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K4B2G0846C-HCH9

Samsung

K4B2G0846C-HCH9 by Samsung

Samsung's K4B2G0846C-HCH9 DDR3 DRAM features 256MX8 organization, 667 MHz clock frequency, and 2147483648 bit memory density. Ideal for applications requiring high-speed data processing and storage in devices like computers and servers.

Median Price

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Lifecycle Status

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3

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1k+

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ACDS - Activité Composants Distribution Service

France . 3,463 parts In-Stock

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Nova Conductors

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Quantum Digital Technology

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Ampacity Inc.

Singapore . 992 parts In-Stock

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$4.000

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Alle Elektronik GmbH

Germany . 4,464 parts In-Stock

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Aranea Global

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Assy Fe

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Argo Parts USA

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Continental Prestige Electronics

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RC Electronics

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Kepictronics

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Perfect Parts

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ChipstoGo Electronic ltd

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Overview

Unleash the power of Samsung's K4B2G0846C-HCH9 DDR3 DRAM module and experience unparalleled performance and reliability. As a leader in memory technology, Samsung ensures top-notch quality and innovation in every product they create. This versatile component can be utilized in a wide range of applications, from consumer electronics to industrial equipment, providing seamless functionality and exceptional speed. Elevate your projects with the cutting-edge technology of Samsung and enjoy the value and benefits that only a trusted manufacturer can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability for long-term use.

Surface Mount: YES

Surface mount option provides ease of installation and space-saving benefits.

Nominal Supply Voltage / Vsup (V): 1.5

Operates efficiently at a low voltage of 1.5V, reducing power consumption.

Maximum Operating Temperature: 85 °C

Can operate efficiently at high temperatures up to 85°C.

Organization: 256MX8

Organized in a 256MX8 configuration for improved data processing capabilities.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed performance.

Memory IC Type: DDR3 DRAM

DDR3 DRAM technology provides faster data transfer rates and improved overall performance.

Technical Specifications

DRAM K4B2G0846C-HCH9 attributes and parameters. Explore more DRAM devices from Samsung

Specs

Maximum Clock Frequency (fCLK):

667 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

8

JESD-30 Code:

R-PBGA-B78

JESD-609 Code:

e1

Memory Density:

2147483648 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

78

No. of Words:

268435456 words

No. of Words Code:

256M

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA78,9X13,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.5

Qualification:

Not Qualified

Refresh Cycles:

Sequential Burst Length:

8

Maximum Standby Current:

.012 Amp

Sub-Category:

DRAMs

Maximum Supply Current:

210 mA

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Trade Compliance

K4B2G0846C-HCH9 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.36

SB

8542.32.00.23

Manufacturer Highlights

Samsung

Samsung Electronics Co., Ltd. engages in the consumer electronics, information technology and mobile communications, and device solutions businesses worldwide. The company offers smartphones, tablets, watches, and accessories; TVs, projectors, and sound devices; home appliances, including refrigerators, washing machines and dryers, vacuum cleaners, cooking appliances, dishwashers, air conditioners, and air purifiers; monitors, and memory and storage products; displays, and smart and LED signages; and other accessories. It also engages in technology, venture capital investments, cloud services, network devices installation and optimization, semiconductor equipment services, digital advertising platforms, marketing, consulting, connected services, logistics, financing, and software design activities; toll processing of display panels and semiconductors; development and sale of network solutions; manufactures semiconductors and food; provision of repair services for electronic devices and enterprise automation solutions; and development and supply of semiconductor process defect and quality control software. The company serves various industries, including education, retail, and finance, as well as government and corporate customers. Samsung Electronics Co., Ltd. was incorporated in 1969 and is based in Suwon-si, South Korea.

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