4,600

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A-Z Elektronik GmbH

Germany . 3,941 parts In-Stock

1+ parts

-

100+ parts

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3,941

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Infinite Electronics LLP (Excess)

. 3,426 parts In-Stock

1+ parts

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3,426

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-

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Epart123

USA . 3,240 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$7.310

10k+ parts

$7.310

3,240

-

-

$7.310

$7.310

Authorized Procurement Solutions

USA . 2,506 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,506

-

-

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$4.988

1k+ parts

$4.835

10k+ parts

$4.733

2,000

-

$4.988

$4.835

$4.733

Formix International (Excess)

India . 1,415 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,415

-

-

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Microchip USA

USA . 1,088 parts In-Stock

1+ parts

-

100+ parts

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1,088

-

-

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Kepictronics

USA . 980 parts In-Stock

1+ parts

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980

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Robosynatics

Brazil . 900 parts In-Stock

1+ parts

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100+ parts

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900

-

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Glotronic Ltd.

UK . 847 parts In-Stock

1+ parts

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100+ parts

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847

-

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GreenTree Electronics

Israel . 700 parts In-Stock

1+ parts

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100+ parts

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700

-

-

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Futuretech Components

Singapore . 500 parts In-Stock

1+ parts

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500

-

-

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Legend Electronics Inc. (Excess)

USA . 220 parts In-Stock

1+ parts

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100+ parts

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220

-

-

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Speed Components Ltd (Excess)

Israel . 220 parts In-Stock

1+ parts

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100+ parts

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220

-

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Overview

Experience superior performance and reliability with the MT48LC8M16A2P-6AIT:L by Micron Technology. As a leader in the industry, Micron delivers top-of-the-line DRAM products that are perfect for a variety of applications. With a focus on quality and innovation, this product offers customers unmatched value and benefits. Trust in Micron Technology to provide you with the cutting-edge solutions you need for your next project. Elevate your performance with the MT48LC8M16A2P-6AIT:L today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Operating Mode: SYNCHRONOUS

Allows for synchronized data transfers, resulting in faster and more efficient performance.

Nominal Supply Voltage / Vsup (V): 3.3

Optimal supply voltage that balances power efficiency with performance, making it suitable for various applications.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments where heat may be a concern.

Memory IC Type: SYNCHRONOUS DRAM

Utilizes synchronous technology for improved data transfer speeds, making it ideal for high-performance computing applications.

Technical Specifications

DRAM MT48LC8M16A2P-6AIT:L attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

FOUR BANK PAGE BURST

Maximum Access Time:

5.4 ns

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

167 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

1,2,4,8

JESD-30 Code:

R-PDSO-G54

JESD-609 Code:

e3

Length:

22.22 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

54

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP54,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Refresh Cycles:

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

1,2,4,8,FP

Maximum Standby Current:

.0025 Amp

Sub-Category:

DRAMs

Maximum Supply Current:

100 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10.16 mm

Trade Compliance

MT48LC8M16A2P-6AIT:L Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.02

SB

8542.32.00.15

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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