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MT41K256M8DA-125AAT:K

Micron Technology

MT41K256M8DA-125AAT:K by Micron Technology

Micron Technology's MT41K256M8DA-125AAT:K is a DDR3L DRAM with 256MX8 organization, operating at 800 MHz. It features a low supply voltage of 1.35V and is designed for automotive applications due to its AEC-Q100 screening level. The memory IC offers a memory density of 2147483648 bits and supports multi-bank page burst access mode.

Median Price

$5.997

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

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$5.997

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$5.997

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Vyrian

USA . 7,119 parts In-Stock

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Digiode

USA . 1,104 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 60 parts In-Stock

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60

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Bristol Electronics

USA . 50 parts In-Stock

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50

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Inventory MP

USA . 29 parts In-Stock

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ComSIT Distribution GmbH

Germany . 4 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 1,619 parts In-Stock

1+ parts

$3.290

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$3.290

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Corohmni

South Africa . 133 parts In-Stock

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$5.821

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Continental Prestige Electronics

USA . 5,389 parts In-Stock

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$5.997

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$5.877

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Bastille Electronics

Australia . 1,000 parts In-Stock

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$5.997

100+ parts

$5.697

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$5.412

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$5.337

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$5.997

$5.697

$5.412

$5.337

AZTECH Wire

Italy . 246 parts In-Stock

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$6.402

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Ampacity Inc.

Singapore . 1,343 parts In-Stock

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$26.000

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Semicontronic

India . 1,327 parts In-Stock

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$27.000

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$26.325

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$26.190

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1,327

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QUARKTWIN TECHNOLOGY LTD

USA . 22,952 parts In-Stock

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Perfect Parts

USA . 7,258 parts In-Stock

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Argo Parts USA

USA . 1,544 parts In-Stock

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Corphita

USA . 1,137 parts In-Stock

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Authorized Procurement Solutions

USA . 179 parts In-Stock

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Overview

Experience unparalleled performance and reliability with Micron Technology's MT41K256M8DA-125AAT:K DDR3L DRAM. Designed for automotive applications, this memory module boasts a high operating temperature of 125°C, making it ideal for demanding environments. With a maximum clock frequency of 800 MHz and a memory density of 2147483648 bits, this DRAM ensures seamless multitasking and fast data processing. Trust Micron Technology's expertise in memory solutions to unlock the full potential of your automotive systems. Elevate your performance with the MT41K256M8DA-125AAT:K today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product onto circuit boards, making it a convenient choice for manufacturers.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures that data is transferred at a consistent speed, improving overall system performance and reliability.

Nominal Supply Voltage / Vsup (V): 1.35

A low nominal supply voltage of 1.35V helps in reducing power consumption and heat generation, making the product more energy efficient.

Maximum Clock Frequency (fCLK): 800 MHz

With a high maximum clock frequency of 800 MHz, this product can handle data at a fast rate, making it suitable for applications requiring high-speed operation.

Temperature Grade: AUTOMOTIVE

Designed to operate within automotive temperature range specifications, this product is suitable for use in automotive applications where reliable performance in extreme temperatures is required.

Memory IC Type: DDR3L DRAM

Being a DDR3L DRAM, this product offers improved energy efficiency and higher data transfer speeds compared to older DRAM technologies, making it a more advanced and reliable choice.

Technical Specifications

DRAM MT41K256M8DA-125AAT:K attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

MULTI BANK PAGE BURST

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

800 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

8

JESD-30 Code:

R-PBGA-B78

JESD-609 Code:

e1

Length:

10.5 mm

Memory Density:

2147483648 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

78

No. of Words:

268435456 words

No. of Words Code:

256M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA78,9X13,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.35

Qualification:

Not Qualified

Refresh Cycles:

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

8

Maximum Standby Current:

.012 Amp

Sub-Category:

DRAMs

Maximum Supply Current:

195 mA

Maximum Supply Voltage (Vsup):

1.45 V

Minimum Supply Voltage (Vsup):

1.283 V

Nominal Supply Voltage / Vsup (V):

1.35

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

MT41K256M8DA-125AAT:K Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.36

SB

8542.32.00.23

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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