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IS42S16800F-7BLI-TR

Integrated Silicon Solution

IS42S16800F-7BLI-TR by Integrated Silicon Solution

IS42S16800F-7BLI-TR by Integrated Silicon Solution is an 8MX16 Synchronous DRAM with 3.3V supply voltage, operating at 143 MHz clock frequency. Ideal for industrial applications requiring fast access time and low standby current consumption.

Median Price

$3.498

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 6,271 parts In-Stock

1+ parts

$4.870

100+ parts

$3.860

1k+ parts

$3.520

10k+ parts

$3.350

6,271

$4.870

$3.860

$3.520

$3.350

Verical

USA . 1,267 parts In-Stock

1+ parts

-

100+ parts

$2.126

1k+ parts

$2.116

10k+ parts

$2.116

1,267

-

$2.126

$2.116

$2.116

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 88 parts In-Stock

1+ parts

$4.094

100+ parts

-

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88

$4.094

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Chip Stock

USA . 13,920 parts In-Stock

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13,920

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NAC Semi

USA . 5,000 parts In-Stock

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$4.500

5,000

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$4.500

Vyrian

USA . 3,755 parts In-Stock

1+ parts

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3,755

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PC Components Company LLC

USA . 414 parts In-Stock

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414

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Bristol Electronics

USA . 392 parts In-Stock

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392

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Distributors (Availability)

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Corohmni

South Africa . 867 parts In-Stock

1+ parts

$2.942

100+ parts

-

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867

$2.942

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Aztec Data Supply Inc.

USA . 25,825 parts In-Stock

1+ parts

$3.730

100+ parts

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25,825

$3.730

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Continental Prestige Electronics

USA . 6,467 parts In-Stock

1+ parts

$4.094

100+ parts

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10k+ parts

$4.012

6,467

$4.094

-

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$4.012

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$4.094

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2,000

$4.094

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Argo Parts USA

USA . 1,927 parts In-Stock

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$4.094

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1,927

$4.094

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Eastek

USA . 7,500 parts In-Stock

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$4.270

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7,500

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$4.270

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Perfect Parts

USA . 4,547 parts In-Stock

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4,547

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GreenTree Electronics

Israel . 2,500 parts In-Stock

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2,500

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Assy Fe

Spain . 2,126 parts In-Stock

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2,126

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Overview

Elevate your electronics with the IS42S16800F-7BLI-TR by Integrated Silicon Solution. As a leading manufacturer in the industry, this DRAM offers unparalleled quality and reliability. With applications ranging from industrial to consumer electronics, this product delivers exceptional performance and efficiency. Experience the value and benefits of this innovative technology, providing customers with a competitive edge in their projects. Upgrade your devices with the IS42S16800F-7BLI-TR and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, making it a good choice for portable devices.

Surface Mount: YES

Being surface mountable allows for easy installation and space-saving on PCBs.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise and efficient data transfer, making it a reliable choice for high-performance applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a common supply voltage of 3.3V ensures compatibility with other components and reduces the need for additional voltage regulation.

Maximum Clock Frequency (fCLK): 143 MHz

High clock frequency allows for fast data access and processing, making it suitable for demanding tasks.

Temperature Grade: INDUSTRIAL

Designed to operate efficiently in industrial temperature ranges, ensuring reliability in harsh environments.

Memory IC Type: SYNCHRONOUS DRAM

Utilizing synchronous DRAM technology enhances data transfer speeds and efficiency, making it ideal for high-speed memory applications.

Technical Specifications

DRAM IS42S16800F-7BLI-TR attributes and parameters. Explore more DRAM devices from Integrated Silicon Solution

Specs

Access Mode:

FOUR BANK PAGE BURST

Maximum Access Time:

5.4 ns

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

143 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

1,2,4,8

JESD-30 Code:

S-PBGA-B54

Length:

8 mm

Memory Density:

134217728 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

54

No. of Words:

8388608 words

No. of Words Code:

8M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA54,9X9,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Refresh Cycles:

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

1,2,4,8,FP

Maximum Standby Current:

.002 Amp

Sub-Category:

DRAMs

Maximum Supply Current:

100 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Trade Compliance

IS42S16800F-7BLI-TR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.02

SB

8542.32.00.15

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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