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MT48LC16M16A2P-6AIT

Micron Technology

MT48LC16M16A2P-6AIT by Micron Technology

MT48LC16M16A2P-6AIT by Micron Technology is a 16MX16 Synchronous DRAM with 167 MHz clock frequency, 5.4 ns access time, and 8192 refresh cycles. It is ideal for industrial applications requiring high-speed memory operations in a compact package with common I/O type and self-refresh capability.

Median Price

$11.314

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$5.977

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$5.977

-

-

-

Mobius Materials

USA . 27 parts In-Stock

1+ parts

$16.650

100+ parts

$13.393

1k+ parts

-

10k+ parts

-

27

$16.650

$13.393

-

-

Chip Stock

USA . 20,187 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20,187

-

-

-

-

Vyrian

USA . 1,555 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,555

-

-

-

-

Digiode

USA . 1,527 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,527

-

-

-

-

ComSIT Distribution GmbH

Germany . 75 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

75

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,360 parts In-Stock

1+ parts

$1.000

100+ parts

$0.975

1k+ parts

$0.970

10k+ parts

-

1,360

$1.000

$0.975

$0.970

-

Corohmni

South Africa . 642 parts In-Stock

1+ parts

$4.397

100+ parts

-

1k+ parts

-

10k+ parts

-

642

$4.397

-

-

-

Aztec Data Supply Inc.

USA . 113 parts In-Stock

1+ parts

$5.086

100+ parts

-

1k+ parts

-

10k+ parts

-

113

$5.086

-

-

-

AZTECH Wire

Italy . 751 parts In-Stock

1+ parts

$5.101

100+ parts

-

1k+ parts

-

10k+ parts

-

751

$5.101

-

-

-

Continental Prestige Electronics

USA . 1,018 parts In-Stock

1+ parts

$5.594

100+ parts

-

1k+ parts

-

10k+ parts

$5.482

1,018

$5.594

-

-

$5.482

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$5.977

100+ parts

-

1k+ parts

$5.678

10k+ parts

$5.559

2,000

$5.977

-

$5.678

$5.559

Ampacity Inc.

Singapore . 1,381 parts In-Stock

1+ parts

$14.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,381

$14.000

-

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,000

-

-

-

-

Argo Parts USA

USA . 1,425 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,425

-

-

-

-

Corphita

USA . 1,073 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,073

-

-

-

-

Overview

Experience the next level of performance with the MT48LC16M16A2P-6AIT by Micron Technology. As a leading manufacturer of high-quality DRAM, Micron Technology delivers reliability and innovation. This versatile memory module is ideal for a wide range of applications, offering seamless operation and fast data processing. Take your projects to new heights with the unmatched value, benefits, and advantages this product provides. Trust in Micron Technology to elevate your technology experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package durable and lightweight, ideal for portable devices.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures accurate and reliable data transmission, making this product suitable for high-performance applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V makes this product energy-efficient and compatible with various electronic devices.

Maximum Clock Frequency (fCLK): 167 MHz

With a high maximum clock frequency, this product offers fast data processing speed, making it ideal for tasks that require quick data access.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature range ensures stable performance in harsh environmental conditions, making this product suitable for industrial applications.

Memory IC Type: SYNCHRONOUS DRAM

The use of synchronous DRAM technology enhances data transfer efficiency and speed, making this product a reliable choice for memory-intensive tasks.

Technical Specifications

DRAM MT48LC16M16A2P-6AIT attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

FOUR BANK PAGE BURST

Maximum Access Time:

5.4 ns

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

167 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

1,2,4,8

JESD-30 Code:

R-PDSO-G54

JESD-609 Code:

e3

Length:

22.22 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

54

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP54,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Refresh Cycles:

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

1,2,4,8,FP

Sub-Category:

DRAMs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10.16 mm

Trade Compliance

MT48LC16M16A2P-6AIT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.24

SB

8542.32.00.15

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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