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MT53E256M32D2FW-046AAT:B

Micron Technology

MT53E256M32D2FW-046AAT:B by Micron Technology

Micron Technology's MT53E256M32D2FW-046AAT:B is a LPDDR4 DRAM with 256MX32 organization, operating at 2133 MHz. It features a common I/O type, self-refresh mode, and synchronous operation. Ideal for applications requiring high-speed memory performance in automotive electronics or industrial devices.

Median Price

$83.580

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1,331 parts In-Stock

1+ parts

$83.580

100+ parts

-

1k+ parts

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10k+ parts

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1,331

$83.580

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-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,021 parts In-Stock

1+ parts

$10.906

100+ parts

-

1k+ parts

-

10k+ parts

-

1,021

$10.906

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-

Chip Stock

USA . 4,408 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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4,408

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-

-

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Vyrian

USA . 3,108 parts In-Stock

1+ parts

-

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10k+ parts

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3,108

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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500

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 696 parts In-Stock

1+ parts

$9.760

100+ parts

-

1k+ parts

-

10k+ parts

-

696

$9.760

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Corphita

USA . 2,110 parts In-Stock

1+ parts

$10.332

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2,110

$10.332

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Argo Parts USA

USA . 2,953 parts In-Stock

1+ parts

-

100+ parts

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2,953

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Continental Prestige Electronics

USA . 1,393 parts In-Stock

1+ parts

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100+ parts

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1,393

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Overview

Elevate your electronic devices with the cutting-edge MT53E256M32D2FW-046AAT:B by Micron Technology. Known for their top-notch quality and reliable performance, Micron Technology delivers innovative solutions in the DRAM category. This LPDDR4 DRAM offers high-speed operation, low power consumption, and a wide range of applications, making it the perfect choice for those seeking superior memory solutions. Upgrade your products today and experience the seamless performance and unmatched value that Micron Technology has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material ensures durability and reliability of the package, making it a good choice for long-term usage.

Surface Mount: YES

Allows for easy installation on printed circuit boards, making it convenient for assembly and maintenance.

Package Shape: RECTANGULAR

The RECTANGULAR shape offers efficient use of space and compatibility with standard mounting options for various devices.

Operating Mode: SYNCHRONOUS

SYNCHRONOUS operation ensures precise timing and coordination with other components, enhancing overall system performance.

Nominal Supply Voltage / Vsup (V): 1.1

The 1.1V supply voltage strikes a balance between energy efficiency and performance, making it suitable for a wide range of applications.

Maximum Clock Frequency (fCLK): 2133 MHz

The high clock frequency allows for fast data transfer and processing speeds, ideal for demanding tasks and applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, contributing to energy efficiency and overall performance.

Memory IC Type: LPDDR4 DRAM

The LPDDR4 DRAM type provides high data transfer rates and efficiency, making it a suitable choice for performance-oriented devices.

Technical Specifications

DRAM MT53E256M32D2FW-046AAT:B attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

MULTI BANK PAGE BURST

Maximum Clock Frequency (fCLK):

2133 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

16,32

JESD-30 Code:

R-PBGA-B200

Length:

14.5 mm

Memory Density:

8589934592 bit

Memory IC Type:

Memory Width:

32

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

200

No. of Words:

268435456 words

No. of Words Code:

256M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256MX32

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA200,12X22,32/25

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Self Refresh:

YES

Sequential Burst Length:

16,32

Maximum Supply Voltage (Vsup):

1.17 V

Minimum Supply Voltage (Vsup):

1.06 V

Nominal Supply Voltage / Vsup (V):

1.1

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

10 mm

Trade Compliance

MT53E256M32D2FW-046AAT:B Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.36

SB

8542.32.00.23

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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