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MT48LC16M16A2P-6A:GTR

Micron Technology

MT48LC16M16A2P-6A:GTR by Micron Technology

Micron Technology's MT48LC16M16A2P-6A:GTR is a 16MX16 Synchronous DRAM with 16777216 words, 268435456 bit memory density, and 5.4 ns max access time. It operates at 3.3V, has a temperature range of 0-70°C, and is suitable for commercial applications requiring high-speed memory performance.

Median Price

$3.802

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 4,265 parts In-Stock

1+ parts

$4.370

100+ parts

$3.780

1k+ parts

$3.540

10k+ parts

$3.470

4,265

$4.370

$3.780

$3.540

$3.470

EBV Elektronik

Germany . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,000

-

-

-

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Arrow

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$3.233

2,000

-

-

-

$3.233

Verical

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$4.693

2,000

-

-

-

$4.693

Future Electronics

Canada . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.440

2,000

-

-

-

$2.440

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 68 parts In-Stock

1+ parts

$3.896

100+ parts

-

1k+ parts

-

10k+ parts

-

68

$3.896

-

-

-

Digiode

USA . 372 parts In-Stock

1+ parts

$4.684

100+ parts

-

1k+ parts

-

10k+ parts

-

372

$4.684

-

-

-

Component Electronics Inc.

Canada . 4 parts In-Stock

1+ parts

$5.380

100+ parts

$4.040

1k+ parts

$3.500

10k+ parts

-

4

$5.380

$4.040

$3.500

-

IBS Electronics

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$4.620

20,000

-

-

-

$4.620

Chip Stock

USA . 17,000 parts In-Stock

1+ parts

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100+ parts

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17,000

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NAC Semi

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

$2.990

10,000

-

-

-

$2.990

Vyrian

USA . 5,616 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,616

-

-

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ComSIT Distribution GmbH

Germany . 4,202 parts In-Stock

1+ parts

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100+ parts

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4,202

-

-

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Component Sense

UK . 2,052 parts In-Stock

1+ parts

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2,052

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Martec Srl

Italy . 411 parts In-Stock

1+ parts

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411

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Bristol Electronics

USA . 5 parts In-Stock

1+ parts

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5

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Bas Electronics GmbH & Co. KG

Germany . 5 parts In-Stock

1+ parts

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 22,689 parts In-Stock

1+ parts

$2.750

100+ parts

$2.681

1k+ parts

$2.668

10k+ parts

-

22,689

$2.750

$2.681

$2.668

-

Ampacity Inc.

Singapore . 5,493 parts In-Stock

1+ parts

$2.750

100+ parts

-

1k+ parts

-

10k+ parts

-

5,493

$2.750

-

-

-

Advanced Electronics

New Zealand . 7,912 parts In-Stock

1+ parts

$2.752

100+ parts

$2.615

1k+ parts

$2.615

10k+ parts

-

7,912

$2.752

$2.615

$2.615

-

Aranea Global

USA . 500 parts In-Stock

1+ parts

$3.818

100+ parts

-

1k+ parts

$3.665

10k+ parts

-

500

$3.818

-

$3.665

-

Continental Prestige Electronics

USA . 6,240 parts In-Stock

1+ parts

$3.891

100+ parts

-

1k+ parts

-

10k+ parts

$3.813

6,240

$3.891

-

-

$3.813

Argo Parts USA

USA . 1,585 parts In-Stock

1+ parts

$3.891

100+ parts

-

1k+ parts

-

10k+ parts

-

1,585

$3.891

-

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Corphita

USA . 1,595 parts In-Stock

1+ parts

$4.437

100+ parts

-

1k+ parts

-

10k+ parts

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1,595

$4.437

-

-

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Aztec Data Supply Inc.

USA . 1,993 parts In-Stock

1+ parts

$5.010

100+ parts

-

1k+ parts

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10k+ parts

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1,993

$5.010

-

-

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Corohmni

South Africa . 735 parts In-Stock

1+ parts

$5.535

100+ parts

-

1k+ parts

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10k+ parts

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735

$5.535

-

-

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GreenTree Electronics

Israel . 42,000 parts In-Stock

1+ parts

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100+ parts

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42,000

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Perfect Parts

USA . 12,993 parts In-Stock

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12,993

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

1+ parts

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6,000

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iodParts Technologies Inc.

India . 484 parts In-Stock

1+ parts

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484

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-

Overview

Discover unparalleled performance and reliability with the MT48LC16M16A2P-6A:GTR by Micron Technology. As a leading manufacturer in the industry, Micron Technology ensures top-notch quality and cutting-edge technology in every product they create. This DRAM module is perfect for a wide range of applications, offering seamless synchronization and self-refresh capabilities. With a nominal supply voltage of 3.3V and a compact package style, this memory component provides exceptional value and efficiency to customers looking to elevate their systems to the next level. Experience the difference with Micron Technology's MT48LC16M16A2P-6A:GTR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the DRAM lightweight and durable, perfect for portable devices.

Surface Mount: YES

The surface mount feature allows for easy installation on PCBs, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular shape of the package provides efficient use of space, ideal for compact electronic designs.

Operating Mode: SYNCHRONOUS

The synchronous operation ensures precise and synchronized data transfers, enhancing system performance.

Self Refresh: YES

The self-refresh capability helps in maintaining data integrity and stability during power fluctuations or interruptions.

Nominal Supply Voltage: 3.3V

The nominal supply voltage of 3.3V ensures compatibility with a wide range of systems, offering versatility in applications.

No. of Terminals: 54

The 54 terminals provide ample connectivity options for seamless integration within complex circuit setups.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline and thin profile of the package style save space, making it suitable for devices with limited room for components.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable performance even in harsh environmental conditions.

Organization: 16MX16

The organization of 16MX16 signifies a large memory capacity, meeting the demands of data-intensive applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C allows the DRAM to function effectively in varied temperature settings.

Terminal Finish: MATTE TIN

The matte tin finish enhances the conductivity of terminals, promoting efficient data transmission within the system.

Technical Specifications

DRAM MT48LC16M16A2P-6A:GTR attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

FOUR BANK PAGE BURST

Maximum Access Time:

5.4 ns

Additional Features:

AUTO/SELF REFRESH

JESD-30 Code:

R-PDSO-G54

JESD-609 Code:

e3

Length:

22.22 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

54

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

16MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10.16 mm

Trade Compliance

MT48LC16M16A2P-6A:GTR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.24

SB

8542.32.00.15

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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