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MT48LC16M16A2BG-75:D

Micron Technology

MT48LC16M16A2BG-75:D by Micron Technology

Micron Technology's MT48LC16M16A2BG-75:D is a 16MX16 Synchronous DRAM with 3.3V supply, operating at 133MHz clock frequency. It features a very thin profile grid array package suitable for commercial applications requiring fast access time of 5.4ns and supports common I/O type with self-refresh capability.

Median Price

$9.700

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 12 parts In-Stock

1+ parts

$9.700

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12

$9.700

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DF Sales Co.

USA . 12 parts In-Stock

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$9.700

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12

$9.700

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Chip Stock

USA . 12,400 parts In-Stock

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Vyrian

USA . 8,533 parts In-Stock

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8,533

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Nova Conductors

Japan . 700 parts In-Stock

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700

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Cyclops Electronics Ltd

UK . 578 parts In-Stock

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578

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Bristol Electronics

USA . 410 parts In-Stock

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410

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Digiode

USA . 305 parts In-Stock

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305

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LIBRA Elektronik GmbH

Germany . 91 parts In-Stock

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91

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NAC Semi

USA . 81 parts In-Stock

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SPM Sales

USA . 79 parts In-Stock

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79

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ACDS - Activité Composants Distribution Service

France . 68 parts In-Stock

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Inventory MP

USA . 40 parts In-Stock

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40

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Prism Electronics

USA . 29 parts In-Stock

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Sogenti Electronics

Canada . 25 parts In-Stock

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Electronics Depot

USA . 7 parts In-Stock

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North Shore Components

USA . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 1,088 parts In-Stock

1+ parts

$2.103

100+ parts

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1,088

$2.103

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Andel Nordic

Denmark . 419 parts In-Stock

1+ parts

$2.374

100+ parts

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$2.279

10k+ parts

$2.279

419

$2.374

-

$2.279

$2.279

Component Stockers USA

USA . 2,126 parts In-Stock

1+ parts

$4.090

100+ parts

$3.890

1k+ parts

$3.760

10k+ parts

-

2,126

$4.090

$3.890

$3.760

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Aztec Data Supply Inc.

USA . 70 parts In-Stock

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$5.851

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70

$5.851

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AZTECH Wire

Italy . 808 parts In-Stock

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$15.782

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808

$15.782

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Ampacity Inc.

Singapore . 1,533 parts In-Stock

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$21.000

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$21.000

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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RC Electronics

USA . 9,498 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,753 parts In-Stock

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Continental Prestige Electronics

USA . 6,336 parts In-Stock

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Corphita

USA . 1,997 parts In-Stock

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Kepictronics

USA . 1,810 parts In-Stock

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Argo Parts USA

USA . 1,312 parts In-Stock

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Futuretech Components

Singapore . 789 parts In-Stock

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789

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Perfect Parts

USA . 540 parts In-Stock

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540

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Aranea Global

USA . 50 parts In-Stock

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50

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Glotronic Ltd.

UK . 26 parts In-Stock

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Overview

Unlock the power of high-quality DRAM technology with the MT48LC16M16A2BG-75:D by Micron Technology. Designed for optimal performance and reliability, this product offers seamless integration into a variety of applications. With a focus on value and benefits, customers can trust in the superior quality and advantages that Micron Technology provides. Elevate your projects with the trusted name in memory solutions and experience the difference with the MT48LC16M16A2BG-75:D.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the DRAM, making it a reliable choice for long-term use.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for data to be transferred at a consistent pace, improving overall performance and efficiency.

Nominal Supply Voltage / Vsup (V): 3.3

With a nominal supply voltage of 3.3V, this DRAM is energy-efficient and helps save on power consumption.

Maximum Clock Frequency (fCLK): 133 MHz

The high maximum clock frequency allows for faster data transfer speeds, enhancing the overall performance of the DRAM.

Memory Density: 268435456 bit

With a high memory density, this DRAM can store a large amount of data, making it suitable for applications requiring high storage capacity.

Technical Specifications

DRAM MT48LC16M16A2BG-75:D attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

FOUR BANK PAGE BURST

Maximum Access Time:

5.4 ns

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

133 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

1,2,4,8

JESD-30 Code:

R-PBGA-B54

JESD-609 Code:

e1

Length:

14 mm

Memory Density:

268435456 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

54

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

16MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA54,9X9,32

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Refresh Cycles:

Maximum Seated Height:

1 mm

Self Refresh:

YES

Sequential Burst Length:

1,2,4,8,FP

Maximum Standby Current:

.002 Amp

Sub-Category:

DRAMs

Maximum Supply Current:

270 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

MT48LC16M16A2BG-75:D Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.24

SB

8542.32.00.15

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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