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MT53E1G32D2FW-046AAT:B

Micron Technology

MT53E1G32D2FW-046AAT:B by Micron Technology

Micron Technology's MT53E1G32D2FW-046AAT:B is a LPDDR4 DRAM with 1GX32 organization, operating at 2133 MHz. It features common I/O type, self-refresh mode, and synchronous operation. Ideal for applications requiring high memory density and fast clock frequency in automotive electronics or industrial devices.

Median Price

$47.063

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,576 parts In-Stock

1+ parts

$44.050

100+ parts

$33.657

1k+ parts

$32.726

10k+ parts

-

1,576

$44.050

$33.657

$32.726

-

Mouser Electronics

USA . 1,265 parts In-Stock

1+ parts

$46.960

100+ parts

$39.600

1k+ parts

-

10k+ parts

-

1,265

$46.960

$39.600

-

-

Element14

Singapore . 1,782 parts In-Stock

1+ parts

$47.166

100+ parts

$38.637

1k+ parts

-

10k+ parts

-

1,782

$47.166

$38.637

-

-

Farnell

UK . 1,782 parts In-Stock

1+ parts

$50.430

100+ parts

$40.725

1k+ parts

-

10k+ parts

-

1,782

$50.430

$40.725

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 844 parts In-Stock

1+ parts

$41.848

100+ parts

-

1k+ parts

-

10k+ parts

-

844

$41.848

-

-

-

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$50.651

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$50.651

-

-

-

Vyrian

USA . 5,228 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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5,228

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-

-

-

Rebound Electronics

UK . 280 parts In-Stock

1+ parts

-

100+ parts

-

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280

-

-

-

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NAC Semi

USA . 22 parts In-Stock

1+ parts

-

100+ parts

-

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22

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 428 parts In-Stock

1+ parts

$5.029

100+ parts

-

1k+ parts

-

10k+ parts

-

428

$5.029

-

-

-

Aztec Data Supply Inc.

USA . 2,110 parts In-Stock

1+ parts

$5.870

100+ parts

-

1k+ parts

-

10k+ parts

-

2,110

$5.870

-

-

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Semicontronic

India . 1,094 parts In-Stock

1+ parts

$28.210

100+ parts

$27.505

1k+ parts

$27.364

10k+ parts

-

1,094

$28.210

$27.505

$27.364

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Ampacity Inc.

Singapore . 1,521 parts In-Stock

1+ parts

$37.440

100+ parts

-

1k+ parts

-

10k+ parts

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1,521

$37.440

-

-

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Corphita

USA . 589 parts In-Stock

1+ parts

$39.645

100+ parts

-

1k+ parts

-

10k+ parts

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589

$39.645

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-

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Continental Prestige Electronics

USA . 6,005 parts In-Stock

1+ parts

$50.600

100+ parts

-

1k+ parts

-

10k+ parts

$49.588

6,005

$50.600

-

-

$49.588

Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

-

100+ parts

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3,000

-

-

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Argo Parts USA

USA . 2,486 parts In-Stock

1+ parts

-

100+ parts

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2,486

-

-

-

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GreenTree Electronics

Israel . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,000

-

-

-

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$49.638

1k+ parts

$48.118

10k+ parts

$47.105

500

-

$49.638

$48.118

$47.105

Overview

Upgrade your devices with the cutting-edge MT53E1G32D2FW-046AAT:B LPDDR4 DRAM from Micron Technology. With a reputation for top-notch quality and reliability, Micron delivers superior performance and efficiency in every product. This memory module is perfect for a wide range of applications, offering lightning-fast speeds and seamless multitasking capabilities. Trust Micron to provide you with the best technology on the market, ensuring a smooth and efficient user experience every time. Elevate your devices with Micron's LPDDR4 DRAM and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability, making the product suitable for a wide range of applications.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise and efficient data transfer, enhancing performance and reducing latency.

Nominal Supply Voltage / Vsup (V): 1.1

Operating at a nominal supply voltage of 1.1V helps in achieving optimized power efficiency without compromising on performance.

Package Style: GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch package style allows for increased memory density and improved signal integrity.

Maximum Clock Frequency (fCLK): 2133 MHz

High maximum clock frequency enables fast data processing and execution, making the product suitable for high-performance applications.

Memory IC Type: LPDDR4 DRAM

Being LPDDR4 DRAM, the product offers high memory density and low power consumption, making it ideal for mobile devices and other power-constrained applications.

Technical Specifications

DRAM MT53E1G32D2FW-046AAT:B attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

MULTI BANK PAGE BURST

Additional Features:

SELF REFRESH; IT ALSO REQUIRES 1.8V NOM; TERM PITCH-MAX

Maximum Clock Frequency (fCLK):

2133 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

16,32

JESD-30 Code:

R-PBGA-B200

Length:

14.5 mm

Memory Density:

34359738368 bit

Memory IC Type:

Memory Width:

32

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

200

No. of Words:

1073741824 words

No. of Words Code:

1G

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1GX32

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA200,12X20,32/25

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Self Refresh:

YES

Sequential Burst Length:

16,32

Maximum Supply Voltage (Vsup):

1.17 V

Minimum Supply Voltage (Vsup):

1.06 V

Nominal Supply Voltage / Vsup (V):

1.1

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

10 mm

Trade Compliance

MT53E1G32D2FW-046AAT:B Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.36

SB

8542.32.00.23

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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